| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/10/2002 | US20020003377 Vehicle having an electrical connection box and electrical connection box for use in the vehicle |
| 01/10/2002 | US20020003304 Semiconductor device having multilevel interconnection |
| 01/10/2002 | US20020003303 Multi-layer interconnect |
| 01/10/2002 | US20020003298 High frequency package, wiring board, and high frequency module |
| 01/10/2002 | US20020003293 Semiconductor device and method for fabricating same |
| 01/10/2002 | US20020003261 Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed |
| 01/10/2002 | US20020003160 Components with conductive solder mask layers |
| 01/10/2002 | US20020003127 Method of manufacturing wireless suspension blank |
| 01/10/2002 | US20020003049 Inline and "Y" input-output bus topology |
| 01/10/2002 | US20020002771 Method for making a planar inductor/transformer in a laminated printed circuit board |
| 01/10/2002 | DE19927795C2 Leiterplatte für eine Schaltunsanordnung PCB for a Schaltunsanordnung |
| 01/10/2002 | DE19612760C2 Trägerplatte und Druckkopf mit dieser Trägerplatte Support plate and pressure head with this carrier plate |
| 01/10/2002 | DE10129032A1 HF-Modul RF module |
| 01/10/2002 | DE10122929A1 Solid-state imaging apparatus has solid-state imaging element mounted on one surface and frame mounted on other surface of flexible printed circuit board |
| 01/10/2002 | DE10031940A1 Conductive foil circuit board for flexible circuit board in motor vehicles, has electric conductor tracks and covering layers |
| 01/10/2002 | DE10029925C1 Leiterplattensteckverbindung PCB plug-in connection |
| 01/10/2002 | DE10029630A1 Device for protection of electronic modules from electrostatic discharge by provision of leads with stepped surge impedances |
| 01/09/2002 | EP1170983A1 Circuit forming board and method of manufacturing circuit forming board |
| 01/09/2002 | EP1170886A2 Control and communication system for components of electrical apparatus |
| 01/09/2002 | EP1170797A2 Thin-film capacitor element and electronic circuit board on which thin-film capacitor element is formed |
| 01/09/2002 | EP1170796A2 High frequency carrier with an adapted interconnect structure |
| 01/09/2002 | EP1170795A2 Electronic component with side contacts and associated method of fabrication |
| 01/09/2002 | EP1170400A1 Electrolytic copper foil with carrier foil and method for manufacturing the same |
| 01/09/2002 | EP1170110A1 Method for fabricating a plastic coated conductive structure of an electrical circuit unit as well as an electrical circuit unit comprising a plastic coated conductive structure |
| 01/09/2002 | EP1169895A1 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 01/09/2002 | EP1169892A1 Parallel expansion local bus interface card-type i, ii & iii |
| 01/09/2002 | EP1169891A1 Flexible microsystem and building techniques |
| 01/09/2002 | EP1169775A1 Predistortion generator coupled with an rf amplifier |
| 01/09/2002 | EP1169736A1 Power semiconductor module |
| 01/09/2002 | EP1169718A1 An arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming |
| 01/09/2002 | CN2471058Y Improved packaging device of image sensor |
| 01/09/2002 | CN1330856A Resonant type with conductive composition closing a electrical circuit |
| 01/09/2002 | CN1330508A Method for detecting absence of electronic elements on PCB |
| 01/09/2002 | CN1330435A Connecting component and its assembling mechanism |
| 01/09/2002 | CN1330432A Printed circuit connector |
| 01/09/2002 | CN1330403A Polymer-ceramic composite electronic substrate |
| 01/09/2002 | CN1329956A Tungsten-copper composite powder |
| 01/09/2002 | CN1329955A Tungsten-copper composite powder |
| 01/09/2002 | CN1077480C Product vending system with pneumatic product delivery |
| 01/08/2002 | US6337880 Indexing for motion video that is compressed using interframe and intraframe techniques |
| 01/08/2002 | US6337798 Digital circuit decoupling for EMI reduction |
| 01/08/2002 | US6337512 Semiconductor module |
| 01/08/2002 | US6337463 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 01/08/2002 | US6337375 High optical contrast resin composition and electronic package utilizing same |
| 01/08/2002 | US6337363 Epoxy resin composition with non-halogen, non-phosphorus flame retardant |
| 01/08/2002 | US6337228 Low-cost printed circuit board with integral heat sink for semiconductor package |
| 01/08/2002 | US6337123 Multilayered ceramic substrate and method of producing the same |
| 01/08/2002 | US6337037 Printed wiring board conductive via hole filler having metal oxide reducing capability |
| 01/08/2002 | US6337028 Process of forming a pattern on a substrate |
| 01/08/2002 | US6336829 Electrical connector free from soldering contamination |
| 01/08/2002 | US6336827 Balanced-transmission cable-and-connector unit |
| 01/08/2002 | US6336815 Connector for sending power to an IC-chip thru two pressed joints in series |
| 01/08/2002 | US6336269 Method of fabricating an interconnection element |
| 01/08/2002 | US6336262 Process of forming a capacitor with multi-level interconnection technology |
| 01/08/2002 | CA2241530C Conductive elastomers and methods for fabricating the same |
| 01/08/2002 | CA2230256C Method for producing electrodeposited copper foil and copper foil obtained by same |
| 01/03/2002 | WO2002001931A1 Multilayer substrate module and portable wireless terminal |
| 01/03/2002 | WO2002001928A1 Vialess printed circuit board |
| 01/03/2002 | WO2002001639A2 Substrate and module |
| 01/03/2002 | WO2002001636A1 Process for the manufacture of printed circuit boards with plated resistors |
| 01/03/2002 | WO2002000791A1 Epoxy resin composition and cured object obtained therefrom |
| 01/03/2002 | WO2000008071A8 Melt-processible poly(tetrafluoroethylene) |
| 01/03/2002 | US20020002038 Mobile communications device power amplifier module and mobile communications device terminal and mobile communications device base station |
| 01/03/2002 | US20020002012 Board connecting connector |
| 01/03/2002 | US20020002007 Board terminal and method of producing same |
| 01/03/2002 | US20020002004 Balanced-transmission cable-and-connector unit |
| 01/03/2002 | US20020001984 Electrical connection method and connection site |
| 01/03/2002 | US20020001879 Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components |
| 01/03/2002 | US20020001872 Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package |
| 01/03/2002 | US20020001747 Solid state electronics |
| 01/03/2002 | US20020001746 Low-temperature fabrication of thin-film energy-storage devices |
| 01/03/2002 | US20020001712 Electronic component, method for producing electronic component, and circuit board |
| 01/03/2002 | US20020001216 Semiconductor device and process for manufacturing the same |
| 01/03/2002 | US20020001179 Standardized test board for testing custom chips |
| 01/03/2002 | US20020001177 Power module having electronic power components, and a method of manufacturing such a module |
| 01/03/2002 | US20020001161 Method and apparatus for mounting printed circuit board components |
| 01/03/2002 | US20020001160 Overvoltage protection device |
| 01/03/2002 | US20020000906 Resistor array board |
| 01/03/2002 | US20020000902 Connecting structure and frequency adjusting method therein |
| 01/03/2002 | US20020000901 Multilayer type printed-wiring board and method of manufacturing multilayer type printed-wiring board |
| 01/03/2002 | US20020000895 Electronic component utilizing face-down mounting |
| 01/03/2002 | US20020000652 Board on chip ball grid array |
| 01/03/2002 | US20020000331 Method for making an electronic circuit assembly |
| 01/03/2002 | US20020000328 Printed wiring board and manufacturing method thereof |
| 01/03/2002 | US20020000034 Continuous processing of thin-film batteries and like devices |
| 01/03/2002 | DE10102848A1 Adhesion of electronic circuit carriers e.g. circuit boards to heat sink using double-sided adhesive film, by applying isostatic pressure via fluid in pressure chamber |
| 01/03/2002 | DE10035175C1 Making electrical/mechanical connection between flexible thin film substrates involves positioning substrates so openings coincide, positioning bonding elements, pressing together |
| 01/03/2002 | DE10029289A1 Verbindungsanordnung aus elektrischen/elektronischen Bauelementeträgern Joint assembly of electrical / electronic components makers |
| 01/03/2002 | DE10026743C1 Substrat zur Aufnahme einer Schaltungsanordnung Substrate for receiving a circuit arrangement |
| 01/02/2002 | EP1168906A1 Power module with electronic power components and production method thereof |
| 01/02/2002 | EP1168901A2 Multilayer printed circuit board laminate and process for manufacturing the same |
| 01/02/2002 | EP1168898A2 Mobile communications device power amplifier module, mobile communications device terminal equipment and mobile communications device base station |
| 01/02/2002 | EP1168897A2 Foil printed circuit board and process for manufacturing and mounting the same |
| 01/02/2002 | EP1168526A2 Connector for a printed circuit board |
| 01/02/2002 | EP1168511A2 Electrical circuit connector with support |
| 01/02/2002 | EP1168481A2 High frequency signal switching unit |
| 01/02/2002 | EP1168445A1 Integrated circuit |
| 01/02/2002 | EP1168441A2 Multi-layer wiring substrate and semiconductor device using the multi-layer wiring substrate |
| 01/02/2002 | EP1168436A2 Polymer and ceramic composite electronic substrates |
| 01/02/2002 | EP1168429A1 Integrated circuit chip and method for mounting an integrated circuit chip to a circuit board |