Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 1 - Printed circuits
Patents for H05K 1 - Printed circuits (98,583)
03/1999
03/23/1999US5884398 Mounting spring elements on semiconductor devices
03/23/1999US5884397 Method for fabricating chip carriers and printed circuit boards
03/18/1999WO1999013140A1 Wholly aromatic synthetic fiber produced by liquid-crystal spinning, process for producing the same, and use thereof
03/18/1999WO1999012749A1 Ic card and method of manufacturing the same
03/18/1999WO1998032213A3 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same
03/18/1999DE19739011A1 Electronic assembly with optimized component carrier, especially for antilock braking system
03/18/1999DE19736113A1 Verfahren und Vorrichtung zur Ermittlung einer Kenngröße für ein Metallisierungsbad Method and apparatus for determining a characteristic quantity for a metallizing
03/18/1999CA2302605A1 Wholly aromatic synthetic fibers spun from a liquid-crystalline polymer solution, a process for preparing the same fibers and use of the same fibers
03/17/1999EP0902611A2 Recyclable circuit board comprising a foil and support system
03/17/1999EP0902608A1 Compound laminate for printed circuit boards
03/17/1999EP0902607A2 Security feature for printed circuit boards
03/17/1999EP0902330A1 Photomask and alignment method
03/17/1999EP0902048A1 High dielectric constant flexible polyimide film and process of preparation
03/17/1999EP0901744A1 Electronic card with shield cover having tabs where each tab engages with recess of corresponding shield cover
03/17/1999EP0901696A1 Smart card computer adaptor
03/17/1999EP0688473B1 Improved high frequency electrical connector
03/17/1999CN1211347A 电缆组件 Cable Assemblies
03/17/1999CN1211160A Wiring board and its producing method
03/16/1999US5883791 Electronic circuit unit and method of mounting the same
03/16/1999US5883788 Backing plate for LGA mounting of integrated circuits facilitates probing of the IC's pins
03/16/1999US5883759 Flex circuit head interconnect for improved electrical performance and ease of assembly
03/16/1999US5883425 Circuit device
03/16/1999US5883150 Compositions of a copolymer including a sulfone polymer
03/16/1999US5882722 Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
03/16/1999US5882720 Shape classification for pads
03/16/1999US5882572 Method for producing a line-shaped weakening by means of lasers
03/16/1999US5882549 Pastes for fired-on layers
03/16/1999US5882455 Apparatus and method for forming isotropic multilayer ceramic substrates
03/16/1999US5882451 Method and apparatus for applying an electronic component adhesive
03/16/1999US5881455 Method of fabricating through-holed wiring board
03/11/1999WO1999012404A1 Flexible circuits and carriers and process for manufacture
03/11/1999WO1999012234A1 Rolling gimbal harness
03/11/1999WO1999012223A1 A method and an arrangement in an electronics system
03/11/1999WO1999012065A1 Electrical appliance
03/11/1999WO1999011727A1 Printable adhesive composition and methods of preparation
03/11/1999WO1998057357A3 Multiple board package employing solder balls and fabrication method and apparatus
03/11/1999WO1998049876A3 Capacitive device on a circuit board
03/11/1999DE19809509A1 Semiconductor component with ball grid array (BGA)
03/11/1999DE19740790C1 Manufacturing ceramic film based components
03/11/1999DE19738754A1 Flexible printed circuit
03/11/1999CA2297212A1 Flexible circuits and carriers and process for manufacture
03/11/1999CA2246925A1 Mobile telecommunication apparatus
03/10/1999EP0901316A2 Multi-layer ceramic substrate and method of producing the multi-layer ceramic substrate
03/10/1999EP0901211A2 Electrical distribution system
03/10/1999EP0901201A1 Electrical connector having time-delayed signal compensation
03/10/1999EP0901198A2 Panel yoke
03/10/1999EP0901191A2 Woven mesh interconnect
03/10/1999EP0901101A2 Noncontact IC device
03/10/1999EP0900971A1 Illumination device with LED's mounted on a glass plate
03/10/1999EP0900700A2 Electrical distribution system
03/10/1999EP0812258A4 Electrical feedthroughs for ceramic circuit board support substrates
03/10/1999CN1210661A Printed wiring board device
03/10/1999CN1210480A Grafted thermoplastic elastomer barrier layer
03/10/1999CN1210440A Method for preventing gold plate connector on PCB from being contaminated
03/10/1999CN1210352A Multilayer interconnection board and connection pin
03/10/1999CN1210343A Elexible electric cable and its application
03/10/1999CN1210304A Laminated substrate board and data inputting device using the same board
03/09/1999US5880938 Circuit board with screening arrangement against electromagnetic interference
03/09/1999US5880937 Electrical circuit arrangement having equipotential surface for reduced high-frequency interference
03/09/1999US5880936 PC card test and configuration connector
03/09/1999US5880935 Device for using in an electronic controller
03/09/1999US5880925 Surface mount multilayer capacitor
03/09/1999US5880705 Mounting structure for a tessellated electronic display having a multilayer ceramic structure and tessellated electronic display
03/09/1999US5880657 Printed wiring board modified gull wing signal lead connection
03/09/1999US5880520 Low mutual inductance lead frame device
03/09/1999US5880405 Terminal structure for electronic part with stepped offset portions
03/09/1999US5880247 Phosphorus-containing dicarboxylic acid (anhydride)-modified epoxy resin
03/09/1999US5880024 Semiconductor device having wiring self-aligned with shield structure and process of fabrication thereof
03/09/1999US5880011 Method and apparatus for manufacturing pre-terminated chips
03/09/1999US5879794 Non-woven substrate containing particulate filler, adhesive resin; electronics
03/09/1999US5879788 Silver-palladium conductor, lead borosilicate glass, gold conductor
03/09/1999US5879787 Method and apparatus for improving wireability in chip modules
03/09/1999US5879761 Method for forming electrically conductive polymer interconnects on electrical substrates
03/09/1999US5879568 For production of hydrogen and oxygen
03/09/1999US5879172 Surface mounted adapter using elastomeric conductors
03/09/1999US5878941 Method of soldering components on a carrier foil
03/09/1999US5878487 Method of supporting an electrical circuit on an electrically insulative base substrate
03/09/1999US5878486 Method of burning-in semiconductor devices
03/04/1999WO1999011107A1 Assembly consisting of a substrate for power components and a cooling element and method for the production thereof
03/04/1999WO1999011105A1 Method for producing electroconductive structures
03/04/1999WO1999011104A1 Electronic interconnection method and apparatus for minimizing propagation delays
03/04/1999WO1999010926A1 Method for producing electrically conductive cross connections between two layers of wiring on a substrate
03/04/1999WO1999010769A1 Applications for encapsulated electrophoretic displays
03/04/1999WO1999010768A1 Novel addressing schemes for electrophoretic displays
03/04/1999WO1999010767A1 Electrophoretic displays and materials
03/04/1999WO1999010734A1 Method and device for determining a parameter for a metallization bath
03/04/1999WO1999010565A2 Electrochemical deposition of a composite polymer-metal oxide
03/04/1999WO1999010435A1 Heat-resistant, lowly dielectric high-molecular material, and films, substrates, electric components and heat-resistant resin moldings produced therefrom
03/04/1999WO1998057226A3 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate
03/04/1999WO1998055669A3 Conductor track structures arranged on a nonconductive support material, especially fine conductor track structures, and method for producing the same
03/04/1999DE19838178A1 Programmable control system with plug-in energy supply
03/04/1999DE19738416A1 Elektrisches Gerät Electrical equipment
03/04/1999DE19737730A1 Electronic control unit and individual components of the unit
03/04/1999DE19737698A1 Electronic control unit and individual components of the unit
03/04/1999DE19737692A1 Electronic control unit and individual components of the unit
03/04/1999DE19736962A1 Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben Arrangement comprising a carrier substrate for power components and a heat sink and method for manufacturing the same
03/04/1999CA2302509A1 Electronic interconnection method and apparatus for minimizing propagation delays
03/03/1999EP0899992A2 Embedded thin film passive components
03/03/1999EP0899842A1 Multilayer interconnection board and connection pin
03/03/1999EP0899821A2 User interface
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