Patents for H05K 1 - Printed circuits (98,583) |
---|
01/28/1997 | US5597644 Glass glaze |
01/28/1997 | US5597313 Electrical connectors |
01/28/1997 | US5596804 Method of constructing an electromagnetically shielded microstrip circuit |
01/23/1997 | WO1997002723A1 Process and device for joining electric, heat source-bearing printed circuit boards to metallic heat dissipating plates |
01/23/1997 | WO1997002628A1 Filtered electrical connector |
01/23/1997 | WO1997002620A1 Surface mounted directional coupler |
01/23/1997 | WO1997002309A1 A microfiber-reinforced porous polymer film |
01/22/1997 | EP0755035A1 Resonant tag and method of manufacturing the same |
01/22/1997 | EP0754795A1 Process and system for making an armature for a part made of composite material |
01/22/1997 | EP0552377B1 Dielectric material for high frequency and resonator made thereof, and manufacture thereof |
01/22/1997 | CN1141114A Method of surface mounting radio frequency components and the components |
01/22/1997 | CN1141078A Self-addressable self-assembling microelectronic system and devices for molecular biological analysis and diagnostics |
01/22/1997 | CN1140973A Process for producing multilayer printed circuit boards |
01/22/1997 | CN1140864A Resonant tag and method of manufacturing the same |
01/21/1997 | US5596227 Ball grid array type semiconductor device |
01/21/1997 | US5596178 single replacement pad with perforated shaft for the repair of printed circuit boards |
01/21/1997 | US5595858 Manufacturing method for double-sided wiring board |
01/21/1997 | US5595668 Protective coatingsprotective coatings |
01/21/1997 | US5595583 Apparatus for localized surface glazing of ceramic articles |
01/18/1997 | CA2181399A1 Process and system for making structure of a composite part |
01/16/1997 | WO1997001872A1 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement |
01/16/1997 | WO1997001595A1 Prepreg for printed wiring boards, resin varnish, resin composition, and laminate for printed wiring boards produced by using these substances |
01/16/1997 | WO1997001591A1 Epoxy resin composition for printed wiring board and laminated board produced with the use of the same |
01/16/1997 | WO1997001437A1 Circuit board laminates and method of making |
01/16/1997 | WO1997001414A1 Preformed solder parts coated with parylene in a thickness effective to exhibit predetermined interference colors |
01/16/1997 | WO1996036450A3 Fabricating metal matrix composites containing electrical insulators |
01/15/1997 | EP0753537A1 Epoxy resin compositions containing red phosphorus |
01/15/1997 | EP0753101A1 Engine components including ceramic-metal composites |
01/15/1997 | EP0667094B1 Backplane printed circuit board for a module frame |
01/15/1997 | EP0556185B1 System for controlling the clamp means in a tree harvesting machine, especially grapple harvester |
01/15/1997 | CN1140430A Method of making composite laminate and PWB substrate so made |
01/15/1997 | CN1140183A Thermosetting resin compostion electrical laminates obtained therefrom and process of producing these |
01/14/1997 | US5594621 Motherboard for a computer of the AT type, and a computer of the AT type comprising such motherboard. |
01/14/1997 | US5594607 For a disk drive |
01/14/1997 | US5594397 Used as a signal transmission element |
01/14/1997 | US5594234 Downset exposed die mount pad leadframe and package |
01/14/1997 | US5594214 Signal transmission flat cable |
01/14/1997 | US5593774 Polyimide base film; thermoplastic or thermosetting adhesive layers; tear strength; semiconductors |
01/14/1997 | US5593767 Laminate, a glass fiber woven fabric and a printed wiring board |
01/14/1997 | US5593722 Method of producing thick multi-layer substrates |
01/14/1997 | US5593720 Process for making a multileveled electronic package |
01/14/1997 | US5593604 Method of resistance welding thin elements |
01/14/1997 | US5593526 Ceramic coated glass spheres |
01/14/1997 | US5592737 Method of manufacturing a multilayer printed wire board |
01/14/1997 | US5592736 Fabricating an interconnect for testing unpackaged semiconductor dice having raised bond pads |
01/14/1997 | CA2149929C Devices using metallized magnetic substrates |
01/08/1997 | EP0752738A2 Polarity-sensitive protector device |
01/08/1997 | EP0752594A2 Contact structure for electrically connecting a testing board and die |
01/08/1997 | EP0752167A1 Method and apparatus for integrated circuit voltage regulation |
01/08/1997 | EP0752154A1 Printed circuit board relay with insert connections |
01/08/1997 | EP0607255B1 Additive compositions for high thermal cycled and aged adhesion |
01/08/1997 | CN1139821A Method of manufacturing thick-film resistor |
01/07/1997 | US5592391 Faraday cage for a printed circuit card |
01/07/1997 | US5592365 Panel assembly structure and panel assembling method capable of achieving a highly reliable connection of electrode terminals even when the electrode terminals have a fine pitch |
01/07/1997 | US5592255 Compact camera having components including inhibiting circuit mounted on one mounting board |
01/07/1997 | US5592199 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
01/07/1997 | US5591941 Solder ball interconnected assembly |
01/07/1997 | US5591519 Can be separated after imaging |
01/07/1997 | US5591382 High strength conductive polymers |
01/07/1997 | US5591285 Fluorinated carbon polymer composites |
01/07/1997 | US5590465 Method of manufacturing connection terminals of flexible wiring pattern substrates |
01/07/1997 | US5590462 Process for dissipating heat from a semiconductor package |
01/07/1997 | US5590461 Method of making multi-layer wiring board |
01/07/1997 | US5590460 Method of making multilayer circuit |
01/04/1997 | CA2176780A1 Polarity-sensitive protector device |
01/03/1997 | WO1997000599A1 Ground plane routing |
01/03/1997 | WO1997000598A1 Connection substrate |
01/03/1997 | WO1997000537A1 Flexible leads for tape ball grid array circuit |
01/03/1997 | WO1997000339A1 Copper wire and process for making copper wire |
01/03/1997 | WO1997000338A2 High fatigue ductility electrodeposited copper foil |
01/03/1997 | CA2221756A1 Ground plane routing |
01/03/1997 | CA2221750A1 Flexible leads for tape ball grid array circuit |
01/02/1997 | EP0751700A2 Copper-clad laminate, process for producing the same, printed wiring board, and process for producing the same |
01/02/1997 | EP0751571A2 A multilayer hybrid circuit |
01/02/1997 | EP0751569A2 Hybrid power circuit |
01/02/1997 | EP0751562A2 Thermally conducting fastening of an electronic power device to a printed circuit board with a heat dissipator |
01/02/1997 | EP0751556A1 Fabrication process for an interconnection substrate allowing to connect a die to a carrier substrate |
01/02/1997 | EP0750791A1 Electric connections arranged in a high-density grid |
01/02/1997 | EP0710177A4 Circuit board material with barrier layer |
01/02/1997 | EP0610425B1 Process for preparing a polyimide film with a preselected value for cte |
01/02/1997 | DE19625669A1 Compatibility precision measurement mark for semiconductor photomask manufacture |
01/02/1997 | DE19620203A1 Printed circuit board |
01/02/1997 | DE19523521A1 Electrical transponder coil and circuit assembly |
01/02/1997 | DE19522838A1 Multiple circuit boards assembly method |
01/02/1997 | DE19522455A1 Electromagnetic compatibility screening of electronic components esp. integrated circuits in motor vehicles |
01/01/1997 | CN1139369A Circuit board and fabricating method thereof |
01/01/1997 | CN1139343A Double superheterodyne tuner |
01/01/1997 | CN1139297A Structure and method of coupling substrates |
12/31/1996 | US5590058 Battery monitor for unobstrusive installation with a battery connector |
12/31/1996 | US5590030 Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections |
12/31/1996 | US5590029 Circuit board SMT device mounting apparatus |
12/31/1996 | US5590017 Alumina multilayer wiring substrate provided with high dielectric material layer |
12/31/1996 | US5589709 Lead frame capacitor and capacitively-coupled isolator circuit using same |
12/31/1996 | US5589319 Photosensitive polyimide resin composition |
12/31/1996 | US5589280 Metal on plastic films with adhesion-promoting layer |
12/31/1996 | US5589255 Adhesive for electroless plating, printed circuit boards and method of producing the same |
12/31/1996 | US5589251 Resonant tag and method of manufacturing the same |
12/31/1996 | US5589250 Resin compositions and printed circuit boards using the same |
12/31/1996 | US5589236 Coextrusion of liquid crystal polymers and thermoplastic polymers |
12/31/1996 | US5588983 Ball milling with stearic acid |