| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/05/2002 | US6353379 Magnetic device employing a winding structure spanning multiple boards and method of manufacture thereof |
| 03/05/2002 | US6353190 Lattice-shaped circuit board |
| 03/05/2002 | US6353189 Wiring board, wiring board fabrication method, and semiconductor package |
| 03/05/2002 | US6353188 Printed circuit assembly with flexible support |
| 03/05/2002 | US6353182 Proper choice of the encapsulant volumetric CTE for different PGBA substrates |
| 03/05/2002 | US6352914 Interleaved signal trace routing |
| 03/05/2002 | US6352782 Reacting a polyphenylene ether containing hydroxy groups that have been capped with a compound containing ethylenically unsaturation with a curable unsaturated monomer capable of reacting with ethylenically unsaturated compound |
| 03/05/2002 | US6352434 High density flexible circuit element and communication device using same |
| 03/05/2002 | US6352317 Solenoid coil structure and interconnection |
| 03/05/2002 | US6352203 Automated semiconductor identification system |
| 03/05/2002 | US6352025 Solder printing apparatus |
| 03/05/2002 | US6352014 Method for making punches using multi-layer ceramic technology |
| 03/05/2002 | US6351885 Method of making conductive bump on wiring board |
| 03/05/2002 | US6351884 Process for manufacturing printed circuit boards and process for connecting wires thereto |
| 03/05/2002 | US6351880 Method of forming multi-chip module having an integral capacitor element |
| 03/05/2002 | US6351871 Aqueous quaternary ammonium hydroxide as a screening mask cleaner |
| 03/05/2002 | CA2238778C Hardenable photoimageable compositions |
| 03/05/2002 | CA2055982C Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates |
| 02/28/2002 | WO2002017692A1 High capacity memory module with higher density and improved manufacturability |
| 02/28/2002 | WO2002017502A1 Radio transmitting/receiving device |
| 02/28/2002 | WO2002017442A2 Communication connector with inductive compensation |
| 02/28/2002 | WO2002017438A1 Interposer for use in electronic packages |
| 02/28/2002 | WO2002017437A1 Communication line separator |
| 02/28/2002 | WO2002017435A2 A shielded carrier for land grid array connectors and a process for fabricating same |
| 02/28/2002 | WO2002017328A1 Low profile, high density memory system |
| 02/28/2002 | WO2002017053A1 Connector receptacle |
| 02/28/2002 | WO2002016475A2 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate |
| 02/28/2002 | WO2002016473A1 Polyimides for high-frequency applications |
| 02/28/2002 | WO2002016257A2 Polymer-wrapped single wall carbon nanotubes |
| 02/28/2002 | WO2002016129A1 Copper-clad laminate |
| 02/28/2002 | WO2001086770A3 Molded buss bar system |
| 02/28/2002 | WO2001080387A3 Over-voltage protection for electronic circuits |
| 02/28/2002 | WO2001075970A3 Element and method for connecting constituents of an electronic assembly |
| 02/28/2002 | WO2001070843A3 High molecular weight epoxy resin and resinous composition for printed circuit board |
| 02/28/2002 | US20020026109 Low-noise optical probes |
| 02/28/2002 | US20020025724 Low inductance power connector and method of reducing inductance in an electrical connector |
| 02/28/2002 | US20020025699 Electrical connector housing |
| 02/28/2002 | US20020025439 Dielectric ceramic composition and multi layered ceramic substrate |
| 02/28/2002 | US20020025148 FPC (flexible printed circuit) board arrangement structure for zoom lens barrels |
| 02/28/2002 | US20020024833 Memory module for preventing skew between bus lines |
| 02/28/2002 | US20020024802 Connection structure for display module and printed substrate, semiconductor device, display module, and elecronic component |
| 02/28/2002 | US20020024801 Integrated circuit pakage substrate integrating with decoupling capacitor |
| 02/28/2002 | US20020024302 Plasma display panel with an auxiliary bonding pad |
| 02/28/2002 | US20020024138 Wiring board for high dense mounting and method of producing the same |
| 02/28/2002 | US20020024120 Power module |
| 02/28/2002 | US20020024025 Semiconductor parts and semiconductor mounting apparatus |
| 02/28/2002 | US20020023906 Method of producing through-hole in aromatic polyimide film |
| 02/28/2002 | US20020023779 Pre-patterned substrate layers for being personalized as needed |
| 02/28/2002 | US20020023778 Printed wiring board having via and method of manufacturing the same |
| 02/28/2002 | US20020023776 Enhanced surface laminar circuit board |
| 02/28/2002 | US20020023775 Sequentially processed circuitry |
| 02/28/2002 | US20020023773 Method for manufacturing raised electrical contact patten of controlled geometry |
| 02/28/2002 | US20020023765 Electronic device sealing electronic element therein and manufacturing method thereof, and printed wiring board suitable for such electronic device |
| 02/28/2002 | US20020023344 Printed circuit board manufacturing method |
| 02/28/2002 | US20020023341 Method for producing a microelectronic component of sandwich construction |
| 02/28/2002 | DE10100823C1 Sealed chamber for electronic control unit integrated into vehicle engine or gearbox, is based on dished panel with sealed, flexible printed circuit lead-in and adhered covering |
| 02/27/2002 | EP1182919A2 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus |
| 02/27/2002 | EP1182913A1 High speed circuit board interconnection |
| 02/27/2002 | EP1182790A2 Front end module for mobile communications apparatus |
| 02/27/2002 | EP1182768A2 Power converter assembly |
| 02/27/2002 | EP1182749A1 Hinge connector extensible to a longitudinal direction |
| 02/27/2002 | EP1182737A1 Electrical connector housing |
| 02/27/2002 | EP1182659A1 Magnetic tape cassette |
| 02/27/2002 | EP1182574A2 Computer system absent a parallel system bus |
| 02/27/2002 | EP1182278A2 Manufacturing method of electrodeposited copper foil and electrodeposited copper foil |
| 02/27/2002 | EP1182222A1 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate |
| 02/27/2002 | EP1181848A1 Ultraviolet curable silver composition and related method |
| 02/27/2002 | EP1181566A1 Testing fastenings of printed circuit board |
| 02/27/2002 | EP1181535A1 Method and apparatus for inspecting solder paste deposits on substrates |
| 02/27/2002 | EP0925177A4 A reinforcement mat |
| 02/27/2002 | EP0783759B1 Multi-layer electrical circuit board |
| 02/27/2002 | EP0731992B1 High-density interconnect technique |
| 02/27/2002 | CN2479712Y Sectional glued flexible printed circuit board |
| 02/27/2002 | CN2479709Y Multi-layer circuit board |
| 02/27/2002 | CN1338196A An electronic circuit board, an arrangement comprising an insulating material and an electric circuit board |
| 02/27/2002 | CN1338195A Flexible microsystem and building techniques |
| 02/27/2002 | CN1338119A Apparatus and method for an integrated circuit having high Q reactive components |
| 02/27/2002 | CN1337843A Master-board device for module mounting |
| 02/27/2002 | CN1337842A Electronic device |
| 02/27/2002 | CN1337759A Radio-frequency signal output module with radio-frequency power amplifier and isolation elements |
| 02/27/2002 | CN1337475A Method for making electrodeposited cooper foil and electrodeposited cooper foil |
| 02/27/2002 | CN1337312A Flexible metal laminated body and producing method thereof |
| 02/27/2002 | CN1337298A Scriber wheel for brittle base-board |
| 02/27/2002 | CN1080082C 印刷电路板 A printed circuit board |
| 02/26/2002 | US6351827 Voltage and clock margin testing of memory-modules using an adapter board mounted to a PC motherboard |
| 02/26/2002 | US6351393 Electronic package for electronic components and method of making same |
| 02/26/2002 | US6351392 Offset array adapter |
| 02/26/2002 | US6351391 Signal busses on printed board structures mounting ASIC chips with signal termination resistor devices using planar signal terminating devices |
| 02/26/2002 | US6351386 Component shim for mounting a component on a heat spreader |
| 02/26/2002 | US6351369 Multi-layer capacitor, wiring substrate, decoupling circuit, and high-frequency circuit |
| 02/26/2002 | US6351352 Separably bondable shunt for wireless suspensions |
| 02/26/2002 | US6351348 Minimal stiffness conductors for a head gimbal assembly |
| 02/26/2002 | US6351195 High frequency circuit device, antenna-sharing device, and communication apparatus having spaced apart ground electrodes |
| 02/26/2002 | US6351194 Electronic component utilizing face-down mounting |
| 02/26/2002 | US6351031 Semiconductor device and method for manufacturing substrate of the same |
| 02/26/2002 | US6351026 Multilayered wiring structure and method of manufacturing the same |
| 02/26/2002 | US6350844 Polyimide film and electric/electronic equipment bases with the use thereof |
| 02/26/2002 | US6350134 Electrical connector having triad contact groups arranged in an alternating inverted sequence |
| 02/26/2002 | US6349456 Method of manufacturing photodefined integral capacitor with self-aligned dielectric and electrodes |
| 02/21/2002 | WO2002015652A1 Flexible wiring board for front-back connection |