| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 05/14/1999 | WO1999022570A2 Three-dimensional electronic module |
| 05/14/1999 | WO1998054733A3 Low profile pin-less planar magnetic devices and method of making same |
| 05/12/1999 | EP0915642A1 Interconnection unit |
| 05/12/1999 | EP0915641A1 Surface mount assembly for electronic components |
| 05/12/1999 | EP0915516A2 Substrate for stacked module and stacked module |
| 05/12/1999 | EP0915515A2 Electrical signal transmitting arrangement between a thermally isolated module on carrier plate and adjacent neighbouring modules |
| 05/12/1999 | EP0915512A2 Ceramic substrate having a metal circuit |
| 05/12/1999 | EP0915488A2 Multilayer capacitor |
| 05/12/1999 | EP0915431A1 IC card and manufacturing method of such a card |
| 05/12/1999 | EP0915381A1 Process of forming a pattern on a substrate |
| 05/12/1999 | EP0915125A2 Laminate base material, method of preparing the same, prepreg and laminate |
| 05/12/1999 | EP0914757A1 Z-axis interconnect method and circuit |
| 05/12/1999 | EP0914756A1 Method and device for the manufacturing of solder stop preferably on a printed board |
| 05/12/1999 | EP0914697A1 Assembly of connector and printed circuit board |
| 05/12/1999 | EP0914688A1 Printed circuit board layering configuration for very high bandwidth interconnect |
| 05/12/1999 | EP0801884B1 Module mounting rack for an electronic control unit with signal-processing components and rapid-operation digital components |
| 05/12/1999 | EP0600051B1 Process for producing printed circuit boards using a semi-finished product with extremely dense wiring for signal conduction |
| 05/12/1999 | DE19747388C1 Contactless chip card manufacturing method |
| 05/12/1999 | DE19747001A1 Elektrischer Widerstand sowie ein mit diesem elektrischen Widerstand hergestellter mechanisch elektrischer Wandler Electrical resistance as well as a manufactured with this electrical resistance mechanical-electric transducer |
| 05/11/1999 | US5903829 RF equalizer module |
| 05/11/1999 | US5903744 Logic emulator using a disposable wire-wrap interconnect board with an FPGA emulation board |
| 05/11/1999 | US5903441 Method and apparatus for aligning a printed circuit board with a chassis |
| 05/11/1999 | US5903440 Method of forming assemblies of circuit boards in different planes |
| 05/11/1999 | US5903432 Computer package with a polygonal shaped motherboard |
| 05/11/1999 | US5903431 Multiple single layer monolithic passive integrated circuits and method |
| 05/11/1999 | US5903429 Capacitor, method for producing same and method for producing dielectric body |
| 05/11/1999 | US5903421 High-frequency composite part |
| 05/11/1999 | US5903353 Method and apparatus for inspecting component placement and solder connection in printed circuit board manufacture |
| 05/11/1999 | US5902850 Blend of styrene-based polymer, polyolefin and a block or graft styrene-olefin polymer; high modulus of elasticity; toughness; antipeeling agents; heat resistance; impact strength; construction materials; electrical apparatus |
| 05/11/1999 | US5902758 Borosilicate glass, alpha- and gamma-alumina, and mullite crystals crystallized out in a dispersed form from the glass and gamma-alumina; low dielectric constant, high strength for multilayer wiring |
| 05/11/1999 | US5902437 Method of making resonant tag labels |
| 05/11/1999 | US5902138 System for connecting wiring harnesses |
| 05/11/1999 | US5901923 Rolling gimbal harness |
| 05/10/1999 | CA2244804A1 Thermal protection for surge suppression |
| 05/06/1999 | WO1999022552A1 Via pad geometry supporting uniform transmission line structures |
| 05/06/1999 | WO1999022210A1 Electric resistor and a mechanical electrical transformer produced with said electric resistor |
| 05/06/1999 | WO1999021803A2 Dielectric glasses for low dielectric loss, low temperature cofired ceramics with medium dielectric constants |
| 05/06/1999 | EP0914032A1 Low-emi circuit board and low-emi cable connector |
| 05/06/1999 | EP0913861A2 Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
| 05/06/1999 | EP0913372A1 Aluminum nitride substrate and process for producing the same |
| 05/06/1999 | EP0913268A1 Flexible ic module and method of its manufacture, and method of manufacturing information carrier comprising flexible ic module |
| 05/06/1999 | EP0913255A2 Thermal ink jet print head energy control apparatus and method |
| 05/06/1999 | EP0913075A1 Rectifier set for high voltage device |
| 05/06/1999 | EP0912913A1 Electronically addressable microencapsulated ink and display thereof |
| 05/06/1999 | EP0912335A1 Conductive elastomers and methods for fabricating the same |
| 05/06/1999 | EP0779904B1 Epoxy resin mixtures for prepregs and composites |
| 05/06/1999 | DE19749954A1 Detecting molten state during soft soldering of component onto e.g. circuit boards, especially for surface mount devices with ball-grid array connectors |
| 05/06/1999 | DE19748174A1 Separation arrangement for printed circuit cards |
| 05/06/1999 | DE19748173A1 Biodegradable electronic components |
| 05/06/1999 | DE19747783A1 High frequency especially microwave waveguide element |
| 05/05/1999 | CN1215973A Mounted structure of prinited circuit board in semiconductor package |
| 05/05/1999 | CN1215922A Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink |
| 05/05/1999 | CN1215896A Circuit protection device |
| 05/04/1999 | US5901279 Method of coupling logic devices using spares |
| 05/04/1999 | US5901046 Surface mount type package unit and method for manufacturing the same |
| 05/04/1999 | US5901045 Method and apparatus for isolating component leads |
| 05/04/1999 | US5901020 Magnetic disk drive |
| 05/04/1999 | US5900738 Method of testing semiconductor devices |
| 05/04/1999 | US5900649 Electronic assembly having improved thermal characteristics |
| 05/04/1999 | US5900587 For transmitting electrical signals |
| 05/04/1999 | US5900312 Integrated circuit chip package assembly |
| 05/04/1999 | US5900308 Circuit with copper plating layer, dielectric substrate, gold conductors with undercoat; stable and reliable filtering characteristics; microwave receivers |
| 05/04/1999 | US5900292 Liquid crystal polymer film and a method for manufacturing the same |
| 05/04/1999 | US5898992 To conductors of printed circuits on a flexible substrate |
| 05/04/1999 | CA2111280C Surge suppression device |
| 04/29/1999 | WO1999021224A1 Package substrate |
| 04/29/1999 | WO1999021193A1 Conductor paste and nonreversible circuit elements made by using the same |
| 04/29/1999 | WO1999021131A1 Method and device for producing chip cards |
| 04/29/1999 | WO1999020814A1 Aluminum alloys for electronic components |
| 04/29/1999 | DE19800460A1 Plastic material for electronic applications contains a negative thermal expansion coefficient filler |
| 04/29/1999 | CA2252113A1 Substrate and process for producing the same |
| 04/28/1999 | EP0911965A2 Complex electronic component |
| 04/28/1999 | EP0911904A2 Printed lumped element stripline circuit structure and method |
| 04/28/1999 | EP0911903A2 Coaxcial cable, method for manufacturing a coaxial cable, and wireless communication device |
| 04/28/1999 | EP0911878A2 Metalization system |
| 04/28/1999 | EP0911876A2 Low thermal expansion circuit board and multilayer wiring circuit board |
| 04/28/1999 | EP0911678A2 Display device with terminals connected to a folded film substrate |
| 04/28/1999 | EP0910935A1 Electrical circuit |
| 04/28/1999 | EP0910857A1 Planar transformer |
| 04/28/1999 | EP0834169A4 Tesselated electroluminescent display having a multilayer ceramic substrate |
| 04/28/1999 | CN1215301A Multi-layer substrate and making method thereof |
| 04/28/1999 | CN1214979A Nickel powder and preparation process thereof |
| 04/27/1999 | US5898576 Printed circuit board including a terminated power plane and method of manufacturing the same |
| 04/27/1999 | US5898575 Support assembly for mounting an integrated circuit package on a surface |
| 04/27/1999 | US5898573 Microelectronic packages and packaging methods including thermally and electrically conductive pad |
| 04/27/1999 | US5898570 Enhanced heat transfer in printed circuit boards |
| 04/27/1999 | US5898563 Chip composite electronic component with improved moisture resistance and method of manufacturing the same |
| 04/27/1999 | US5898344 High-frequency module |
| 04/27/1999 | US5898222 Capped copper electrical interconnects |
| 04/27/1999 | US5898215 Microelectronic assembly with connection to a buried electrical element, and method for forming same |
| 04/27/1999 | US5898128 Electronic component |
| 04/27/1999 | US5897761 Surface treatment of matte surface; controlling surface roughness |
| 04/27/1999 | US5897723 Method for fabricating a ceramic composite body having at least one hollow portion therein |
| 04/27/1999 | US5897388 Method of applying ESD protection to a shielded electrical |
| 04/27/1999 | US5897336 Direct chip attach for low alpha emission interconnect system |
| 04/27/1999 | US5897334 Method for reproducing printed circuit boards for semiconductor packages including poor quality printed circuit board units and method for fabricating semiconductor packages using the reproduced printed circuit boards |
| 04/27/1999 | US5897326 Method of exercising semiconductor devices |
| 04/27/1999 | US5897188 Structure of liquid crystal display device with two driver circuit substrates partially superposed and connected by a flexible cable |
| 04/27/1999 | US5896655 Method for manufacturing electrically conductive lead-throughs in metallized plastic housings |
| 04/27/1999 | US5896651 Method of mounting microelectronic circuit package |