Patents for H05K 1 - Printed circuits (98,583)
01/2002
01/22/2002CA2077720C Process of forming electrical connections between conductive layers using thermosonic wire bonded bump vias and thick film techniques
01/17/2002WO2002005608A1 Method, apparatus and use of applying viscous medium on a substrate
01/17/2002WO2002005607A1 Method and apparatus for providing a substrate with viscous medium and use of jetting means for the correction of application errors
01/17/2002WO2002005606A2 Closed-grid bus architecture for wafer interconnect structure
01/17/2002WO2002005605A1 Carrier-foiled copper foil circuit, printed circuit board manufacturing method using the circuit, and printed circuit board
01/17/2002WO2002005604A1 Carrier-foiled composite copper foil, method for manufacturing printed circuit board with resistance circuit, and printed circuit board having resistance circuit
01/17/2002WO2002005603A1 Multichip module connected to flexible, film-like substrate
01/17/2002WO2002005440A2 Radio communication device having an in-situ strain sensor
01/17/2002WO2002005346A1 Electronic device with heat conductive encasing device
01/17/2002WO2002005297A1 Shielded flat cable
01/17/2002WO2002005294A1 Electrically conductive ink
01/17/2002WO2002005039A1 Drug delivery management system
01/17/2002WO2002003777A1 Method of producing plants, plant cultivating device, and light-emitting panel
01/17/2002WO2001050198A3 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
01/17/2002US20020007260 Check system for wiring structure of printed circuit board
01/17/2002US20020006742 Terminal box
01/17/2002US20020006515 Styrene-maleic anhydride copolymer and epoxy resin blend crosslinked with multifunctional amine compounds
01/17/2002US20020006503 Composite wiring board and manufacturing method thereof
01/17/2002US20020006040 Led luminaire with light control means
01/17/2002US20020006035 Compact electronic circuit unit having circulator, manufactured with high productivity
01/17/2002US20020006032 Low-profile registered DIMM
01/17/2002US20020006023 Conductive paste and ceramic electronic component
01/17/2002US20020005567 Electronic component, manufacturing method therefor, aggregate electronic component, mounting structure of electronic component, and electronic device
01/17/2002US20020005507 Conductive paste and printed wiring board using the same
01/17/2002US20020005498 Cream solder inspection method and apparatus therefor
01/17/2002US20020005296 Surface mount package for long lead devices
01/17/2002US20020005295 Multilayered circuit board and method for producing the same
01/17/2002US20020005292 Bump-attached wiring circuit board and method for manufacturing same
01/17/2002US20020005249 Method for producing copper-clad laminate
01/17/2002US20020005091 Method and equipment for removing insulation from a flat cable
01/17/2002US20020005086 High density
01/17/2002US20020004982 Method for producing a doublesided wiring board
01/17/2002DE10033352A1 Method of manufacturing electronic module or subassembly, has second conductor path connected via thermally plated-through regions to first conductor path
01/17/2002DE10031658A1 Microwave module comprising substrate with HF and LF layers forming distribution network structures, includes intervening insulating layer
01/17/2002DE10024676A1 Verfahren zum Bestimmen von Strömungsverhältnissen sowie Festplatine A method for determining flow conditions and hard board
01/17/2002DE10007967C2 Mehrschichtige Anordnung elektrischer Leiter mit integrierter Stromerfassung Multi-layered arrangement of electrical conductors with integrated current detection
01/16/2002EP1173051A1 Flexible printed wiring board and its production method
01/16/2002EP1172901A1 Vehicle having an electrical connection box and electrical connection box for use in the vehicle
01/16/2002EP1172882A2 Resonator
01/16/2002EP1172826A2 Flat cable and its manufacturing method
01/16/2002EP1172760A1 Antenna coil for IC card and manufacturing method thereof
01/16/2002EP1172401A2 Thin copper film directly bonded polyimide film and method of manufacturing the same
01/16/2002EP1172026A1 Electronic power module and method for making same
01/16/2002EP1171932A1 Memory module with offset notches for improved insertion and stability and memory module connector
01/16/2002EP1171516A1 Polymers having backbones with reactive groups employed in crosslinking as precursors to nanoporous thin film structures
01/16/2002EP1139104A9 Electrical conductor multilayer arrangement with integrated current detection
01/16/2002EP1082884B1 Method for producing wirings having solder bumps
01/16/2002EP1027753B1 Edge Interface electrical connector and radiotelephone
01/16/2002EP1025747B1 Printed circuit boards
01/16/2002EP1000529B1 Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards
01/16/2002EP0980322B1 Sensor circuit for automobiles
01/16/2002EP0966777B1 Electric subassembly
01/16/2002EP0784066B1 Hydrogenated ring-opening polymer
01/16/2002CN2472455Y Packing device for image sensor
01/16/2002CN1331802A Improving multi-chip module testability using poled-polymer interlayer dielectrics
01/16/2002CN1331490A Substrate, displaying device, mounting of substrate and IC chip and mounting bonding method
01/16/2002CN1331475A Conductive slurry and laminated electronic element using same
01/16/2002CN1331474A Conductive slurry and laminated ceramic electronic element
01/15/2002US6339197 Multilayer printed circuit board and the manufacturing method
01/15/2002US6339191 Prefabricated semiconductor chip carrier
01/15/2002US6339116 Forming mixture of polymer selected from lignin, crop oils, wood resins, tannins, polysaccharide resins, epoxy resin cross-linking agent, initiator and supplying energy to cause crosslinking
01/15/2002US6338936 Resin with ester group, unsaturated bond, generation of acid by exposure to acid and catalysis
01/15/2002US6338906 Sintering ceramic matrices and interconnecting pore structure
01/15/2002US6338893 Conductive paste and ceramic printed circuit substrate using the same
01/15/2002US6338767 Circuit component built-in module and method for producing the same
01/15/2002US6338631 Electrical coupler for detachable interconnection between a main unit and an external unit
01/15/2002CA2244868C Grafted thermoplastic elastomer barrier layer
01/15/2002CA2244137C Control device, especially for a motor vehicle
01/15/2002CA2233481C Integrated circuit device cooling structure
01/10/2002WO2002003769A1 Device and bridge card for a computer
01/10/2002WO2002003767A1 Multi-metal layer circuit
01/10/2002WO2002003766A2 Process for thick film circuit patterning
01/10/2002WO2002003764A1 Flexible printed circuit board and foldable cell phone terminal
01/10/2002WO2002003499A1 Radio communication device with integrated antenna, transmitter, and receiver
01/10/2002WO2002003422A2 Integrated circuits packaging system and method
01/10/2002WO2002003421A2 Semiconductor chip package with embedded capacitors
01/10/2002WO2002003397A2 Insulation material for use in high-frequency electronic parts
01/10/2002WO2001055823A3 Apparatus for providing regulated power to an integrated circuit
01/10/2002WO2001047015A3 Electronic component protection devices and methods
01/10/2002WO2001017011A3 Conductor track supporting layer for laminating inside a chip card, chip card comprising a conductor track supporting layer, and method for producing a chip card
01/10/2002US20020004893 Feedback system for accomodating different memory module loading
01/10/2002US20020004341 Board-cable connection structure
01/10/2002US20020004323 Right-angle type electrical connector
01/10/2002US20020004321 High frequency signal switching unit
01/10/2002US20020004320 Attaratus for socketably receiving interconnection elements of an electronic component
01/10/2002US20020004319 Terminating circuit module used in a computer system
01/10/2002US20020004177 Photosensitive resin composition
01/10/2002US20020004167 Device enclosures and devices with integrated battery
01/10/2002US20020004163 IC device, circuit board and IC assembly
01/10/2002US20020004132 Contact printable adhesive composition and methods of making thereof
01/10/2002US20020004125 Low loss material for the manufacture of PCB'S and antenna boards and a method for producing same
01/10/2002US20020004124 Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board
01/10/2002US20020004123 Having diarylamino substituted diaryl, triaryl or tetraaryl light emitting, electron transporting material; high performance and luminance
01/10/2002US20020004111 Hollow glass microspheres and process for their production
01/10/2002US20020003746 Memory address driver circuit
01/10/2002US20020003740 System for automatic generation of suitable voltage source on motherboard
01/10/2002US20020003715 Isolated converter
01/10/2002US20020003694 Vertical surface mount apparatus with thermal carrier
01/10/2002US20020003557 Ink-jet recording head, circuit board for ink-jet recording head, ink-jet recording head cartridge, and ink-jet recording apparatus
01/10/2002US20020003475 Control and communication system for components of electrical apparatus