| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/03/1999 | EP0899787A2 Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structurs formed thereby |
| 03/03/1999 | EP0899683A2 IC card indicating state of usage and system therefor |
| 03/03/1999 | EP0898802A1 Protective device for an electronic circuit |
| 03/03/1999 | EP0717443B1 Integrated circuit device |
| 03/03/1999 | EP0702806B1 Method of photolithographically metallizing at least the inside of holes arranged in accordance with a pattern in a plate of an electrically insulating material |
| 03/03/1999 | EP0698290B1 Power semiconductor device with stress buffer layer |
| 03/03/1999 | EP0680999B1 Styrene resin composition |
| 03/03/1999 | CN1209602A Master plate of programmable controller system and power-supply unit and CPU unit on same |
| 03/03/1999 | CN1209468A Micro-etching agent for copper and copper alloy |
| 03/02/1999 | US5877942 Circuit card assembly footprint providing reworkable interconnection paths for use with a surface mount device |
| 03/02/1999 | US5877937 Encapsulated semiconductor device and electronic circuit board mounting same |
| 03/02/1999 | US5877669 Flyback transformer having a flexible coil winding structure and manufacturing process thereof |
| 03/02/1999 | US5877550 Hybrid module and method of manufacturing the same |
| 03/02/1999 | US5877033 System for detection of unsoldered components |
| 03/02/1999 | US5876859 Direct metal bonding |
| 03/02/1999 | US5876842 Modular circuit package having vertically aligned power and signal cores |
| 03/02/1999 | US5876841 Conductive paste and conductor and ceramic substrate comprising the same |
| 03/02/1999 | US5876795 Method for producing a low-stress electrolessly deposited nickel layer |
| 03/02/1999 | US5876549 Method and apparatus for stacking sheets supported by carriers |
| 03/02/1999 | US5876538 Method for manufacturing a ceramic multilayer substrate for complex electronic circuits |
| 03/02/1999 | US5876427 Compact flexible circuit configuration |
| 03/02/1999 | US5876221 Surface mount contact assembly for printed circuit board |
| 03/02/1999 | US5876216 Integrated connector board for disc drive storage systems |
| 02/25/1999 | WO1999009485A1 Section access for ide or scsi hard drives |
| 02/25/1999 | WO1999009105A1 Glass fiber sizing composition |
| 02/25/1999 | DE19803670A1 Semiconductor component for single-chip microcomputer |
| 02/24/1999 | EP0898340A1 Electrical connector having reduced cross-talk |
| 02/24/1999 | EP0898311A2 Surface mounting type semiconductor package mounted on a multilayer mounting substrate |
| 02/24/1999 | EP0898172A1 Testing printed circuit assemblies |
| 02/24/1999 | EP0897653A1 A circuit board |
| 02/24/1999 | EP0897601A1 Coplanar waveguide coupler |
| 02/24/1999 | EP0897582A1 Polymeric compositions having a temperature-stable dielectric constant |
| 02/24/1999 | EP0897351A1 Overlay substrate for securing electronic devices in a vehicle |
| 02/24/1999 | EP0706678B1 Method of photolithographically producing a copper pattern on a plate of an electrically insulating material |
| 02/24/1999 | EP0705484B1 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element |
| 02/24/1999 | EP0514557B1 Coating solution for forming transparent electrically conductive film, method of preparation thereof, electrically conductive substrate, method of preparation thereof, and display device having transparent electrically conductive substrate |
| 02/24/1999 | CN1208961A Surface mounting type semiconductor package mounted on multiplayer mounting substrate |
| 02/24/1999 | CN1208959A High-frequency integrated circuit device and mfr. method thereof |
| 02/24/1999 | CN1208955A IC-mounted structre, liquid crystal device and electronic device |
| 02/23/1999 | US5875102 Eclipse via in pad structure |
| 02/23/1999 | US5875101 For conducting power from power supplied to a circuit board |
| 02/23/1999 | US5875100 High-density mounting method and structure for electronic circuit board |
| 02/23/1999 | US5875091 Busbars with filter capacitors |
| 02/23/1999 | US5874776 Chip carrier |
| 02/23/1999 | US5874770 Flexible interconnect film including resistor and capacitor layers |
| 02/23/1999 | US5874378 Low temperature fired crystal structure having rare earth-aluminum garnet crystalline phase precipitated on grain boundaries; alkali resistance, thermoconductivity |
| 02/23/1999 | US5874370 Substrate comprising sheet of cloth coated with partly cured first thermosettting resin having better adhesion to cloth, b-stage cured second resin having better adhesion to metal, laminated between two sheets of metal and fully cured |
| 02/23/1999 | US5874175 Brazed bonding layer being microscopically void-free |
| 02/23/1999 | US5874162 Weighted sintering process and conformable load tile |
| 02/23/1999 | US5874154 For subsequent plating of metals from an electroless plating bath, improved adhesion and etchability, for electronic components |
| 02/23/1999 | US5874152 Method of making a composite laminate and a PWB substrate so made |
| 02/23/1999 | US5874009 Forming through holes by etching copper and insulating adhesive layers |
| 02/23/1999 | US5873751 Circuitized insulator |
| 02/23/1999 | US5873162 Technique for attaching a stiffener to a flexible substrate |
| 02/23/1999 | US5873161 Method of making a Z axis interconnect circuit |
| 02/23/1999 | CA2074648C Polyimide multilayer wiring substrate and method for manufacturing the same |
| 02/18/1999 | WO1999008498A1 Contact arrangement linking two substrates and method for the production of said contact arrangement |
| 02/18/1999 | WO1999008494A1 Temperature measuring type outside connecting mechanism for printed wiring board |
| 02/18/1999 | WO1999008493A1 Pcmcia card with metal cover, connector, frame with cross beam and exposed ground plate disposed on connector |
| 02/18/1999 | WO1999008297A2 Method of manufacturing a plurality of electronic components |
| 02/18/1999 | WO1998036624A3 Laminated multilayer substrates |
| 02/18/1999 | DE19730865A1 Heat sink for an electronic component especially a ceramic circuit board |
| 02/18/1999 | DE19727230C1 Low viscose adhesive droplets assessment |
| 02/18/1999 | CA2267297A1 Pcmcia card with metal cover, connector, frame with cross beam and exposed ground plate disposed on connector |
| 02/17/1999 | EP0896971A1 Curable resin composition for overcoat of flexible circuit |
| 02/17/1999 | EP0896787A1 A multi-layer moulded electronic device and method for manufacturing same |
| 02/17/1999 | EP0896714A1 Esd protection of magnetic heads |
| 02/17/1999 | EP0896706A1 Resonant tag and method of manufacturing the same |
| 02/17/1999 | EP0896673A1 Methods and systems for increased numbers of test points on printed circuit boards |
| 02/17/1999 | CN1208506A Circuit board clip connector |
| 02/17/1999 | CN1208368A Fabricating interconnects and tips using sacrificial substrates |
| 02/17/1999 | CN1208318A Connection apparatus between circuit boards |
| 02/17/1999 | CN1208253A Integrated circuit package and semi-conductor component |
| 02/16/1999 | US5872935 Method and apparatus for providing a remotely located outrigger card electrically coupled to a control card |
| 02/16/1999 | US5872695 Integrated electronic components having conductive filled through holes |
| 02/16/1999 | US5872687 Transducer suspension system |
| 02/16/1999 | US5872485 Dielectric line waveguide which forms electronic circuits |
| 02/16/1999 | US5872399 Solder ball land metal structure of ball grid semiconductor package |
| 02/16/1999 | US5872393 Flip-chip mounting, radio frequency, polybenzocyclobutene dielectric film |
| 02/16/1999 | US5872337 Chip carrier and cable assembly reinforced at edges |
| 02/16/1999 | US5872040 Method for fabricating a thin film capacitor |
| 02/16/1999 | US5871842 For preventing contaminants from permeating through the substrate silicon rubber keypad |
| 02/16/1999 | US5871840 Nickel powder containing a composite oxide of La and Ni and process for preparing the same |
| 02/16/1999 | US5871819 Two step coating; partially curing thermosetting resin/solvent mixture; filling, covering, curing again; printed circuits |
| 02/16/1999 | US5871672 Polypyrroles, polyanilines or polythiophenes with silver salts and ionic conducting exchange polymers |
| 02/16/1999 | US5871313 For use in a self-aligned chamfering of a workpiece |
| 02/16/1999 | US5871271 Bicycle helmet |
| 02/16/1999 | CA2123905C Metal powder composition for metallization and a metallized substrate |
| 02/11/1999 | WO1999007198A1 Console panel for equipment |
| 02/11/1999 | WO1999007194A1 Inter-tracks for power printed circuits |
| 02/11/1999 | DE19834640A1 Multilayer conducting track substrate for integrated hybrid circuit |
| 02/11/1999 | DE19832052A1 Printed circuit board |
| 02/11/1999 | DE19732254A1 Arrangement for transferring magnetic signals between the arrangement and a mobile communications partner, e.g. for monitoring and access control systems |
| 02/11/1999 | DE19732223A1 Function integration module for electrical load in automobile door |
| 02/10/1999 | EP0896501A2 Mounting structure for one or more semiconductor devices |
| 02/10/1999 | EP0896427A2 Surface acoustic wave device |
| 02/10/1999 | EP0896419A2 Power converter incorporated in a magnetic circuit |
| 02/10/1999 | EP0896368A1 Film carrier tape, semiconductor assembly, semiconductor device, manufacturing method therefor, mounting board, and electronic equipment |
| 02/10/1999 | EP0896250A2 Hardenable photoimageable compositions |
| 02/10/1999 | EP0895486A1 Grafted thermoplastic elastomer barrier layer |