Patents for H05K 1 - Printed circuits (98,583)
04/1999
04/06/1999US5892412 Method of and an apparatus for tunable passive-gain equalization
04/06/1999US5892304 Power cap
04/06/1999US5892303 Compact design for combination of an electrical circuit with a segmented electrode development roll
04/06/1999US5892291 Registration accuracy measurement mark
04/06/1999US5892277 Tab tape and semiconductor device using the tab tape
04/06/1999US5892274 Printed circuit board ground plane and high frequency semiconductor combination
04/06/1999US5892192 Operation device for vehicle air conditioner
04/06/1999US5892149 Heat transfer monitoring and/or measuring device
04/06/1999US5891606 Method for forming a high-density circuit structure with interlayer electrical connections method for forming
04/06/1999US5891553 Printed circuits
04/06/1999US5891543 Apparatus and method for screening using electrostatic adhesion
04/06/1999US5891283 Conductive paste composition and method for producing a ceramic substrate
04/06/1999US5891281 System and method for uniform product compressibility in a high throughput uniaxial lamination press
04/06/1999US5890912 Contact terminal with linear contact region
04/06/1999US5890429 Method of making and bonding a screen printed ink film carrier to an electronic device
04/06/1999US5890284 Method for modifying circuit having ball grid array interconnections
04/06/1999US5890281 Method for simplified and compact component addition to a printed circuit board
04/06/1999CA2247714A1 Laser-solderable electronic component
04/06/1999CA2131580C Novel phosphorus-containing flameproofing agents for epoxy resin materials
04/01/1999WO1999016292A1 Article and method for temporarily securing a flexible circuit to a rigid member
04/01/1999WO1999016091A1 Planar inductance geometry
04/01/1999WO1999015585A1 Curable resin composition for insulator and insulator
04/01/1999WO1999015474A2 Composite based on a porous material
04/01/1999WO1999015334A1 Method for transferring a picture to a surface
04/01/1999WO1999015331A1 Microsphere-containing circuit board paper
04/01/1999WO1998056018A3 Planar inductive devices
04/01/1999WO1998052393A9 Surface mount power supply device
04/01/1999DE19741580A1 Verbundwerkstoff Composite material
04/01/1999DE19739722A1 Rich fluid microengineered system
04/01/1999DE19737685A1 Screening seal for electrical equipment
03/1999
03/31/1999EP0906006A2 Process for manufacturing pressure-tight via connections
03/31/1999EP0906004A2 Multilayer circuit board
03/31/1999EP0905828A2 Device for identifying electronic apparatus
03/31/1999EP0905812A2 HF Module
03/31/1999EP0905775A2 Electrically conductive paste for via-hole and method of producing monolithic ceramic substrate using the same
03/31/1999EP0905720A1 Thick film low value high frequency inductor, and method of making the same
03/31/1999EP0905700A2 Support for a data processing device
03/31/1999EP0905550A1 Camera including dual sided auxiliary circuit board
03/31/1999EP0904675A1 Screen printing method and screen printing apparatus
03/31/1999EP0842594B1 Controller with a housing made of at least two parts
03/31/1999EP0776538A4 Electric power distribution system
03/31/1999CN1212820A Method and combined circuit board for preventing delamination and sagging in course of manufacturing complex circuit board
03/31/1999CN1212782A Data processing of Bitstream signal
03/31/1999CN1212463A Printed-circuit board bearing plate for ball grid array integrated circuit component
03/31/1999CN1042777C Production method for semiconductor units
03/30/1999US5889775 Multi-stage switch
03/30/1999US5889682 Clock routing design method using a hieraichical layout design
03/30/1999US5889660 Isolated power supply for indicator light
03/30/1999US5889657 Surface-mounting structure and method of electronic devices
03/30/1999US5889572 Liquid crystal display device
03/30/1999US5889462 Multilayer thick film surge resistor network
03/30/1999US5889322 Sintered from mixture of glass and silica filler; preventing change in thermal expansion; semiconductor packages
03/30/1999US5889321 Stiffeners with improved adhesion to flexible substrates
03/30/1999US5889233 Multilayer wiring structure
03/30/1999US5889139 Dimensionally stable ether-containing polyimide copolymers
03/30/1999US5888631 Method for minimizing warp in the production of electronic assemblies
03/30/1999US5888627 Printed circuit board and method for the manufacture of same
03/30/1999US5888087 One-handed dock for a portable data collection terminal
03/30/1999US5887345 Method for applying curable fill compositon to apertures in a substrate
03/30/1999US5887342 Method for making an electronic control unit
03/30/1999US5887324 Electrical terminal with integral capacitive filter
03/30/1999CA2134019C Solder ball connections and assembly process
03/30/1999CA2012633C Polyimide composition and prepreg and laminate thereof
03/25/1999WO1999014994A1 Multi-layer circuit board
03/25/1999WO1999014806A1 Carrier plate for micro-hybrid circuits
03/25/1999WO1998052384A3 Flexible lighting element circuit and method of manufacturing the same
03/25/1999DE19842237A1 Attachment element for at least one additional circuit board on a mother board
03/25/1999DE19741302A1 Planar inductor geometry for integrated circuit or printed circuit
03/25/1999DE19740330A1 Ceramic carrier plate for microhybrid circuits
03/24/1999EP0903969A2 Electronic printed circuit board
03/24/1999EP0903658A2 Multifunctional joystick
03/24/1999EP0903600A1 Optical device mounting board
03/24/1999EP0903426A2 Improved zinc-chromium stabilizer containing a hydrogen inhibiting additive
03/24/1999EP0903062A1 Lead attach for chip on board printed wiring board
03/24/1999EP0903060A1 Apparatus and method for mounting an electronic component to a substrate
03/24/1999EP0903014A1 Proximity switches with mechanical decoupling of terminal pins and plug-in unit
03/24/1999EP0902990A1 High density connector arrangement for a circuit board module
03/24/1999EP0902977A1 Surface mount package with heat transfer feature
03/24/1999EP0882384A4 Metal ball grid electronic package
03/24/1999CN1212115A Printed circuit multilayer assembly and method of manufacture therefor
03/24/1999CN1212063A Non-conductive substrate forming band or panel, on which are formed plurality of support elements
03/23/1999US5887158 Switching midplane and interconnecting system for interconnecting large numbers of signals
03/23/1999US5886886 Voltage multiplier for a power supply unit of an electronic insect-killer device
03/23/1999US5886878 Printed circuit board manufacturing method for through hole components with a metal case
03/23/1999US5886875 Apparatus using a circuit board having a frangible portion apparatus
03/23/1999US5886874 IC card
03/23/1999US5886858 Magnetic disk apparatus with flexible printed circuit board connected to carriage assembly
03/23/1999US5886763 LCD heater utilizing Z-axis conductive adhesive to attach bus bars to ito
03/23/1999US5886597 Circuit structure including RF/wideband resonant vias
03/23/1999US5886589 Balanced to unbalanced transmission line transformers
03/23/1999US5886574 High-frequency amplifier
03/23/1999US5886415 Anisotropic conductive sheet and printed circuit board
03/23/1999US5886406 Power-ground plane for a C4 flip-chip substrate
03/23/1999US5886309 Matrix switch board, connection pin, and method of fabricating them
03/23/1999US5886136 Coating a substrate with a photosensitive resin composition comprising a polyamic compound having at each terminal thereof at least one actinic ray-sensitive functional group, a photosensitive polymerizable auxiliary, exposing, developing
03/23/1999US5886134 From arylene dicyanates and arylenedioxydiphenylenebismaleimides
03/23/1999US5885850 Method for the 3D interconnection of packages of electronic components, and device obtained by this method
03/23/1999US5885710 Flexible strip transmission line
03/23/1999US5885501 Process for preparing dimensionally stabilized biaxially stretched thermoplastic film
03/23/1999US5885400 Method for joining rigid substrates at abutting lateral edges