| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/31/1996 | US5588848 Low inductance surface-mount connectors for interconnecting circuit devices and method for using same |
| 12/31/1996 | US5588845 Connectors for base boards and methods of connector of base boards |
| 12/31/1996 | US5588207 Method of manufacturing two-sided and multi-layered printed circuit boards |
| 12/27/1996 | WO1996042080A1 Integrated head-electronics interconnection suspension for a data recording disk drive |
| 12/27/1996 | EP0749674A1 Apparatus having inner layers supporting surface-mount components |
| 12/27/1996 | EP0749673A1 Fabrication multilayer combined rigid/flex printed circuit board |
| 12/27/1996 | EP0749634A1 Technique for producing interconnecting conductive links |
| 12/27/1996 | EP0749633A1 Prefabricated semiconductor chip carrier |
| 12/27/1996 | EP0749600A1 Modular architecture for high bandwidth computers |
| 12/27/1996 | EP0663108B1 Contacting device for a film with several conductor tracks |
| 12/27/1996 | CA2217733A1 Integrated head-electronics interconnection suspension for a data recording disk drive |
| 12/25/1996 | CN1033672C Thin film electrical component |
| 12/24/1996 | US5587920 Computer including a Faraday cage on printed circuit board |
| 12/24/1996 | US5587890 Vehicle electric power distribution system |
| 12/24/1996 | US5587887 Printed circuit board having a configurable voltage supply |
| 12/24/1996 | US5587885 Mechanical printed circuit board/laminated multi chip module interconnect apparatus |
| 12/24/1996 | US5587557 Printed circuit board and liquid crystal display |
| 12/24/1996 | US5587452 Polyamide-imide |
| 12/24/1996 | US5587450 Process for producing aromatic polyamide film |
| 12/24/1996 | US5587341 Process for manufacturing a stacked integrated circuit package |
| 12/24/1996 | US5587275 Photosensitive resin composition and a process for forming a patterned polyimide film using the same |
| 12/24/1996 | US5587243 Also containing aromatic polyamine hardener; for prepregs and composites |
| 12/24/1996 | US5587119 Method for manufacturing a coaxial interconnect |
| 12/24/1996 | US5587111 Ultrafine particles of metal |
| 12/24/1996 | US5586686 Temperature maintained food dispensing system and method |
| 12/24/1996 | US5586389 Method for producing multi-board electronic device |
| 12/24/1996 | US5586388 Method for producing multi-board electronic device |
| 12/24/1996 | CA2067728C Microminature down converter for satellite communications |
| 12/19/1996 | WO1996041507A1 Low profile semiconductor die carrier |
| 12/19/1996 | WO1996041376A1 Mesh planes for multilayer module |
| 12/19/1996 | WO1996041327A1 Tesselated electroluminescent display having a multilayer ceramic substrate |
| 12/19/1996 | WO1996041030A1 Method for producing metal matrix composites incorporating partially sintered preforms |
| 12/19/1996 | WO1996040522A1 Apparatus and process for directly printing an electrical circuit component onto a substrate |
| 12/19/1996 | WO1996040509A1 Debossable films |
| 12/19/1996 | WO1996040507A1 Conductive film composite |
| 12/19/1996 | WO1996040443A1 A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press |
| 12/19/1996 | DE19623799A1 Beheizte Kristallvorrichtung und Verfahren zur Herstellung Heated crystal device and process for producing |
| 12/19/1996 | CA2224147A1 Apparatus and process for directly printing an electrical circuit component onto a substrate |
| 12/19/1996 | CA2224091A1 A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press |
| 12/19/1996 | CA2223544A1 Debossable films |
| 12/19/1996 | CA2223538A1 Conductive film composite |
| 12/18/1996 | EP0749181A2 Low crosstalk modular electrical connector assembly |
| 12/18/1996 | EP0748473A1 Flexible wearable computer |
| 12/18/1996 | EP0656171B1 A multiple layer printed circuit board |
| 12/18/1996 | CN1138286A Wiring construction body, method of manufacturing same, and circuit board using wiring construction body |
| 12/17/1996 | US5586011 Side plated electromagnetic interference shield strip for a printed circuit board |
| 12/17/1996 | US5586009 Bus communication system for stacked high density integrated circuit packages |
| 12/17/1996 | US5586007 Circuit board having improved thermal radiation |
| 12/17/1996 | US5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together |
| 12/17/1996 | US5585783 Marker light utilizing light emitting diodes disposed on a flexible circuit board |
| 12/17/1996 | US5585670 Semiconductor device package |
| 12/17/1996 | US5585602 Structure for providing conductive paths |
| 12/17/1996 | US5585162 Ground plane routing |
| 12/17/1996 | US5585157 Printed susbstrate having reinforcement patterns of varying size and/or shape |
| 12/17/1996 | US5585147 Process for a surface treatment of a glass fabric |
| 12/17/1996 | US5585020 Process for the production of nanoparticles |
| 12/17/1996 | US5584704 Device for the common electrical contacting of a plurality of electrically excitable aggregates of internal combustion engines |
| 12/17/1996 | US5584120 Method of manufacturing printed circuits |
| 12/12/1996 | WO1996039796A1 Printed wiring board |
| 12/12/1996 | WO1996039364A1 Forming size compositions, glass fibers coated with the same and fabrics woven from such coated fibers |
| 12/12/1996 | WO1996039363A1 Low-permittivity glass fibers |
| 12/11/1996 | EP0748152A2 Method for mounting an electronic component on a wiring substrate and an illuminated switch unit using this mounting method |
| 12/11/1996 | EP0747997A2 Microstrip flexible printed wiring board interconnect line |
| 12/11/1996 | EP0747955A2 Hybrid circuit and method of fabrication |
| 12/11/1996 | EP0747954A2 Reflowed solder ball with low melting point metal cap |
| 12/11/1996 | EP0747912A2 Thick film conductive paste composition |
| 12/11/1996 | EP0747911A1 Method of manufacturing thick-film resistor |
| 12/11/1996 | EP0608221B1 Interconnector |
| 12/11/1996 | EP0558712B1 Electrical device, especially switching and control device for motor vehicles |
| 12/11/1996 | EP0326577B1 Reinforced plastic laminates for use in the production of printed circuit boards and process for making such laminates and resulting products |
| 12/11/1996 | CN1137734A Thermoformed three dimensional wiring module |
| 12/11/1996 | CN1137733A Cleaning device for contact surface on PCB |
| 12/11/1996 | CN1137695A Apparatus for providing controlled impedance in electrical contact |
| 12/11/1996 | CN1137680A 回转型可变电阻器 Transition back to a variable resistor |
| 12/11/1996 | CN1137641A Method and compositions for diffusion patierning tape on substrate |
| 12/10/1996 | US5583867 Backplane wiring for hub in packet data communications system |
| 12/10/1996 | US5583749 Baseboard and daughtercard apparatus for reconfigurable computing systems |
| 12/10/1996 | US5583748 Semiconductor module having multiple circuit boards |
| 12/10/1996 | US5583720 Magnetic disk drive and flexible printed board used in such drive |
| 12/10/1996 | US5583546 Streak-detector for ink jet printer |
| 12/10/1996 | US5583377 Pad array semiconductor device having a heat sink with die receiving cavity |
| 12/10/1996 | US5583376 High performance semiconductor device with resin substrate and method for making the same |
| 12/10/1996 | US5583321 Multi-layer circuit construction methods and structures with customization features and components for use therein |
| 12/10/1996 | US5583320 Reinforcement for flexible printed circuit board and reinforced flexible printed circuit board |
| 12/10/1996 | US5582872 Electrostatic dissipative laminate and method for making |
| 12/10/1996 | US5582858 Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier |
| 12/10/1996 | US5582745 Method of making circuit boards with locally enhanced wiring density |
| 12/10/1996 | US5582104 Apparatus and process for screen printing |
| 12/10/1996 | US5581876 Method of adhering green tape to a metal support substrate with a bonding glass |
| 12/08/1996 | CA2151214A1 Electronic devices with electronic components carried upon a substrate |
| 12/05/1996 | WO1996039012A1 Electrical connection |
| 12/05/1996 | WO1996038858A2 Method and probe card for testing semiconductor devices |
| 12/05/1996 | WO1996038253A1 Device for checking the presence of soldering paste during application to printed circuit boards which can be reflow-soldered |
| 12/04/1996 | EP0746189A1 Process for producing multilayer printed circuit boards |
| 12/04/1996 | EP0746188A1 Use of micromodule as surface mount package and corresponding method |
| 12/04/1996 | EP0746187A2 Printed-circuit board for use with card-edge connector and method therfor |
| 12/04/1996 | EP0746053A1 Microwave vertical interconnect through circuit with compressible conductor |
| 12/04/1996 | CN1137159A Thin-film capacitor and its manufacturing method, and hybrid circuit substrate and its assembling method |
| 12/03/1996 | US5581492 Flexible wearable computer |
| 12/03/1996 | US5581445 Plastic integrated circuit card with reinforcement structure for protecting integrated circuit module |