| Patents for H05K 1 - Printed circuits (98,583) |
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| 03/12/2002 | US6356449 Flexible printed circuit board mounting structure and recording/reproducing device using the same |
| 03/12/2002 | US6356448 Inter-circuit encapsulated packaging for power delivery |
| 03/12/2002 | US6356447 Surface mounted conduction heat sink |
| 03/12/2002 | US6356333 Conductive adhesive with conductive particles, mounting structure, liquid crystal device and electronic device using the same |
| 03/12/2002 | US6356234 Electrical circuit |
| 03/12/2002 | US6356182 Planar EMI inductor |
| 03/12/2002 | US6356173 High-frequency module coupled via aperture in a ground plane |
| 03/12/2002 | US6356166 Multi-layer switched line phase shifter |
| 03/12/2002 | US6356002 Electrical slip ring having a higher circuit density |
| 03/12/2002 | US6355764 Prepared from dihalodiphenyl sulfone, aromatic dihydroxyphenyl compound, dihydroxybenzoic acid and inorganic soda; further reacting carboxyl-terminated polymer with acrylic epoxy propylene ester; heat resistance |
| 03/12/2002 | US6355504 Electrical interconnections, methods of conducting electricity, and methods of reducing horizontal conductivity within an anisotropic conductive adhesive |
| 03/12/2002 | US6355364 Providing a section of copper-invar-copper clad sheet; annealing |
| 03/12/2002 | US6355357 Rust resistant polyimide insulating layer |
| 03/12/2002 | US6355324 Multiple coated substrates |
| 03/12/2002 | US6355316 Device for protecting electronic circuits from unauthorized access |
| 03/12/2002 | US6355187 Conductive paste and glass circuit substrate |
| 03/12/2002 | US6355131 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 03/12/2002 | US6354871 Connector-mounted substrate and method for assembling the same |
| 03/12/2002 | US6354868 Vehicle power distribution box |
| 03/12/2002 | US6354484 Process for producing a metal-ceramic composite substrate |
| 03/12/2002 | US6354000 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 03/12/2002 | US6353999 Method of making mechanical-laser structure |
| 03/11/2002 | CA2356994A1 Bridging board |
| 03/07/2002 | WO2002019784A1 Sequentially processed circuitry |
| 03/07/2002 | WO2002019782A1 Collective method for flush filling of through holes in a substrate |
| 03/07/2002 | WO2002019430A2 Hybrid substrate with embedded capacitors and methods of manufacture |
| 03/07/2002 | WO2002019349A1 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly |
| 03/07/2002 | WO2002018493A1 Curable resin composition |
| 03/07/2002 | WO2002018469A1 Epoxy resin mixture with a phosphor-modified epoxy resin |
| 03/07/2002 | WO2002018313A1 Oxetane-modified compounds and photocuring compounds derived therefrom, processes for preparation of both and curing compositions contaning the photocuring compounds |
| 03/07/2002 | WO2002018294A1 Dielectric ceramic material that contains silver, niobium and tantalate |
| 03/07/2002 | WO2001054232A3 Flexible compliant interconnect assembly |
| 03/07/2002 | US20020029364 System and method for high speed processing of turbo codes |
| 03/07/2002 | US20020028906 Terephthalic acid, 2,6- naphthalenedicarboxylic acid, hydroquinone, and p-hydroxybenozic acid monomers; molding materials |
| 03/07/2002 | US20020028622 Glass woven fabric and laminate for printed wiring board |
| 03/07/2002 | US20020028600 Wiring harness and manufacturing method of the same |
| 03/07/2002 | US20020028595 Method for assembling integral type electronic component and integral type electronic component |
| 03/07/2002 | US20020028591 Electrical connection box for a vehicle |
| 03/07/2002 | US20020028590 Junction box |
| 03/07/2002 | US20020028589 High-density electrical interconnect system |
| 03/07/2002 | US20020028588 Board connecting terminal and connector using the terminal |
| 03/07/2002 | US20020028530 High-frequency module and manufacturing method of the same |
| 03/07/2002 | US20020028525 Method for manufacturing circuit devices |
| 03/07/2002 | US20020028410 Process for patterning non-photoimagable ceramic tape |
| 03/07/2002 | US20020028337 Forming laminate; curing; cladding with copper; printed circuits |
| 03/07/2002 | US20020028284 Method to embed passive components |
| 03/07/2002 | US20020028048 Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
| 03/07/2002 | US20020028045 Optical coupling structures and the fabrication processes |
| 03/07/2002 | US20020027996 Disposable modular hearing aid |
| 03/07/2002 | US20020027788 DC-to-DC converter providing high current and low voltage |
| 03/07/2002 | US20020027773 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 03/07/2002 | US20020027760 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 03/07/2002 | US20020027634 Liquid crystal display device having a flexible circuit board |
| 03/07/2002 | US20020027531 Circuit module |
| 03/07/2002 | US20020027466 Semiconductor integrated circuit and an electronic apparatus incorporating a multiplicity of semiconductor integrated circuits |
| 03/07/2002 | US20020027282 Composite monolithic electronic component |
| 03/07/2002 | US20020027276 Circuit device and method of manufacturing the same |
| 03/07/2002 | US20020027265 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 03/07/2002 | US20020027127 Method of manufacturing wireless suspension blank |
| 03/07/2002 | US20020027022 Front-and-back electrically conductive substrate and method for manufacturing same |
| 03/07/2002 | US20020027021 Printed circuit board with reduced crosstalk noise and method of forming wiring lines on a board to form such a printed circuit board |
| 03/07/2002 | US20020027020 Through-hole structure and printed circuit board including the through-hole structure |
| 03/07/2002 | US20020027018 Insulative ceramic compact |
| 03/07/2002 | US20020027011 Multi-chip module made of a low temperature co-fired ceramic and mounting method thereof |
| 03/07/2002 | US20020026980 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 03/07/2002 | US20020026978 Multilayer ceramic substrate and manufacturing method therefor |
| 03/07/2002 | US20020026876 Printing of a conductive coating on an electric unit |
| 03/07/2002 | US20020026709 Manufacture of a wiring loom |
| 03/07/2002 | US20020026703 Method for mounting parts, and IC card and manufacturing method thereof |
| 03/07/2002 | DE10139071A1 Wandlervorrichtung Conversion device |
| 03/07/2002 | DE10041770A1 Microwave module comprising substrate with HF and LF layers forming distribution network structures, includes intervening insulating layer |
| 03/07/2002 | DE10039707A1 Energieversorgungseinheit zur Übertragung von Hilfsenergie für eine elektrische Anordnung Power supply unit for transfer of power supply for an electrical assembly |
| 03/07/2002 | DE10037818A1 Process for structuring unburned layers used in high frequency switches comprises preparing a layer succession of two layers, and structuring at least one of the layers on the outer side of the succession using a photosensitive layer |
| 03/06/2002 | EP1185153A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185151A1 Surface treated copper foil and method for preparing the same and copper-clad laminate using the same |
| 03/06/2002 | EP1185057A2 Connection structure for connecting a display module and a printed substrate by using a semiconductor device |
| 03/06/2002 | EP1184979A2 Radio frequency module parts including surface elastic wave elements and manufacturing method thereof |
| 03/06/2002 | EP1184905A1 Power feed and heat dissipating device for power semiconductor devices |
| 03/06/2002 | EP1184882A1 Conductor pattern built in multilayer board, multilayer board having built-in conductor pattern, and method of manufacturing multilayer board |
| 03/06/2002 | EP1184881A2 Conductive paste |
| 03/06/2002 | EP1184407A1 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate |
| 03/06/2002 | EP1184165A1 Electrolytic copper foil with carrier foil and copper-clad laminate using the electrolytic copper foil |
| 03/06/2002 | EP1183920A1 Insulation barrier on a printed circuit board |
| 03/06/2002 | EP1183916A1 Sandwich-structured intelligent power module |
| 03/06/2002 | EP1183905A2 Mounting of the coil in an electroacoustic transducer |
| 03/06/2002 | EP1183754A1 Variable capacitance coupling antenna |
| 03/06/2002 | EP1183462A1 Integrated powertrain control system for large engines |
| 03/06/2002 | EP1183294A1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 03/06/2002 | EP1112676B1 Method and device for processing substrates |
| 03/06/2002 | EP0993677B1 Thermal release for fixing on a circuit substrate |
| 03/06/2002 | EP0902977B1 Surface mount package with heat transfer feature |
| 03/06/2002 | CN1339243A Wiring board, semiconductor device and method of producing, testing and packaging the same, and circuit board and electronic equipment |
| 03/06/2002 | CN1339097A Remote controller for air conditioner |
| 03/06/2002 | CN1338890A Electronic elements and manufacture thereof |
| 03/06/2002 | CN1338880A Photoelectric device and electronic apparatus |
| 03/06/2002 | CN1080530C Miniature speeching body |
| 03/05/2002 | US6353540 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board. |
| 03/05/2002 | US6353539 Method and apparatus for matched length routing of back-to-back package placement |
| 03/05/2002 | US6353431 Surface mount pointing device having signal conditioning components |
| 03/05/2002 | US6353420 Wireless article including a plural-turn loop antenna |