| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/16/1997 | EP0767815A1 Compatibilized lcp blends |
| 04/16/1997 | EP0647251A4 Surface mount conductive adhesives. |
| 04/16/1997 | CN1147805A Coating of substrates |
| 04/15/1997 | US5621193 Ceramic edge connect process |
| 04/15/1997 | US5621068 Thermoplastic polyimide polymer; thermoplastic polyimide film; polyimide laminate; and method of manufacturing the laminate |
| 04/15/1997 | US5620927 Solder ball attachment machine for semiconductor packages |
| 04/15/1997 | US5620800 Laminated structure of a metal layer on a conductive polymer layer and method of manufacturing such a structure |
| 04/15/1997 | US5620782 Method of fabricating a flex laminate package |
| 04/15/1997 | US5619791 Method for fabricating highly conductive vias |
| 04/15/1997 | CA2063682C Solder-coated printed circuit board and method of manufacturing the same |
| 04/10/1997 | WO1997013395A1 Module mounting rack for an electronic control unit with signal-processing components and rapid-operation digital components |
| 04/10/1997 | WO1997013393A1 Printed circuit board interconnection between layers |
| 04/10/1997 | WO1997013295A1 Connector and manufacturing method therefor |
| 04/10/1997 | WO1997013274A1 A support for electronic components |
| 04/10/1997 | WO1997012925A1 Halogen-free flame-retardant epoxy resin composition, and prepreg and laminate containing the same |
| 04/10/1997 | WO1997008737A3 Circuit arrangement including a hybrid circuit |
| 04/10/1997 | DE19640435A1 Power dissipation device for semiconductor component, e.g. SMD or PCB |
| 04/10/1997 | DE19537445A1 Protection against manipulation of automated games machine |
| 04/09/1997 | EP0767600A1 Device for treating radio frequency signals having a surface mounted component |
| 04/09/1997 | EP0767496A1 Multilayer high-frequency circuit with integrated active elements |
| 04/09/1997 | EP0767495A2 Surface-mounting type semiconductor device |
| 04/09/1997 | EP0767257A2 Process for manufacturing integrated electrodes in plastic moulds, plastic moulds with integrated electrodes and its use |
| 04/09/1997 | EP0767211A1 Styrene-based resin composition |
| 04/09/1997 | EP0767065A1 Thermal printing head, substrate used therefor and method for producing the substrate |
| 04/09/1997 | EP0766907A1 Metallized laminate material having ordered distribution of conductive through holes |
| 04/09/1997 | EP0710433B1 Electrical circuits with very high conductivity and great fineness, methods of manufacture and devices comprising same |
| 04/09/1997 | EP0692177B1 Resin impregnated laminate for wiring board applications |
| 04/09/1997 | EP0613608B1 Electromagnetic interference control in multilayer structures |
| 04/09/1997 | EP0485588B1 Electrodeposited copper foil and process for making same using electrolyte solutions having low chloride ion concentrations |
| 04/09/1997 | CN1146952A Laminate of liquid crystal polyester resin composition film and material foil, and printed-wiring board using the same |
| 04/08/1997 | US5619719 Reduced inter-module circuit path crossovers on circuit boards mounting plural multi-chip modules, through rearranging the north-south-east-west interconnection interfaces of a given module and through selective rotation of each module |
| 04/08/1997 | US5619018 Low weight multilayer printed circuit board |
| 04/08/1997 | US5618636 Low thermal expansion polyimide films are formed as insulation and surface protection films stacked with multilayered metal films; wiring board |
| 04/08/1997 | US5618611 Metallization of ferrites through surface reduction |
| 04/08/1997 | US5618470 Electrically conductive paste |
| 04/08/1997 | US5618185 Crosstalk noise reduction connector for telecommunication system |
| 04/08/1997 | CA2109555C Printed circuit board for injection molding system |
| 04/08/1997 | CA2077499C Pattern structure of a printed circuit board |
| 04/03/1997 | WO1997012504A1 Method for surface mounting a heatsink to a printed circuit board |
| 04/03/1997 | WO1997012503A1 Electronic assembly with semi-crystalline copolymer adhesive |
| 04/03/1997 | WO1997012440A1 Planar electronic network |
| 04/03/1997 | WO1997012388A1 Apparatus and method for making laminated electrical and electronic devices |
| 04/03/1997 | DE19536848A1 Baugruppenträger für ein elektronisches Steuergerät mit signalverarbeitenden Bauelementen und schnell arbeitenden digitalen Bauelementen Rack for an electronic control unit with signal processing components and high-speed digital devices |
| 04/02/1997 | EP0766506A2 A multilayer circuit board having a window exposing an enhanced conductive layer for use as an insulated mounting area |
| 04/02/1997 | EP0766505A2 Rigid-flex circuit board having a window for an insulated mounting area |
| 04/02/1997 | EP0766504A2 A wireless circuit board system for a motor controller |
| 04/02/1997 | EP0766503A2 Multi-layered printed circuit board, and grid array package adopting the same |
| 04/02/1997 | EP0766351A1 Status display device for a circuit board connection element |
| 04/02/1997 | EP0766344A2 Jumper connector |
| 04/02/1997 | EP0765534A1 High impact digital crash data recorder |
| 04/02/1997 | CN1146848A Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| 04/02/1997 | CN1146748A Composite article and method for making same |
| 04/02/1997 | CN1146707A Printed-circuit board |
| 04/01/1997 | US5617300 Connecting method of printed substrate and apparatus |
| 04/01/1997 | US5617298 Collinear terminated transmission line structure |
| 04/01/1997 | US5617296 Data processing system |
| 04/01/1997 | US5617294 Apparatus for removing heat from an integrated circuit package that is attached to a printed circuit board |
| 04/01/1997 | US5616967 Method and apparatus for decoupling of unused power supply pins of a printed circuit board capable of operating at a plurality of predetermined voltages |
| 04/01/1997 | US5616962 Semiconductor integrated circuit devices having particular terminal geometry |
| 04/01/1997 | US5616960 Multilayered interconnection substrate having a resin wall formed on side surfaces of a contact hole |
| 04/01/1997 | US5616956 Circuit substrate including insulating layer of aluminum nitride and electrically conductive layer of conductive component, aluminum nitride and other components, and semiconductor device containing same |
| 04/01/1997 | US5616888 Rigid-flex circuit board having a window for an insulated mounting area |
| 04/01/1997 | US5616423 Ceramic substrate having a multilayered metallic thin film |
| 04/01/1997 | US5616422 Metallized substrate |
| 04/01/1997 | US5616421 Metal matrix composites containing electrical insulators |
| 04/01/1997 | US5616363 Laminate, glass fiber non-woven fabric therefor and a method of producing glass fiber non-woven fabric |
| 04/01/1997 | US5616256 Printed wiring board and process for producing thereof |
| 04/01/1997 | US5616173 Thick film conductor paste for automotive glass |
| 04/01/1997 | US5616165 Method for making gold powders by aerosol decomposition |
| 04/01/1997 | US5616050 Flexible circuit connector |
| 04/01/1997 | US5615824 Method of making an electrical connection |
| 04/01/1997 | US5615477 Method for interconnecting a flip chip to a printed circuit substrate |
| 03/27/1997 | WO1997011590A2 Method of detecting the position and displacement of layers on multilayered circuit boards |
| 03/27/1997 | WO1997011589A1 Coating for the structured production of conductors on the surface of electrically insulating substrates |
| 03/27/1997 | WO1997011588A1 Microelectronic lead structures with dielectric layers |
| 03/27/1997 | WO1997011377A1 Machine for the opposite control of printed circuits |
| 03/27/1997 | WO1997011210A1 Method for producing electrodeposited copper foil and copper foil obtained by same |
| 03/27/1997 | WO1997011109A1 Cross-linked biobased materials and uses thereof |
| 03/27/1997 | WO1997011105A1 Epoxy resin composition for electrolaminates having aryl substituted guanidine and/or biguanide as cross-linking agent |
| 03/27/1997 | WO1997011037A2 Composite materials based on ultra-high molecular weight polyolefin fiber and matrix, and process for the manufacture thereof |
| 03/27/1997 | WO1997006656A3 Method of manufacturing devices comprising a base with a conductor pattern of electrical conductors |
| 03/27/1997 | DE19638681A1 Manufacturing method for electrical distribution box for mutual connection of cable harnesses |
| 03/27/1997 | DE19635564A1 Circuit board for motor vehicle lights, esp. for brake lights mounted near rear windscreen or boot lid |
| 03/27/1997 | DE19535705A1 Double-sided circuit board with multiple connection pads |
| 03/27/1997 | DE19535068A1 Beschichtung zur strukturierten Erzeugung von Leiterbahnen auf der Oberfläche von elektrisch isolierenden Substraten Coating for the structured production of conductor tracks on the surface of electrically insulating substrates |
| 03/27/1997 | CA2231865A1 Machine for the opposite control of printed circuits |
| 03/27/1997 | CA2228598A1 Ultra-high molecular weight polyolefin fiber composite matrix and process for the manufacture thereof |
| 03/26/1997 | EP0765110A1 Circuit board and method of making |
| 03/26/1997 | EP0765053A2 Printed circuit board, printed circuit board used for flat panel display drive circuit, and flat panel display device |
| 03/26/1997 | EP0764995A1 Microwave shielding structures |
| 03/26/1997 | EP0764956A2 Electric component to be mounted on double printed circuit boards |
| 03/26/1997 | EP0764618A2 Thick film conductor paste compositions for aluminum nitride substrates |
| 03/26/1997 | EP0764393A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology |
| 03/26/1997 | EP0764353A1 Corrosion protection of oppositely polarised electrical conductors |
| 03/26/1997 | EP0764352A1 Microelectronic contacts and assemblies |
| 03/26/1997 | EP0764342A1 Electrostatic chuck |
| 03/26/1997 | EP0419594B1 Method of making laminated ptfe-containing composites and products thereof |
| 03/26/1997 | CN1146134A Assembly for mounting components to flexible cables |
| 03/26/1997 | CN1146055A Thick film conductor paste compositions for aluminum nitride substrates |
| 03/26/1997 | CN1145849A Multi-layer structures containing adhesion promoting layer |