| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/14/1997 | EP0773709A2 Two-layer solderable gold for thick film circuits |
| 05/14/1997 | EP0773600A2 Electrical circuit |
| 05/14/1997 | EP0773584A2 Device having resin package and method of producing the same |
| 05/14/1997 | EP0773309A1 Electroless/electrolytic methods for the preparation of metallized ceramic substrates |
| 05/14/1997 | EP0772958A1 Internally damped circuit articles |
| 05/14/1997 | CN1149855A Thermal printing head, substrate used thereof and method for producing the substrate |
| 05/14/1997 | CN1149814A Method for soldering parts on carrier sheet |
| 05/14/1997 | CN1149813A Method for producing metal layer coated pressboard |
| 05/14/1997 | CN1149807A Matrix patch board, wiring plug and its producing method |
| 05/14/1997 | CN1149774A 层结构 Layer structure |
| 05/14/1997 | CN1149750A Monolithic ceramic electronic element and its producing method |
| 05/13/1997 | US5629654 Coplanar waveguide coupler |
| 05/13/1997 | US5629563 Component stacking in multi-chip semiconductor packages |
| 05/13/1997 | US5629241 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 05/13/1997 | US5629098 Epoxy adhesives and copper foils and copper clad laminates using same |
| 05/13/1997 | US5628921 Demetallizing procedure |
| 05/13/1997 | US5628919 Forming via holes in unsintered green sheets, burying a portion of an internal conductor in via holes, obtaining a multilayr structure, pressing, and sintering to form a carrier body, and concave portions on lower face of carrier |
| 05/13/1997 | US5628881 High temperature reaction method |
| 05/13/1997 | US5628852 Method for manufacturing a polyimide multilayer wiring substrate |
| 05/13/1997 | US5628850 Method for producing input/output connections in a ceramic device |
| 05/13/1997 | US5628637 Computer system SCSI adapter card including an add-in daughter board providing an external SCSI connector for modular and upgradable SCSI bus routing options |
| 05/09/1997 | WO1997016913A1 A method and device to fasten a loudspeaker to a circuit board |
| 05/09/1997 | WO1997016383A1 Multilayer co-fired ceramic compositions and ceramic-on-metal circuit board |
| 05/09/1997 | WO1997011037A3 Composite materials based on ultra-high molecular weight polyolefin fiber and matrix, and process for the manufacture thereof |
| 05/07/1997 | EP0772379A1 Mounting of power converters |
| 05/07/1997 | EP0772195A2 Carriage structure for a disk drive |
| 05/07/1997 | EP0771833A1 Process of producing acid-modified polyphenylene ether and polystyrenic resin composition |
| 05/07/1997 | EP0771423A1 Three axis packaging |
| 05/07/1997 | DE19645034A1 Manufacture of end section for connection to planar circuit element such as ribbon cable printed circuit body |
| 05/07/1997 | DE19644796A1 Elektrische Verbinderanordnung An electrical connector assembly |
| 05/07/1997 | DE19643670A1 Over-voltage protection material curing at low temperature to avoid damage |
| 05/07/1997 | DE19541096A1 Laminatmaterial für Leiterplatten sowie Verfahren zu seiner Herstellung Laminate material for printed circuit boards and processes for its preparation |
| 05/07/1997 | DE19541030A1 Coating circuit boards, electric modules, hybrid circuits etc |
| 05/07/1997 | DE19540814A1 Board for printed circuit with surface mount technology (SMT) components |
| 05/07/1997 | CN1149238A Apparatus for minimizing clock skew and maximizing retime margin in high speed system |
| 05/07/1997 | CN1149191A Thick film conductive paste composition |
| 05/06/1997 | US5628053 Integrated multilayered microwave circuit and a method of fabricating it |
| 05/06/1997 | US5627904 Miniature loudspeaker clip structure |
| 05/06/1997 | US5627730 Printed circuit board assembly for high speed data transfer |
| 05/06/1997 | US5627481 Fast transmission line implemented with receiver, driver, terminator and IC arrangements |
| 05/06/1997 | US5627406 Inverted chip bonded module with high packaging efficiency |
| 05/06/1997 | US5627344 Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate |
| 05/06/1997 | US5627316 Position sensor |
| 05/06/1997 | US5626948 Layer vary in electroconductivity |
| 05/06/1997 | US5626914 Ceramic body with copper metal infiltration |
| 05/06/1997 | US5626777 Process for producing dividable plates of brittle material with high accuracy and apparatus for receiving and precision-grinding the end faces of a plate |
| 05/06/1997 | US5626771 Multilayer electronic circuit packages |
| 05/06/1997 | US5626713 Method for manufacturing multi-layer printed board |
| 05/06/1997 | US5625944 Methods for interconnecting integrated circuits |
| 05/06/1997 | US5625935 Method of manufacturing a multilayer electronic component |
| 05/06/1997 | CA2044454C Ultrafine spherical nickel powder and method of manufacturing the same |
| 05/02/1997 | EP0771045A1 Microstrip line dielectric filter |
| 05/02/1997 | EP0771009A1 Support with low dielectric constant, use for printed circuits board and process of manufacturing |
| 05/02/1997 | EP0770638A1 Polyimide compositions for electrodeposition and coatings formed of the same |
| 05/02/1997 | EP0770260A2 Variable voltage protection structures and methods for making same |
| 05/02/1997 | EP0710431A4 Space-saving memory module |
| 05/01/1997 | WO1997015965A1 Process and arrangement for connecting a plurality of mutually remote electric contact points |
| 05/01/1997 | WO1997015623A1 Resin composition, molding produced using the same, and process for producing the same |
| 04/30/1997 | DE19643129A1 Composite plate comprising plastic resin films sandwiching metallic electrical circuit |
| 04/29/1997 | US5625780 Programmable backplane for buffering and routing bi-directional signals between terminals of printed circuit boards |
| 04/29/1997 | US5625227 Circuit board-mounted IC package cooling apparatus |
| 04/29/1997 | US5625222 Semiconductor device in a resin package housed in a frame having high thermal conductivity |
| 04/29/1997 | US5625169 Electronic parts with an electrode pattern between two dielectric substrates |
| 04/29/1997 | US5624979 Stabilized phosphorus-modified epoxy resins and their use |
| 04/29/1997 | US5624750 Adhesive heater and method for securing an object to a surface |
| 04/29/1997 | US5624741 Matrix of oxygen impermeable anhygroscopic inorganic dielectric with insulatively coated, abutting dispersed metal particles; application of electrical potential between two points breaks down coating forming conductive path |
| 04/29/1997 | US5624708 High-density circuit and method of its manufacture |
| 04/29/1997 | CA2124196C Magnetic vias within multilayer, 3 dimensional structures/substrates |
| 04/24/1997 | WO1997015097A1 Solder element |
| 04/24/1997 | WO1997015096A1 Top exit coupler |
| 04/23/1997 | EP0769378A2 Recording head, head cartridge and recording apparatus |
| 04/23/1997 | EP0769214A1 Process for producing an electrically conductive connection |
| 04/23/1997 | EP0769155A1 Arrangement of optical modules |
| 04/23/1997 | EP0768952A1 Polymeric film containing silicone resin and clay |
| 04/23/1997 | EP0691041B1 Asymmetrical waveguide |
| 04/23/1997 | CN1148402A Halogen-free flame-retardant epoxy resin composition |
| 04/23/1997 | CN1148281A Method and apparatus for locating electrical circuit members |
| 04/23/1997 | CN1034706C Solder-coated printed circuit board, and method for mfg. same |
| 04/22/1997 | US5623191 Circuit board architecture for a motor controller |
| 04/22/1997 | US5623160 Signal-routing or interconnect substrate, structure and apparatus |
| 04/22/1997 | US5622895 Metallization for polymer-dielectric multichip modules |
| 04/22/1997 | US5622770 Printed circuit board design utilizing flexible interconnects for programmable logic components |
| 04/22/1997 | US5622769 Ceramic circuit board having a thermal conductivity substrate |
| 04/22/1997 | US5622652 Solution mixture comprising electroconductive powder |
| 04/22/1997 | US5622608 Depositing copper and magnesium on substrate, annealing to form inert magnesium oxide layer |
| 04/22/1997 | US5622547 Containing tall oil ester |
| 04/19/1997 | CA2160854A1 Top exit coupler |
| 04/19/1997 | CA2160851A1 Terminal |
| 04/17/1997 | WO1997014281A1 Reducing dusting of epoxy laminates |
| 04/17/1997 | WO1997014280A1 Laminates having improved dielectric properties |
| 04/17/1997 | WO1997014157A1 An electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 04/17/1997 | WO1997013586A1 Flip chip underfill system and method |
| 04/17/1997 | DE19538046A1 Process for making metal to ceramic layers |
| 04/17/1997 | CA2224236A1 An electrical circuit component formed of a conductive liquid printed directly onto a substrate |
| 04/17/1997 | CA2187857A1 Prepreg, process for producing the same and printed circuit substrate/board using the same |
| 04/16/1997 | EP0768814A1 Woven glass cloth for printed wiring board and printed wiring products manufactured therefrom |
| 04/16/1997 | EP0768813A2 Printed circuit boards |
| 04/16/1997 | EP0768802A1 Automatic mdf apparatus |
| 04/16/1997 | EP0768334A2 Prepreg, process for producing the same and printed circuit substrate using the same |
| 04/16/1997 | EP0768313A2 A surface treating agent for glass fiber substrates |