Patents for H05K 1 - Printed circuits (98,583)
12/2001
12/25/2001US6333469 Wafer-scale package structure and circuit board attached thereto
12/25/2001US6333468 Flexible multi-layered printed circuit cable
12/25/2001US6333467 Flexible printed wiring board
12/25/2001US6333466 Flexible wiring board
12/25/2001US6333384 Vinyl-terminated polybutadiene and butadiene-styrene copolymers containing urethane and/or ester residues, and the electrical laminates obtained therefrom
12/25/2001US6333210 Process of ensuring detect free placement by solder coating on package pads
12/25/2001US6333139 Providing polyimide precursor solution comprising a polyimide precursor and photosensitive agent on a long stainless steel foil; further providing conductor layer formed by laminating copper layer via chromium layer or titanium layer or directly
12/25/2001US6333136 Carrier film and process for producing the same
12/25/2001US6332783 Circuit module having connectors, and electronic apparatus incorporating the circuit module
12/25/2001US6332782 Spatial transformation interposer for electronic packaging
12/25/2001US6332677 Stable substrate structure for a wide swath nozzle array in a high resolution inkjet printer
12/25/2001US6332359 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor
12/25/2001US6332269 Component alignment methods
12/25/2001CA2069405C Quarternary ammonium polyarylamides, articles of manufacture formed therefrom, and processes for the preparation thereof
12/23/2001CA2351106A1 Power module with electronic power components and process for manufacturing such a module
12/20/2001WO2001097583A2 Molded electronic assembly
12/20/2001WO2001097581A1 Connector arrangement made from electrical/electronic component supports
12/20/2001WO2001097578A1 Method for preparing substrate for flexible print wiring board and substrate for flexible print wiring board
12/20/2001WO2001097577A1 Printed circuit board
12/20/2001WO2001097572A1 Electronic ballast for a discharge lamp
12/20/2001WO2001097234A1 Polytetrafluoroethylene mixed powder for insulation use in product for transmission of high frequency signal and product for transmission of high frequency signal using the same
12/20/2001WO2001096990A2 Usb-compliant personal key using a smartcard processor and a smartcard reader emulator
12/20/2001WO2001096781A1 Small portable flashlight
12/20/2001WO2001096440A1 Epoxy resin composition and laminate using the same
12/20/2001WO2001022489A3 Control device, particularly for use in automotive engineering
12/20/2001US20010053820 Blend of polyphenylene ether, styrene compound and acrylic ester
12/20/2001US20010053616 Method and an apparatus for manufacturing multilayer electronic part
12/20/2001US20010053565 Method and apparatus for edge connection between elements of an integrated circuit
12/20/2001US20010053488 Automated, flow-through, dual side, laser direct imaging process and apparatus which provides capability to simultaneously register and image both sides of substrate in continuous flow-through process
12/20/2001US20010053487 Automated, flow-through, dual side, laser direct imaging process and apparatus which provides capability to simultaneously register and image both sides of substrate in continuous flow-through process
12/20/2001US20010053450 Poly (phenylene ether) - polyvinyl thermosetting resin
12/20/2001US20010053448 Thermosetting resin composition
12/20/2001US20010053447 Method of producing prepreg for printed wiring boards, glass fiber material treated with silicone oligomer, and laminate for printed wiring boards
12/20/2001US20010053408 Casting mixtures comprising granular and dispersion fluoropolymers
12/20/2001US20010053187 Symbol-based signaling device for an elctromagnetically-coupled bus system
12/20/2001US20010053076 Connector arrangement for an electro-luminescent lighting element and night-light using such an arrangement
12/20/2001US20010053069 Multiple channel modules and bus systems using same
12/20/2001US20010053068 Electronic circuit device
12/20/2001US20010053063 Surface mounted conduction heat sink
12/20/2001US20010053040 Index signal output device and floppy disk drive
12/20/2001US20010052958 Electrode structure of display panel and electrode forming method
12/20/2001US20010052829 Inline and "Y" input-output bus topology
12/20/2001US20010052637 Memory modules including capacity for additional memory
12/20/2001US20010052467 Making thermally stable electromagnetic coil vanes, by photolithographically exposing high resolution, dense wire patterns in copper on both sides of ceramic substrate, plating additional copper and firing to eutectically bond
12/20/2001US20010052425 Printed circuit board and method of manufacturing the same
12/20/2001US20010052422 Structure for supporting connecting member
12/20/2001US20010052183 Printed-wiring substrate and method for fabricating the same
12/20/2001DE10129282A1 Integrated circuit modules connection method involves connecting interlocking edge, by aligning teeth and recesses of edge of integrated circuit with adjacent edge
12/20/2001DE10127773A1 Capacitor module for inverter has switching module attached to lower substrate of stack on which ceramic capacitors are mounted
12/20/2001DE10121902A1 Memory module has data buses with which memory components are connected extending from contact strips on front side of module through module to contact strips on rear side of module
12/20/2001DE10029094A1 SMD-cooler esp. for thermal LSI-circuits, has metal layers and sacrificial layer arranged alternatively over one another
12/20/2001DE10025279A1 Determining network conductor position while minimizing crosstalk radiation involves signal classification for conductor in noise inducing network according to relevance to radiation
12/19/2001EP1164823A2 Printed circuit board and method of manufacturing the same
12/19/2001EP1164661A2 Connecting structure of flat circuit member
12/19/2001EP1164621A2 Electrode structure of display panel and electrode forming method
12/19/2001EP1164335A1 Remote controller for air conditioner
12/19/2001EP1163828A1 An arrangement relating to conductor carriers and methods for the manufacture of such carriers
12/19/2001EP1163826A1 Circuit board printer
12/19/2001EP1163825A1 Method for producing circuit arrangements
12/19/2001EP1163474A1 Compact, flexible, led array
12/19/2001EP1163389A1 Visible and fluorescent dye containing laminate materials
12/19/2001EP1163292A2 Electrically conductive flexible composition, methods of making same
12/19/2001EP0935526A4 Metal ceramic composites with improved interfacial properties
12/19/2001EP0914697B1 Assembly of connector and printed circuit board
12/19/2001EP0727045B1 Self-addressable self-assembling microelectronic systems and devices for molecular biological analysis and diagnostics
12/19/2001CN1327710A Multilayer printed wiring board and method of producing multilayer printed wiring board
12/19/2001CN1327570A Electrooptic device, method for manufacturing electrooptic device, and electronic apparatus
12/19/2001CN1327489A Electrolytic copper foil with carrier foil and method for manufacturing the same and copper-clad laminate using the electrolytic copper foil with carrier foil
12/19/2001CN1327234A Address changing signal input device and soft disc driver
12/19/2001CN1326853A Laminated board
12/19/2001CN1326837A Laser preocessing method and processing device
12/19/2001CN1326833A Mo-Cu composite powder
12/19/2001CN1076558C Signal transmitting device, circuit block and integrated icrcuit suited fast signal transmission
12/19/2001CN1076512C Electric switch device on printed circuit and watch comprising such device
12/19/2001CN1076272C Multi-layer structure containing adhesion promoting layer
12/18/2001US6331946 Method for protecting on-chip memory (flash and RAM) against attacks
12/18/2001US6331926 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package
12/18/2001US6331883 Flat panel display device and manufacturing method thereof
12/18/2001US6331849 Integrated surface-mount pointing device
12/18/2001US6331811 Thin-film resistor, wiring substrate, and method for manufacturing the same
12/18/2001US6331678 Reduction of blistering and delamination of high-temperature devices with metal film
12/18/2001US6331447 High density flip chip BGA
12/18/2001US6331350 Polycarboxy/polyol fiberglass binder of low pH
12/18/2001US6331117 Electrical component system with rotatable electrical contacts
12/18/2001US6331063 LED luminaire with light control means
12/18/2001US6330745 Method for making a modular integrated apparatus for heat dissipation
12/18/2001CA2210738C Upgradeable voltage regulator modules
12/18/2001CA2209660C Electrical circuit suspension system
12/13/2001WO2001095684A1 Trimming of embedded structures
12/13/2001WO2001095683A1 Method of manufacturing circuit laminates
12/13/2001WO2001095681A1 Method for producing ceramic substrate
12/13/2001WO2001095679A1 Module for radio communication
12/13/2001WO2001095678A1 Method for manufacturing printed-circuit board
12/13/2001WO2001095499A1 Apparatus and method for reducing electromigration
12/13/2001WO2001095435A2 Multiple function high current interconnect with integrated bus bar
12/13/2001WO2001095425A1 Multi-layer microwave circuits and methods of manufacture
12/13/2001WO2001095424A1 Waveguide in multilayer structures
12/13/2001WO2001095349A2 Lighting assembly
12/13/2001WO2001094435A1 Glyoxal-phenolic condensates with enhanced fluorescence
12/13/2001WO2001094273A1 Method for manufacturing aluminum nitride sintered body in which via hole is made