| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/07/2002 | US20020014346 Mounting structure of semiconductor package |
| 02/07/2002 | US20020013997 Method of manufacture of integral low and high value resistors on a printed circuit board |
| 02/07/2002 | DE19931004C2 Chipmodul, insbesondere BGA-Package, mit einem Interconnect zur stressfreien Lötverbindung mit einer Leiterplatte Chip module, in particular BGA package, with an interconnect for stress-free soldered to a circuit board |
| 02/07/2002 | DE10052517A1 Transpondemodul und Verfahren zum Herstellen eines Transponders Transpondemodul and method for producing a transponder |
| 02/07/2002 | DE10034865A1 Optoelektronisches oberflächenmontierbares Modul Optoelectronic surface-mountable module |
| 02/07/2002 | DE10034615A1 Pluggable connector for electrical ribbon cable, has carrier body on to which is fixed a ribbon cable section to be contacted |
| 02/07/2002 | DE10000414C2 Verfahren zur stiftlosen versatzfreien Montage von Multilayer-Innenanlagen Method for pinless offset-free assembly of multilayer indoor plants |
| 02/06/2002 | EP1178714A2 Multilayer board and method for making the same |
| 02/06/2002 | EP1178713A2 Multilayered board and method for fabricating the same |
| 02/06/2002 | EP1178712A2 Structure with blended polymer conformal coating of controlled electrical resistivity |
| 02/06/2002 | EP1178594A2 Electronic apparatus provided with an electronic circuit substrate |
| 02/06/2002 | EP1178128A1 Method of forming chromium coated copper for printed circuit boards |
| 02/06/2002 | EP1178074A1 Prepreg, metal-clad laminate, and printed circuit board obtained from these |
| 02/06/2002 | EP1178072A2 Aromatic liquid-crystalline polyester solution composition |
| 02/06/2002 | EP1177870A2 A cutter wheel for forming scribe lines on brittle materials |
| 02/06/2002 | EP1177641A1 Energy conditioning circuit assembly |
| 02/06/2002 | EP1177614A1 Modular power supply for generating a high voltage dc output |
| 02/06/2002 | EP1001852A4 Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
| 02/06/2002 | CN1335045A Process for depositing conducting layer on substrate |
| 02/06/2002 | CN1334980A Multifunction connector system |
| 02/06/2002 | CN1334847A Polyimide/polyarylate resin compositions and mouldings thereof |
| 02/06/2002 | CN1334696A 电子电路组件 Electronic circuit assembly |
| 02/06/2002 | CN1334695A 电子电路组件 Electronic circuit assembly |
| 02/06/2002 | CN1334624A HF signal conversion apparatus |
| 02/06/2002 | CN1334569A 介电陶瓷组合物 The dielectric ceramic composition |
| 02/06/2002 | CN1334491A Method for forming pattern of non-photo-imaging ceramic strip |
| 02/06/2002 | CN1334291A Epoxy resin composition, laminated material and metal lamina laminate |
| 02/06/2002 | CN1334256A Insulation ceramic press block, ceramic laminal substrate and ceramic electronic device |
| 02/06/2002 | CN1334255A Insulation ceramic press block |
| 02/06/2002 | CN1078846C Polymeric film contg. silicone resin and clay and method for producing same |
| 02/05/2002 | US6344975 Modular backplane |
| 02/05/2002 | US6344974 Printed circuit board and method of producing same |
| 02/05/2002 | US6344973 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 02/05/2002 | US6344961 Multi-layer capacitator, wiring substrate, decoupling circuit, and high-frequency circuit |
| 02/05/2002 | US6344792 Method of manufacturing and testing an electronic device, and a electronic device |
| 02/05/2002 | US6344695 Semiconductor device to be mounted on main circuit board and process for manufacturing same device |
| 02/05/2002 | US6344684 Multi-layered pin grid array interposer apparatus and method for testing semiconductor devices having a non-pin grid array footprint |
| 02/05/2002 | US6344667 Wiring board with reduced radiation of undesired electromagnetic waves |
| 02/05/2002 | US6344613 Automobile electrical circuit assembly with transparent protective cover |
| 02/05/2002 | US6344609 Electronic unit effectively utilizing circuit board surface |
| 02/05/2002 | US6344308 Method of manufacturing a flexible circuit board |
| 02/05/2002 | US6344157 Polymeric resin, conductive filler, 8-hydroxyquinoline corrosion inhibitor |
| 02/05/2002 | US6344155 Electrically conductive adhesive composition, electrically conductive adhesive sheet and use thereof |
| 02/05/2002 | US6343940 Contact structure and assembly mechanism thereof |
| 02/05/2002 | CA2068326C Fluorinated poly(naphthyl ethers) |
| 01/31/2002 | WO2002009485A2 Flip chip package, circuit board thereof and packaging method thereof |
| 01/31/2002 | WO2002009133A1 Inverted board mounted electromechanical device |
| 01/31/2002 | WO2002008347A2 Resist ink composition |
| 01/31/2002 | WO2002007918A1 Paste filled with metal powder and metal products obtained with same |
| 01/31/2002 | WO2001076322A3 Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions |
| 01/31/2002 | WO2001072095A3 Polybutadiene and polyisoprene based theremosetting compositions and method of manufacture |
| 01/31/2002 | WO2001050614A3 System and method for high speed processing of turbo codes |
| 01/31/2002 | WO2001033630A3 Methods and compositions for detection and treatment of breast cancer, based on breast cancer-associated polypeptides |
| 01/31/2002 | US20020013443 Polybenzoxazole and crosslinking agent |
| 01/31/2002 | US20020013084 Terminal crimping method and terminal crimping apparatus |
| 01/31/2002 | US20020013083 Electric connecting terminal |
| 01/31/2002 | US20020013082 Electric connecting terminal |
| 01/31/2002 | US20020013017 Multilayer circuit component and method for manufacturing the same |
| 01/31/2002 | US20020012780 Multilayer lamination |
| 01/31/2002 | US20020012762 Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| 01/31/2002 | US20020012240 Emc characteristics of a printed circuit board |
| 01/31/2002 | US20020012239 Board-to-board electrical coupling with conductive band |
| 01/31/2002 | US20020012234 Semiconductor package |
| 01/31/2002 | US20020012140 Optical bus system and signal processor |
| 01/31/2002 | US20020012096 Manufacturing method for manufacturing electro-optical device, connection method for connecting terminals, electro-optical device, and electronic equipment |
| 01/31/2002 | US20020011918 Mounting structure for thermistor with positive resistance-to-temperature characteristic |
| 01/31/2002 | US20020011907 Multilayer ceramic device |
| 01/31/2002 | US20020011903 Resonator |
| 01/31/2002 | US20020011857 Test coupon in printed wiring board |
| 01/31/2002 | US20020011662 Packaging substrate and semiconductor device |
| 01/31/2002 | US20020011659 Insulating thick film composition, ceramic electronic device using the same, and electronic apparatus |
| 01/31/2002 | US20020011658 Surface-mounting type electronic circuit unit suitable for miniaturization |
| 01/31/2002 | US20020011596 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
| 01/31/2002 | US20020011484 Electric heating device, especially for use in motor vehicles |
| 01/31/2002 | US20020011353 Isolated flip chip or BGA to minimize interconnect stress due to thermal mismatch |
| 01/31/2002 | US20020011352 Electronic circuit unit that is suitable for miniaturization and excellent in high frequency characteristic |
| 01/31/2002 | US20020011351 Printed-wiring substrate and method for fabricating the same |
| 01/31/2002 | US20020011349 Circuit board and method of manufacturing a circuit board |
| 01/31/2002 | US20020011348 Flexible wiring boards and processes for producing flexible wiring board |
| 01/31/2002 | US20020011110 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor |
| 01/31/2002 | US20020011109 Acceleration sensor module |
| 01/31/2002 | DE10126002A1 Multilayered circuit board composite body used in the production of planar transformers and coils comprises two circuit boards joined by a composite foil |
| 01/31/2002 | DE10057647A1 Gehäusestruktur für CCD-Chip Housing structure for CCD chip |
| 01/31/2002 | DE10042350C1 Ceramic material used in the electrical industry e.g. for producing dielectric resonators contains two different components having a perovskite structure containing silver on the A sites and niobium and tantalum on the B sites |
| 01/30/2002 | EP1176683A2 Vehicle power distributor and method of connecting control circuit board to vehicle power distributor |
| 01/30/2002 | EP1176661A1 Resonant capacitive coupler |
| 01/30/2002 | EP1176641A2 Front-and-back electrically conductive substrate and method for manufacturing same |
| 01/30/2002 | EP1176239A1 Glass cloth and printed wiring board |
| 01/30/2002 | EP1176172A1 Epoxy resin composition, prepreg and metal-clad laminate |
| 01/30/2002 | EP1176000A1 Carrier foil-pasted metal foil and production method thereof |
| 01/30/2002 | EP1175816A1 Method and device for placing components on substrates, and corresponding substrate |
| 01/30/2002 | EP1175712A1 Printed circuit board connector |
| 01/30/2002 | EP1175710A1 Wireless article including a plural-turn loop antenna |
| 01/30/2002 | EP1175693A1 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 01/30/2002 | EP0974249B1 Process for producing printed circuits and printed circuits thus obtained |
| 01/30/2002 | EP0968629B1 Flat assembly and method for post-assembling additional components on a printed circuit board |
| 01/30/2002 | CN1333997A Printed circuit assembly having locally enhanced wiring density |
| 01/30/2002 | CN1333995A Embedded energy storage device |
| 01/30/2002 | CN1333920A Liimnate for multi-layer printed circuit |
| 01/30/2002 | CN1333649A Duplicated material and making method thereof, and distribution substrate made of same |