Patents for H05K 1 - Printed circuits (98,583)
01/1997
01/28/1997US5597644 Glass glaze
01/28/1997US5597313 Electrical connectors
01/28/1997US5596804 Method of constructing an electromagnetically shielded microstrip circuit
01/23/1997WO1997002723A1 Process and device for joining electric, heat source-bearing printed circuit boards to metallic heat dissipating plates
01/23/1997WO1997002628A1 Filtered electrical connector
01/23/1997WO1997002620A1 Surface mounted directional coupler
01/23/1997WO1997002309A1 A microfiber-reinforced porous polymer film
01/22/1997EP0755035A1 Resonant tag and method of manufacturing the same
01/22/1997EP0754795A1 Process and system for making an armature for a part made of composite material
01/22/1997EP0552377B1 Dielectric material for high frequency and resonator made thereof, and manufacture thereof
01/22/1997CN1141114A Method of surface mounting radio frequency components and the components
01/22/1997CN1141078A Self-addressable self-assembling microelectronic system and devices for molecular biological analysis and diagnostics
01/22/1997CN1140973A Process for producing multilayer printed circuit boards
01/22/1997CN1140864A Resonant tag and method of manufacturing the same
01/21/1997US5596227 Ball grid array type semiconductor device
01/21/1997US5596178 single replacement pad with perforated shaft for the repair of printed circuit boards
01/21/1997US5595858 Manufacturing method for double-sided wiring board
01/21/1997US5595668 Protective coatingsprotective coatings
01/21/1997US5595583 Apparatus for localized surface glazing of ceramic articles
01/18/1997CA2181399A1 Process and system for making structure of a composite part
01/16/1997WO1997001872A1 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement
01/16/1997WO1997001595A1 Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances
01/16/1997WO1997001591A1 Epoxy resin composition for printed wiring board and laminated board produced with the use of the same
01/16/1997WO1997001437A1 Circuit board laminates and method of making
01/16/1997WO1997001414A1 Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors
01/16/1997WO1996036450A3 Fabricating metal matrix composites containing electrical insulators
01/15/1997EP0753537A1 Epoxy resin compositions containing red phosphorus
01/15/1997EP0753101A1 Engine components including ceramic-metal composites
01/15/1997EP0667094B1 Backplane printed circuit board for a module frame
01/15/1997EP0556185B1 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester
01/15/1997CN1140430A Method of making composite laminate and PWB substrate so made
01/15/1997CN1140183A Thermosetting resin compostion electrical laminates obtained therefrom and process of producing these
01/14/1997US5594621 Motherboard for a computer of the AT type, and a computer of the AT type comprising such motherboard.
01/14/1997US5594607 For a disk drive
01/14/1997US5594397 Used as a signal transmission element
01/14/1997US5594234 Downset exposed die mount pad leadframe and package
01/14/1997US5594214 Signal transmission flat cable
01/14/1997US5593774 Polyimide base film; thermoplastic or thermosetting adhesive layers; tear strength; semiconductors
01/14/1997US5593767 Laminate, a glass fiber woven fabric and a printed wiring board
01/14/1997US5593722 Method of producing thick multi-layer substrates
01/14/1997US5593720 Process for making a multileveled electronic package
01/14/1997US5593604 Method of resistance welding thin elements
01/14/1997US5593526 Ceramic coated glass spheres
01/14/1997US5592737 Method of manufacturing a multilayer printed wire board
01/14/1997US5592736 Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads
01/14/1997CA2149929C Devices using metallized magnetic substrates
01/08/1997EP0752738A2 Polarity-sensitive protector device
01/08/1997EP0752594A2 Contact structure for electrically connecting a testing board and die
01/08/1997EP0752167A1 Method and apparatus for integrated circuit voltage regulation
01/08/1997EP0752154A1 Printed circuit board relay with insert connections
01/08/1997EP0607255B1 Additive compositions for high thermal cycled and aged adhesion
01/08/1997CN1139821A Method of manufacturing thick-film resistor
01/07/1997US5592391 Faraday cage for a printed circuit card
01/07/1997US5592365 Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch
01/07/1997US5592255 Compact camera having components including inhibiting circuit mounted on one mounting board
01/07/1997US5592199 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
01/07/1997US5591941 Solder ball interconnected assembly
01/07/1997US5591519 Can be separated after imaging
01/07/1997US5591382 High strength conductive polymers
01/07/1997US5591285 Fluorinated carbon polymer composites
01/07/1997US5590465 Method of manufacturing connection terminals of flexible wiring pattern substrates
01/07/1997US5590462 Process for dissipating heat from a semiconductor package
01/07/1997US5590461 Method of making multi-layer wiring board
01/07/1997US5590460 Method of making multilayer circuit
01/04/1997CA2176780A1 Polarity-sensitive protector device
01/03/1997WO1997000599A1 Ground plane routing
01/03/1997WO1997000598A1 Connection substrate
01/03/1997WO1997000537A1 Flexible leads for tape ball grid array circuit
01/03/1997WO1997000339A1 Copper wire and process for making copper wire
01/03/1997WO1997000338A2 High fatigue ductility electrodeposited copper foil
01/03/1997CA2221756A1 Ground plane routing
01/03/1997CA2221750A1 Flexible leads for tape ball grid array circuit
01/02/1997EP0751700A2 Copper-clad laminate, process for producing the same, printed wiring board, and process for producing the same
01/02/1997EP0751571A2 A multilayer hybrid circuit
01/02/1997EP0751569A2 Hybrid power circuit
01/02/1997EP0751562A2 Thermally conducting fastening of an electronic power device to a printed circuit board with a heat dissipator
01/02/1997EP0751556A1 Fabrication process for an interconnection substrate allowing to connect a die to a carrier substrate
01/02/1997EP0750791A1 Electric connections arranged in a high-density grid
01/02/1997EP0710177A4 Circuit board material with barrier layer
01/02/1997EP0610425B1 Process for preparing a polyimide film with a preselected value for cte
01/02/1997DE19625669A1 Compatibility precision measurement mark for semiconductor photomask manufacture
01/02/1997DE19620203A1 Printed circuit board
01/02/1997DE19523521A1 Electrical transponder coil and circuit assembly
01/02/1997DE19522838A1 Multiple circuit boards assembly method
01/02/1997DE19522455A1 Electromagnetic compatibility screening of electronic components esp. integrated circuits in motor vehicles
01/01/1997CN1139369A Circuit board and fabricating method thereof
01/01/1997CN1139343A Double superheterodyne tuner
01/01/1997CN1139297A Structure and method of coupling substrates
12/1996
12/31/1996US5590058 Battery monitor for unobstrusive installation with a battery connector
12/31/1996US5590030 Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections
12/31/1996US5590029 Circuit board SMT device mounting apparatus
12/31/1996US5590017 Alumina multilayer wiring substrate provided with high dielectric material layer
12/31/1996US5589709 Lead frame capacitor and capacitively-coupled isolator circuit using same
12/31/1996US5589319 Photosensitive polyimide resin composition
12/31/1996US5589280 Metal on plastic films with adhesion-promoting layer
12/31/1996US5589255 Adhesive for electroless plating, printed circuit boards and method of producing the same
12/31/1996US5589251 Resonant tag and method of manufacturing the same
12/31/1996US5589250 Resin compositions and printed circuit boards using the same
12/31/1996US5589236 Coextrusion of liquid crystal polymers and thermoplastic polymers
12/31/1996US5588983 Ball milling with stearic acid