| Patents for H05K 1 - Printed circuits (98,583) |
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| 12/13/2001 | US20010051840 Mounting apparatus and mounting method |
| 12/13/2001 | US20010051707 Polyamic acid, polyimide resin obtained therefrom and application thereof to circuit board |
| 12/13/2001 | US20010051682 Treating the surface of a molded article of thermoplastic resin of given impact strength and hardness, and an inorganic filler with blast to roughen surface, then catalyst coating, activation treatment and electroless plating |
| 12/13/2001 | US20010051584 Dielectric ceramic composition and method for producing the same, and device for communication apparatus using the same |
| 12/13/2001 | US20010051457 Technique for identifying multiple circuit components |
| 12/13/2001 | US20010051450 Multiple function high current interconnect with integrated bus bar |
| 12/13/2001 | US20010051395 Tape stiffener, semiconductor device assemblies including same, and stereolithographic methods for fabricating same |
| 12/13/2001 | US20010051385 Method of manufacturing semiconductor device |
| 12/13/2001 | US20010051210 Minimizing formation of cracks at junctions between vias and lines in line-to-via connections on a substrate; each line has a base section and a cap, each cap is positioned over a via in the substrate, cap's diameter is greater than via's |
| 12/13/2001 | US20010051029 Three-dimensional mounted assembly, method of manufacturing the same, and optical transmission device |
| 12/13/2001 | US20010050843 Radiation structure for heating element |
| 12/13/2001 | US20010050603 Microwave dielectric material |
| 12/13/2001 | US20010050600 Isolating energy conditioning shield assembly |
| 12/13/2001 | US20010050574 Interconnect for testing semiconductor dice having raised bond pads |
| 12/13/2001 | US20010050570 Method of forming an apparatus configured to engage an electrically conductive pad on a semiconductive substrate and a method of engaging electrically conductive pads on a semiconductive substrate |
| 12/13/2001 | US20010050566 Printed circuit board for use in the testing of electrical components and method for producing it |
| 12/13/2001 | US20010050434 Flexible printed wiring boards |
| 12/13/2001 | US20010050430 Electronic assembly having high interconnection density |
| 12/13/2001 | US20010050357 Ultraviolet curable silver composition and related method |
| 12/13/2001 | US20010050184 Connecting structure of flat circuit member |
| 12/13/2001 | US20010050182 Wiring board |
| 12/13/2001 | US20010050180 Method for preparing side attach pad traces through buried conductive material |
| 12/13/2001 | US20010050130 Acrylic polymer and nonconductor fillers, fibers, binders |
| 12/13/2001 | US20010050100 Semiconductors |
| 12/13/2001 | DE10125323A1 Electronic component, such as ceramic capacitor, has outer electrode layer containing polycrystalline tin and tin crystal grains with boundaries and atoms of another metal than tin at tin crystal grain boundaries |
| 12/13/2001 | DE10028319A1 Electromechanical transducer has piezoelectric elements in stack with intermediate contact electrodes in form of flat connecting vanes fed out of flexible circuit board |
| 12/13/2001 | DE10026714A1 Verbundfolie, Verfahren zu ihrer Herstellung und ihre Verwendung Composite film, process for their preparation and their use |
| 12/13/2001 | DE10026633A1 Elektrisch leitfähige Paste Electrically conductive paste |
| 12/13/2001 | CA2407650A1 Glyoxal-phenolic condensates with enhanced fluorescence |
| 12/12/2001 | EP1162869A2 Tuner with non-edge RF input PIN/LEAD |
| 12/12/2001 | EP1162867A1 Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 12/12/2001 | EP1162866A2 Laminate |
| 12/12/2001 | EP1162660A1 Electronic assembly with high density of electrical interconnections |
| 12/12/2001 | EP1162631A1 Flat ribbon-cable and its connection or contacting |
| 12/12/2001 | EP1162630A1 Flat ribbon cable |
| 12/12/2001 | EP1162629A1 Flat ribbon cable |
| 12/12/2001 | EP1162628A1 Flat ribbon-cable and its connection or contacting |
| 12/12/2001 | EP1162569A2 Method of producing a data carrier |
| 12/12/2001 | EP1162485A2 Opical fiber systems |
| 12/12/2001 | EP1162400A2 Modular lighting elements with leds (light-emitting diodes) |
| 12/12/2001 | EP1066224B1 Inorganic particle-coated glass fiber strands and products including the same |
| 12/12/2001 | EP0970594B1 Moulded sockets for electronic component attachment |
| 12/12/2001 | EP0953277B1 Optimized solder joints for surface mount chips |
| 12/12/2001 | EP0925326B1 Flame-retardant organic formulations |
| 12/12/2001 | CN2465329Y Iamge sensor |
| 12/12/2001 | CN1326600A Voltage tunable laminated dielectric materials for microwave applications |
| 12/12/2001 | CN1326313A Multi-layer printed circuit board and manufacture thereof |
| 12/12/2001 | CN1326312A Printed circuit board and electronic device therewith |
| 12/12/2001 | CN1326311A Double locations of slots and jacks |
| 12/12/2001 | CN1326263A 电子电路组件 Electronic circuit assembly |
| 12/12/2001 | CN1326261A Power device and power module therewith |
| 12/12/2001 | CN1326220A Connecting construction body |
| 12/12/2001 | CN1326196A Conductive rubber and ceramic electronic elements |
| 12/12/2001 | CN1325780A Device and method for priting marks on copper coated laminating boards |
| 12/12/2001 | CN1076154C Copper foil and high-density multi-layered printed circuit board using the copper foil for inner layer circuit |
| 12/12/2001 | CN1076148C 双超外差调谐器 Double superheterodyne tuner |
| 12/11/2001 | US6330377 Optical transmitting/receiving method and apparatus |
| 12/11/2001 | US6330166 Electronic-component mounting structure |
| 12/11/2001 | US6330165 Semiconductor device |
| 12/11/2001 | US6330164 Interconnect assemblies and methods including ancillary electronic component connected in immediate proximity of semiconductor device |
| 12/11/2001 | US6330159 Vertical surface mount apparatus with thermal carrier |
| 12/11/2001 | US6330158 Semiconductor package having heat sinks and method of fabrication |
| 12/11/2001 | US6329899 Formation of thin film resistors |
| 12/11/2001 | US6329702 High frequency carrier |
| 12/11/2001 | US6329609 Method and structure to prevent distortion and expansion of organic spacer layer for thin film transfer-join technology |
| 12/11/2001 | US6329607 Microelectronic lead structures with dielectric layers |
| 12/11/2001 | US6329606 Grid array assembly of circuit boards with singulation grooves |
| 12/11/2001 | US6329605 Components with conductive solder mask layers |
| 12/11/2001 | US6329604 Multilayer printed circuit board |
| 12/11/2001 | US6329603 Low CTE power and ground planes |
| 12/11/2001 | US6329474 For printed wiring boards; heat resistance, hydrophobic; corrosion resistance, discoloration inhibition |
| 12/11/2001 | US6329077 Plate-shaped compression mold, process for producing the same and process for making laminate therewith |
| 12/11/2001 | US6329074 Alloy layer comprising copper, zinc, tin and nickel, chromate layer |
| 12/11/2001 | US6329065 Wire board and method of producing the same |
| 12/11/2001 | US6329045 Substrates with inorganic powders |
| 12/11/2001 | US6328914 Thick-film paste with insoluble additive |
| 12/11/2001 | US6328598 Printed circuit board supporting different types of chassis connector panels |
| 12/11/2001 | US6328577 High density electric connector set |
| 12/11/2001 | US6328572 Motherboard with board having terminating resistance |
| 12/11/2001 | US6328427 Method of producing a wiring substrate |
| 12/08/2001 | CA2348802A1 Electronic assembly with high interconnect density |
| 12/06/2001 | WO2001093650A1 Modular backplane |
| 12/06/2001 | WO2001093324A2 Substrate adapted to accommodate a circuit configuration and method for producing the same |
| 12/06/2001 | WO2001093280A1 Halogen-free film composite, method for producing the same and its use |
| 12/06/2001 | WO2001063996A3 Electronic printed-circuit board for electronic devices, especially communications terminals |
| 12/06/2001 | US20010049221 Alignment mechanism for a high density electrical connector |
| 12/06/2001 | US20010049213 Electrical connector with floating terminals and terminal thereof |
| 12/06/2001 | US20010049212 Low profile connector for printed wire boards |
| 12/06/2001 | US20010049210 3.5 inch form factor compatible connector for 2.5 inch form factor disc drive |
| 12/06/2001 | US20010049209 Electrical connector with electrical shield having latch and mounting arms |
| 12/06/2001 | US20010049206 Electrical connector with compression contacts |
| 12/06/2001 | US20010049009 Halogen-free, flame-retardant insulating epoxy resin composition and circuit board comprising insulation layer formed thereof |
| 12/06/2001 | US20010048999 Reinforced flexible substrates and method therefor |
| 12/06/2001 | US20010048793 Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
| 12/06/2001 | US20010048592 Printed circuit board and electronic equipment using the board |
| 12/06/2001 | US20010048581 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 12/06/2001 | US20010048492 Liquid crystal display device and a method thereof |
| 12/06/2001 | US20010048287 Compact fast battery charger |
| 12/06/2001 | US20010048150 Compact, surface-mounting-type, electronic-circuit unit |
| 12/06/2001 | US20010048098 Conductive paste for the electrical industry and its use |