| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/27/1999 | US5896650 Method of making ceramic multilayer |
| 04/27/1999 | CA2012670C Multilayer film and laminate for use in producing printed circuit boards |
| 04/22/1999 | WO1999020089A1 Stratified composite dielectric and method of fabrication |
| 04/22/1999 | WO1999020088A1 Printed circuit boards |
| 04/22/1999 | WO1999019982A1 Surface mount lc filter with polymer layers |
| 04/22/1999 | WO1999019691A1 Position sensor |
| 04/22/1999 | WO1999019139A1 Bumped substrate assembly |
| 04/22/1999 | DE19842028A1 High frequency communications unit for wireless communications system |
| 04/22/1999 | DE19744643A1 Semiconductor component adhesive-pressing method |
| 04/22/1999 | DE19743289A1 High density multilevel interconnect substrate, especially for multi-chip modules, has insulation levels of different materials |
| 04/21/1999 | EP0910232A1 Low resistivity palladium-silver compositions |
| 04/21/1999 | EP0910163A1 Oscillator module |
| 04/21/1999 | EP0909467A1 Small filament lamp, and holder for a small filament lamp |
| 04/21/1999 | EP0909462A1 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 04/21/1999 | EP0807325B1 Press-fit connecting pin and electronic device using the same |
| 04/21/1999 | EP0806127A4 An environmentally desirable method of manufacturing printed circuits, printed circuits made thereby and associated apparatus |
| 04/21/1999 | EP0751866B1 Method of making a ud crossply pwb laminate having one or more inner layers of metal |
| 04/21/1999 | CN1214548A 多芯片模块 A multi-chip module |
| 04/21/1999 | CN1214547A 多芯片模块 A multi-chip module |
| 04/21/1999 | CN1214544A Discrete semiconductor device and method for producing the same |
| 04/21/1999 | CN1214497A Circuit substrate, circuit-formed suspension substrate, and prodution methods therefor |
| 04/20/1999 | US5896346 High speed and low cost SDRAM memory subsystem |
| 04/20/1999 | US5896271 Integrated circuit with a chip on dot and a heat sink |
| 04/20/1999 | US5896268 Enclosure for high-density subscriber line modules |
| 04/20/1999 | US5896259 Preheating device for electronic circuits |
| 04/20/1999 | US5896127 Coordinate data input device and method of fabricating the same |
| 04/20/1999 | US5896080 Thermal fuse for fixing on a circuit board |
| 04/20/1999 | US5896079 High frequency common mode ferrite bead |
| 04/20/1999 | US5895970 Semiconductor package having semiconductor element, mounting structure of semiconductor package mounted on circuit board, and method of assembling semiconductor package |
| 04/20/1999 | US5895969 Thin type semiconductor device, module structure using the device and method of mounting the device on board |
| 04/20/1999 | US5895800 A heat resistance, solvent resistance polynorbornene graft copolymer and a curing agent to form a dielectric protective coatings for semiconductor, printed circuits, electronics |
| 04/20/1999 | US5895302 Method for making a heat-resistant reflector for LED display suitable for surface mounting |
| 04/20/1999 | US5895281 High density board to board connector |
| 04/20/1999 | US5895277 Electrical connection box with general and special circuits |
| 04/20/1999 | US5895232 Three-dimensional warp-resistant integrated circuit module method and apparatus |
| 04/20/1999 | US5895231 External terminal fabrication method for semiconductor device package |
| 04/20/1999 | US5894984 Structure of electronic parts and method of soldering electronic parts to substrate |
| 04/20/1999 | US5894648 High speed depaneling apparatus and method |
| 04/15/1999 | WO1999018656A1 Voltage regulating device |
| 04/15/1999 | WO1999018633A1 Wiring board constructions and methods of making same |
| 04/15/1999 | WO1999018611A1 Stacked integrated circuits using tape automated bonding within an implantable medical device |
| 04/15/1999 | WO1999018607A1 Methods of making flexible substrates for electronic packaging and flexible substrates formed by the method |
| 04/15/1999 | WO1999008297A3 Method of manufacturing a plurality of electronic components |
| 04/15/1999 | DE19842615A1 Electronic component comprises a boxed printed circuit board module |
| 04/15/1999 | DE19800928A1 Stackable housing for electronic component |
| 04/15/1999 | DE19747177A1 Stackable encased electronic component |
| 04/15/1999 | DE19739717A1 Circuit boards are bonded to form a fluidic micro-system |
| 04/14/1999 | EP0909118A2 Conductive elastomer for grafting to an elastic substrate |
| 04/14/1999 | EP0909117A2 Method of making thick film circuits |
| 04/14/1999 | EP0909019A2 Television tuner system |
| 04/14/1999 | EP0908975A1 Male connector for flat flexible circuit |
| 04/14/1999 | EP0908968A2 Connector for flat flexible circuitry |
| 04/14/1999 | EP0908951A2 Improved air isolated crossovers |
| 04/14/1999 | EP0908943A2 Laser-solderable electronic component |
| 04/14/1999 | EP0908902A2 PTC-element, protective device and electric circuit board |
| 04/14/1999 | EP0908559A2 Nonwoven reinforcement for printed wiring base board and process for producing the same |
| 04/14/1999 | EP0908429A1 Metallized silicon nitride ceramic, fabricating process thereof and metallizing composite for the process |
| 04/14/1999 | EP0908076A1 Grid array assembly and method of making |
| 04/14/1999 | EP0907998A1 Power pad/power delivery system |
| 04/14/1999 | EP0907965A1 Component housing for surface mounting a semiconductor component |
| 04/14/1999 | EP0851944B1 Method for producing electrodeposited copper foil and copper foil obtained by same |
| 04/14/1999 | EP0787347B1 Electrically conducting ink with metal grains of different melting points |
| 04/14/1999 | CN1214185A Control device, especially for motor vehicle |
| 04/14/1999 | CN1213947A Conductive elastomer for grafting to elastic substrate |
| 04/14/1999 | CN1213713A Improved zinc-chromium stabilizer containing hydrogen inhibiting additive |
| 04/14/1999 | CN1042984C Feedthrough film capacitor and its array |
| 04/14/1999 | CN1042983C Compsns. of cupric alloy |
| 04/14/1999 | CA2249827A1 Magnetic component assembly |
| 04/13/1999 | US5894252 Laminated ceramic electronic component with a quadrangular inner conductor and a method for manufacturing the same |
| 04/13/1999 | US5893763 Transition adapter for conductor cables |
| 04/13/1999 | US5893727 Method for manufacturing a massive parallel interconnection attachment using flexible circuit |
| 04/13/1999 | US5893623 Structure and method for mounting semiconductor devices, and liquid crystal display |
| 04/10/1999 | CA2249133A1 Connectors for flat flexible circuitry |
| 04/10/1999 | CA2248851A1 Male connector for flat flexible circuit |
| 04/08/1999 | WO1999017597A1 Microelectronic packages and packaging methods including thermally and electrically conductive pad |
| 04/08/1999 | WO1999017596A1 Hybrid substrate for cooling an electronic component and method for forming the substrate |
| 04/08/1999 | WO1999017404A1 High frequency bus system |
| 04/08/1999 | WO1999017363A1 Method for producing a multilevel cable carrier (substrate), especially for multichip modules |
| 04/08/1999 | WO1999016601A1 Manufacture of thin metal objects |
| 04/08/1999 | WO1999016556A1 Method for metallizing holes |
| 04/08/1999 | DE19743365A1 Verfahren zur Herstellung eines Mehrebenen-Verdrahtungsträgers (Substrat), insbesondere für Multichipmodule A process for preparing a multi-level wiring support (substrate), especially for multi-chip modules |
| 04/08/1999 | DE19721731C1 Joining plastic film with a release agent on the surface to a metal foil and resulting multilayer material |
| 04/08/1999 | CA2305696A1 Manufacture of thin metal objects |
| 04/08/1999 | CA2304528A1 Microelectronic packages and packaging methods including thermally and electrically conductive pad |
| 04/07/1999 | EP0907308A1 Method for mounting terminal on circuit board and circuit board |
| 04/07/1999 | EP0907307A1 Heat sink for surface mount power packages |
| 04/07/1999 | EP0906666A1 Printed circuit board having integrated broadside microwave coupler |
| 04/07/1999 | EP0742962B1 Transmission-line network |
| 04/07/1999 | EP0664547B1 Metallic film resistor having fusing function and method for its manufacture |
| 04/07/1999 | EP0638225B1 Feedthrough via connection method and apparatus |
| 04/07/1999 | CN1213459A Small filament lamp and holder for small filament lamp |
| 04/07/1999 | CN1213156A Flexible circuit and its preparation method |
| 04/06/1999 | US5892668 Noise-cut filter for power converter |
| 04/06/1999 | US5892663 Flexible insulator for telecommunications network printed |
| 04/06/1999 | US5892660 Single in line memory module adapter |
| 04/06/1999 | US5892658 VME eurocard triple printed wiring board single slot module assembly |
| 04/06/1999 | US5892657 Electronic-circuit assembly and its manufacturing method |
| 04/06/1999 | US5892490 Meander line antenna |
| 04/06/1999 | US5892476 Electromagnetic radiation absorptive composition containing inorganic coated microparticles |
| 04/06/1999 | US5892425 Interwound center-tapped spiral inductor |