| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/21/2002 | WO2002015651A2 Low inductance transistor module with distributed bus |
| 02/21/2002 | WO2002015568A1 Signal processor and electronic apparatus comprising it |
| 02/21/2002 | WO2002015423A1 Transmitter and receiver module |
| 02/21/2002 | WO2002015272A1 Tuner device |
| 02/21/2002 | WO2002015266A2 Direct build-up layer on an encapsulated die package |
| 02/21/2002 | WO2002014406A1 Novel polyimide and circuit substrate comprising the same |
| 02/21/2002 | WO2002014404A2 Polyarylether-polyetherimide compositions |
| 02/21/2002 | WO2001069987A3 Printed circuit board assembly with improved thermal performance |
| 02/21/2002 | US20020023187 Computer system board having slots for operating different types of memory modules |
| 02/21/2002 | US20020022710 Reacting a diamine with an ester acid of a dianhydride to form polyimide |
| 02/21/2002 | US20020022405 Memory modules having conductors at edges thereof and configured to conduct signals to and from the memory modules via the respective edges |
| 02/21/2002 | US20020022387 Electronic control unit mounting structure |
| 02/21/2002 | US20020022385 Connection structure and connection method of both circuit boards |
| 02/21/2002 | US20020022383 Compression connector |
| 02/21/2002 | US20020022381 Card edge connector |
| 02/21/2002 | US20020022110 Printed circuit board having inductive vias |
| 02/21/2002 | US20020021871 Optoelectronic surface-mountable module and optoelectronic coupling unit |
| 02/21/2002 | US20020021561 Aggregate of electronic components and mounting method thereof |
| 02/21/2002 | US20020021556 Vapor chamber with integrated pin array |
| 02/21/2002 | US20020021204 Method and component for forming an embedded resistor in a multi-layer printed circuit |
| 02/21/2002 | US20020021182 Front end module for mobile communications apparatus |
| 02/21/2002 | US20020020925 Semiconductor module and producing method therefor |
| 02/21/2002 | US20020020914 Method and apparatus providing redundancy for fabricating highly reliable memory modules |
| 02/21/2002 | US20020020910 Semiconductor device including bonding wire bonded to electronic part and method for manufacturing the same |
| 02/21/2002 | US20020020898 Microelectronic substrates with integrated devices |
| 02/21/2002 | US20020020897 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 02/21/2002 | US20020020836 Thin film capacitor avoiding short circuit between electrodes |
| 02/21/2002 | US20020020811 Semiconductor parts and semiconductor mounting apparatus |
| 02/21/2002 | US20020020557 Printed wiring board, and method and apparatus for manufacturing the same |
| 02/21/2002 | US20020020556 Printed wiring board, and method and apparatus for manufactujring the same |
| 02/21/2002 | US20020020555 Printed wiring board and method of producing the same |
| 02/21/2002 | US20020020554 Multi-layer circuit board and method of manufacturing the same |
| 02/21/2002 | US20020020553 Method and component for forming an embedded resistor in a multi-layer printed circuit |
| 02/21/2002 | US20020020551 Controlled-shaped solder reservoirs for increasing the volume of solder bumps |
| 02/21/2002 | US20020020550 Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby |
| 02/21/2002 | US20020020548 Multi-layer circuit board and method of manufacturing same |
| 02/21/2002 | US20020020491 Joining with electronic circuit using printable anisotropic conductive adhesive or paste; radio frequency identification devices or smart cards |
| 02/21/2002 | US20020020058 Method of mounting a BGA |
| 02/21/2002 | DE10039997A1 Data storage device incorporated in electronic circuit board or module has semiconductor chip contained in recess in laminate layer for holding recycling data |
| 02/21/2002 | DE10037292A1 Verfahren zur Herstellung von Anschlußsubstraten für Halbleiterkomponenten A process for the production of substrates for semiconductor connection components |
| 02/20/2002 | EP1180921A2 Multi-layer circuit board and method of manufacturing the same |
| 02/20/2002 | EP1180920A2 Circuit board and method of manufacturing same |
| 02/20/2002 | EP1180919A2 Method for producing a conductive pattern and method for producing a greensheet lamination body including the same |
| 02/20/2002 | EP1180918A1 Method for dispensing adhesive on a circuit-board carrier member and circuit-board provided thereby |
| 02/20/2002 | EP1180917A2 Copper-alloy foil to be used for laminate sheet |
| 02/20/2002 | EP1180818A2 Electronic control unit mounting structure |
| 02/20/2002 | EP1180701A1 Optical connector and printed circuit board assembly with movable connection |
| 02/20/2002 | EP0842561B1 Device with amplifier means including safety means, and with filter means connected to the amplifier means |
| 02/20/2002 | CN1337144A Article having a circuit soldered with parts and method for recycling wastes of the same |
| 02/20/2002 | CN1337016A Electronic wrist watch comprising an integrated circuit incorporated in a flexible band |
| 02/20/2002 | CN1336795A Apparatus and method for mounting of components |
| 02/20/2002 | CN1336793A Electromagnetic wave absorber, its mfg. method, and articles equipped with said absorber |
| 02/20/2002 | CN1336792A Electronic arrangement equiped with electronic circuit substrate |
| 02/20/2002 | CN1336790A Multi-layer circuit plate and its mfg. method |
| 02/20/2002 | CN1336789A Printed circuit plate and its mfg. method |
| 02/20/2002 | CN1336788A Electrode joint structure and its manufacture |
| 02/20/2002 | CN1336787A Ceramic laminated device |
| 02/20/2002 | CN1336786A Electronic control device and its mfg. method |
| 02/20/2002 | CN1336725A Electronic element and its mfg. method |
| 02/20/2002 | CN1336720A Power amplifier module of mobile communiation arrangement, terminal and its base station for said arrangement |
| 02/20/2002 | CN1336394A Aromatic liquid crystal polyester liquid composite |
| 02/20/2002 | CN1079630C Woven glass cloth for printed wiring board, and products made thereby |
| 02/20/2002 | CN1079582C Electronic package with multilever connections |
| 02/20/2002 | CN1079571C Variable voltage protection structures and method for making same |
| 02/19/2002 | US6349038 EMC characteristics of a printed circuit board |
| 02/19/2002 | US6349037 Backplane for common building block |
| 02/19/2002 | US6348844 Transition between symmetric stripline and asymmetric stripline |
| 02/19/2002 | US6348737 Metallic interlocking structure |
| 02/19/2002 | US6348661 Corrosion protection for wireless flexure |
| 02/19/2002 | US6348427 High-thermal-expansion glass ceramic sintered product |
| 02/19/2002 | US6348424 Low-temperature calcined glass ceramic and a manufacturing process therefor |
| 02/19/2002 | US6348233 Minimizing formation of cracks at junctions between vias and lines in line-to-via connections on a substrate; each line has a base section and a cap, each cap is positioned over a via in the substrate, cap's diameter is greater than via's |
| 02/19/2002 | US6347946 Pin grid array socket |
| 02/19/2002 | US6347901 Solder interconnect techniques |
| 02/19/2002 | US6347735 Method of manufacture for embedded processing subsystem module |
| 02/19/2002 | US6347584 Method of manufacturing electronic components using intaglio plate having dual releasing layers |
| 02/19/2002 | CA2097410C Recording medium cassette and a recording/reproducing apparatus |
| 02/19/2002 | CA2051266C Metal-film laminate resistant to delamination |
| 02/19/2002 | CA1341340C Electromagnetic radiation absorptive coating composition containing metal coated microspheres |
| 02/17/2002 | CA2344043A1 Computer system absent a parallel bus |
| 02/14/2002 | WO2002013586A1 Adhesive bonding of printed circuit boards to heat sinks |
| 02/14/2002 | WO2002013267A1 Power module and power module with heat sink |
| 02/14/2002 | WO2002012619A1 Heat-resistant fibrous paper |
| 02/14/2002 | WO2002012114A2 Ceramic microelectromechanical structure |
| 02/14/2002 | WO2001069577A3 Fiber display module and panel assembly |
| 02/14/2002 | US20020019919 Control chipset having dual-definition pins for reducing circuit layout of memory slot |
| 02/14/2002 | US20020019680 Method for controlling screen printer |
| 02/14/2002 | US20020019500 Epoxy acrylates |
| 02/14/2002 | US20020019464 Visible and fluorescent dye containing laminate materials |
| 02/14/2002 | US20020019304 Powdered borosilicate glass comprising boron oxide and silicon oxide, and aluminum, calcium, magnesium, and/or barium oxides |
| 02/14/2002 | US20020019174 Integrated connector and semiconductor die package |
| 02/14/2002 | US20020019170 Memory module with offset notches for improved insertion and memory module connector |
| 02/14/2002 | US20020019155 Printed circuit board with pins for being connected to electronic part mounted thereon |
| 02/14/2002 | US20020019154 Portable electronic apparatus having external connector fixed at internal circuit board |
| 02/14/2002 | US20020019153 Connecting devices and method for interconnecting circuit components |
| 02/14/2002 | US20020019152 Microelectric contact structure |
| 02/14/2002 | US20020019080 Method and apparatus for reducing BGA warpage caused by encapsulation |
| 02/14/2002 | US20020018861 Methods for the lithographic deposition of materials containing nanoparticles |
| 02/14/2002 | US20020018635 Opto-electronic device having staked connection between parts to prevent differential thermal expansion |
| 02/14/2002 | US20020018625 Optical wavelength division multiplexer and/or demultiplexer mounted in a pluggable module |