| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 02/10/1999 | CN1207585A Semiconductor device and its lead frame |
| 02/10/1999 | CN1207505A Hardenable photoimageable compositions |
| 02/09/1999 | US5870621 Quadrilateral multichip computer systems and printed circuit boards therefor |
| 02/09/1999 | US5870528 Automatic MDF apparatus |
| 02/09/1999 | US5870290 Interface adapter board having arrays of interstitial connectors and an intermediate switching circuit |
| 02/09/1999 | US5870289 Chip connection structure having diret through-hole connections through adhesive film and wiring substrate |
| 02/09/1999 | US5870286 Heat sink assembly for cooling electronic modules |
| 02/09/1999 | US5870274 Capacitive PCB with internal capacitive laminate |
| 02/09/1999 | US5869961 Smart IC-test receptacle having holes adapted for mounting capacitors arranged adjacent to pin positions |
| 02/09/1999 | US5869906 Registration accuracy measurement mark for semiconductor devices |
| 02/09/1999 | US5869887 Semiconductor package fabricated by using automated bonding tape |
| 02/09/1999 | US5869790 Coordinate input apparatus having orthogonal electrodes on opposite surfaces of a dielectric substrate and through-hole connections and manufacturing method thereof |
| 02/09/1999 | US5869353 Modular panel stacking process |
| 02/09/1999 | US5868949 Metalization structure and manufacturing method thereof |
| 02/09/1999 | US5868884 Kneading mixture of water soluble metal acids or salts, ceramic particles, sintering auxiliaries, water; slurrying with binder, drying, sintering |
| 02/09/1999 | US5868582 Contact device for electrically connecting a printed circuit board with a liquid crystal display |
| 02/09/1999 | US5867898 Method of manufacture multilayer circuit package |
| 02/04/1999 | WO1999005760A1 Disposable portable electronic devices and method of making |
| 02/04/1999 | WO1999005731A1 Solid-state energy storage module employing integrated interconnect board |
| 02/04/1999 | WO1999005722A1 Double-side, thermally conductive adhesive tape for plastic-packaged electronic components |
| 02/04/1999 | WO1999005360A1 Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom |
| 02/04/1999 | WO1999005054A1 Pneumatic product vending system and loader |
| 02/04/1999 | WO1998050255A3 Sensor circuit, specially for an automobiles |
| 02/04/1999 | WO1998050249A3 Detection circuit and corresponding carrier |
| 02/04/1999 | DE19824225A1 Method of manufacturing a printed circuit board |
| 02/04/1999 | DE19732561A1 Control module for domestic equipment |
| 02/04/1999 | CA2320976A1 Disposable portable electronic devices and method of making |
| 02/04/1999 | CA2289467A1 Aramid papers of improved solvent resistance and dimensionally stable laminates made therefrom |
| 02/03/1999 | EP0895445A1 Improvement of the design of inter-tracks of power printed circuits |
| 02/03/1999 | EP0895444A1 Circuit assembly |
| 02/03/1999 | EP0895287A2 Semiconductor device and lead frame for the same |
| 02/03/1999 | EP0895284A1 Metal-ceramic composite circuit substrates |
| 02/03/1999 | EP0894808A1 Modified cellulose compound and photopolymerizable resin composition containing the same |
| 02/02/1999 | USRE36077 Method of manufacturing inversion type IC's and IC module using same |
| 02/02/1999 | US5867469 Optical pickup device with biaxial drive for objective lens |
| 02/02/1999 | US5867417 Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
| 02/02/1999 | US5867390 Adhesive applying method |
| 02/02/1999 | US5867367 Quad flat pack integrated circuit package |
| 02/02/1999 | US5867235 Assembling construction of a display apparatus and assembling method therefor |
| 02/02/1999 | US5867069 Orthogonally mounted substrate based resonators |
| 02/02/1999 | US5866850 Layered construction of busbars and insulating plates with ribs |
| 02/02/1999 | US5866848 Method of providing power to a circuit module on a circuit board |
| 02/02/1999 | US5866470 Method of using an interface layer for stacked lamination sizing and sintering |
| 02/02/1999 | US5866441 Inverted chip bonded module with high packaging efficiency |
| 02/02/1999 | US5866240 Thick ceramic on metal multilayer circuit board |
| 02/02/1999 | US5866203 Bonding strength |
| 02/02/1999 | US5866202 Fine particles of amino resin |
| 02/02/1999 | US5866020 Method of manufacturing TAB tapes and laminated body for producing the same |
| 02/02/1999 | US5865934 Method of manufacturing printed wiring boards |
| 02/02/1999 | US5865920 Method of forming electrode on ceramic green sheet and method of manufacturing multilayer ceramic electronic component |
| 02/02/1999 | US5865650 Ultrasound adapter |
| 02/02/1999 | US5865631 Method for reducing shorts on a printed circuit board edge connector |
| 02/02/1999 | US5864946 Method of making contact tip structures |
| 01/28/1999 | WO1999004430A1 Semiconductor flip-chip package and method for the fabrication thereof |
| 01/28/1999 | WO1999003926A1 Alkoxysilane/organic polymer composition for thin insulating film production and use thereof |
| 01/28/1999 | WO1999003597A1 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 01/28/1999 | WO1998048378A3 Card inlay for chip cards |
| 01/28/1999 | WO1998048197A3 Vibration control system, especially for circuit boards |
| 01/28/1999 | DE19832561A1 Electric motor control circuit module |
| 01/28/1999 | DE19832560A1 Control circuit module for electrical system in automobile |
| 01/28/1999 | DE19732317A1 Electromagnetic noise absorber for flat cable |
| 01/27/1999 | EP0893946A2 Circuit board having bonding areas to be joined with bumps by ultrasonic bonding |
| 01/27/1999 | EP0893474A2 Epoxy resin composition and a process for manufacturing a multilayer printed-wiring board using it |
| 01/27/1999 | EP0892987A1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 01/27/1999 | CN1206546A Laminates for printed circuits using unidirectional glass fabric |
| 01/27/1999 | CN1206545A Optical/electrical hybrid wiring board and its manufacturing method |
| 01/27/1999 | CN1206325A Printed circuit board |
| 01/27/1999 | CN1206226A Spherical grid array plugin unit |
| 01/26/1999 | US5864642 Electro-optic device board |
| 01/26/1999 | US5864478 Power pod/power delivery system |
| 01/26/1999 | US5864463 Electronic device having connector with rows of terminals divided by ribs and ground or power terminal adjacent ribs |
| 01/26/1999 | US5864445 Hygrothermal load compensating structures in an integrated lead suspension |
| 01/26/1999 | US5864377 Liquid crystal display |
| 01/26/1999 | US5864175 Wrap-resistant ultra-thin integrated circuit package fabrication method |
| 01/26/1999 | US5864089 Low-crosstalk modular electrical connector assembly |
| 01/26/1999 | US5864088 Electronic device having the electromagnetic interference suppressing body |
| 01/26/1999 | US5863817 Semiconductor device |
| 01/26/1999 | US5863674 Battery terminals for a miniature electronic apparatus and structure for holding the same |
| 01/26/1999 | US5863666 High performance flexible laminate |
| 01/26/1999 | US5863446 Electrical means for extracting layer to layer registration |
| 01/26/1999 | US5863407 Metal film resistor having fuse function and method for producing the same |
| 01/26/1999 | US5863405 Process for forming conductive circuit on the surface of molded article |
| 01/26/1999 | US5863331 IPC (Chip) termination machine |
| 01/26/1999 | US5862973 Method for inspecting solder paste in printed circuit board manufacture |
| 01/26/1999 | CA2066325C Interface connection through an insulating part |
| 01/21/1999 | WO1999003316A1 Printed wiring board and method for manufacturing the same |
| 01/21/1999 | WO1999003315A1 A device and method in electronics systems |
| 01/21/1999 | WO1999003111A1 Electrical device, electrical appliance or lighting device |
| 01/21/1999 | WO1999002373A1 Electric controller, in particular for a motor vehicle |
| 01/21/1999 | WO1998047320A3 Multifunctional printed circuit board with an opto-electronically active component |
| 01/20/1999 | EP0892592A2 Construction for mounting electronic component on flexible substrate |
| 01/20/1999 | EP0892591A2 Method of manufacturing a circuit assembly from two or more layers of flexible film |
| 01/20/1999 | EP0892410A2 Improved thick film resistor assembly |
| 01/20/1999 | EP0892274A2 A system and method for easily inspecting a bonded state of a BGA/CSP type electronic part to a board |
| 01/20/1999 | EP0892004A1 A polyimide film, a method for its manufacture and a polyimide film containing metal laminated plate |
| 01/20/1999 | EP0891646A1 Signal conductor |
| 01/20/1999 | EP0891603A1 Non-conductive substrate forming a band or panel, on which are formed a plurality of support elements |
| 01/20/1999 | EP0784539A4 Thermal management for additive printed circuits |
| 01/20/1999 | EP0777955B1 Device with an electric circuit |
| 01/20/1999 | EP0776385A4 High fatigue ductility electrodeposited copper foil |