| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/02/2002 | EP1168403A2 Electrode-to-ballast interconnection of flat integral type compact fluorescent lamps |
| 01/02/2002 | EP1168387A2 Isolated converter |
| 01/02/2002 | EP1168376A1 Method for forming transparent conductive film by using chemically amplified resist |
| 01/02/2002 | EP1168208A2 Printed circuit board wiring structure checkup system |
| 01/02/2002 | EP1168082A2 Device for exposure of the peripheral area of a film circuit board |
| 01/02/2002 | EP1167581A1 Electrolytic copper foil and method for inspecting physical property thereof, and copper clad laminate using the electrolytic copper foil |
| 01/02/2002 | EP1167580A1 Electrolytic copper foil |
| 01/02/2002 | EP1166609A2 Multifunctional laminate structure and process |
| 01/02/2002 | EP1166385A1 Inverted microstrip transmisson line integrated in a multilayer structure |
| 01/02/2002 | EP1166361A1 Apparatus and method for an integrated circuit having high q reactive components |
| 01/02/2002 | EP1166355A1 Multi-chip module |
| 01/02/2002 | EP1166353A1 Laminate for multi-layer printed circuit |
| 01/02/2002 | EP1166289A1 Soft magnetic powder and composite magnetic material using the same |
| 01/02/2002 | EP1165870A1 Woven fabric reinforcement to optimize dimensional stability of laminated composite structures, including products for electrical and electronic applications |
| 01/02/2002 | EP1165311A1 Multilayer ceramic circuit boards with embedded resistors |
| 01/02/2002 | EP1054844B1 Composite |
| 01/02/2002 | EP0725981B1 Component stacking in multi-chip semiconductor packages |
| 01/02/2002 | EP0633295B1 Resin composition for electronic parts |
| 01/02/2002 | EP0584349B1 Process and device for three-dimensional interconnection of housings for electronic components |
| 01/02/2002 | CN1329812A Printed circuit board and method for fabricating such board |
| 01/02/2002 | CN1329580A Impregnated glass fiber stands and products including the same |
| 01/02/2002 | CN1329428A Cover body connecting mechanism |
| 01/02/2002 | CN1329376A Assembly unit for mounting electric element of flexible cable |
| 01/02/2002 | CN1329363A Data bus performance improved memory module |
| 01/02/2002 | CN1329362A Mixed IC device |
| 01/02/2002 | CN1329355A Fluorescent lamp device with built-in starting circuit |
| 01/02/2002 | CN1077395C Method for producing metal layer coated pressboard |
| 01/01/2002 | US6335867 Apparatus for interconnecting logic boards |
| 01/01/2002 | US6335866 Printed wiring board unit for use with electronic apparatus |
| 01/01/2002 | US6335865 Printed wiring board |
| 01/01/2002 | US6335862 Multilayer printed wiring board provided with injection hole for thermally conductive filler |
| 01/01/2002 | US6335707 Electronic circuit structure with optimized space requirement according to available volume |
| 01/01/2002 | US6335669 RF circuit module |
| 01/01/2002 | US6335664 Branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
| 01/01/2002 | US6335626 Method and device for determining a parameter for a metallization bath |
| 01/01/2002 | US6335571 Semiconductor flip-chip package and method for the fabrication thereof |
| 01/01/2002 | US6335567 Semiconductor device having stress reducing laminate and method for manufacturing the same |
| 01/01/2002 | US6335495 Patterning a layered chrome-copper structure disposed on a dielectric substrate |
| 01/01/2002 | US6335494 Multiple power distribution for delta-I noise reduction |
| 01/01/2002 | US6335493 Multilayer wiring board |
| 01/01/2002 | US6335487 Method for connecting a cable to a printed circuit board, and a housing having a cable connected to the printed circuit board in accordance with the method |
| 01/01/2002 | US6335417 Modified polyimide resin and thermosetting resin composition containing the same |
| 01/01/2002 | US6335416 Polyimide film and process for producing the same |
| 01/01/2002 | US6335298 Insulating glass paste and thick-film circuit component |
| 01/01/2002 | US6335077 For filling a via-hole formed in a green ceramic sheet |
| 01/01/2002 | US6334782 Printed-circuit board |
| 01/01/2002 | US6334569 Reflow soldering apparatus and reflow soldering method |
| 12/27/2001 | WO2001099480A2 Printed circuit board having inductive vias |
| 12/27/2001 | WO2001099479A2 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
| 12/27/2001 | WO2001099237A1 Power supply terminal and backboard |
| 12/27/2001 | WO2001099224A1 Electronically tunable dielectric composite thick films |
| 12/27/2001 | WO2001099211A1 Battery pack and method of producing the same |
| 12/27/2001 | WO2001099210A1 Electrochemical cells |
| 12/27/2001 | WO2001099189A1 Method and apparatus for edge connection between elements of an integrated circuit |
| 12/27/2001 | WO2001099187A1 Panel stacking of bga devices to form three-dimensional modules |
| 12/27/2001 | WO2001099124A1 Laminate and use thereof |
| 12/27/2001 | WO2001099074A2 Electronic article surveillance tag and method for making same |
| 12/27/2001 | WO2001099042A1 Device for biometric applications |
| 12/27/2001 | WO2001098829A1 A method for individualised marking of circuit boards |
| 12/27/2001 | WO2001037338A3 Method for integrating a chip in a printed board and integrated circuit |
| 12/27/2001 | US20010055704 Method for manufacturing a metal powder, a metal powder, an electroconductive paste using the same, and a multilayer ceramic electronic component using the same |
| 12/27/2001 | US20010055703 Method for the controlling of certain second phases in aluminum nitride |
| 12/27/2001 | US20010055691 Roll of metal film/aromatic polyimide film composite web |
| 12/27/2001 | US20010055676 Very ultra thin conductor layers for printed wiring boards |
| 12/27/2001 | US20010055203 Package substrate |
| 12/27/2001 | US20010055194 Inverter capacitor module and inverter |
| 12/27/2001 | US20010055191 Multilayer capacitor |
| 12/27/2001 | US20010055073 Solid state imaging apparatus |
| 12/27/2001 | US20010054950 Termination resistor in printed circuit board |
| 12/27/2001 | US20010054939 High-frequency multilayer circuit substrate |
| 12/27/2001 | US20010054938 Filter structures for integrated circuit interfaces |
| 12/27/2001 | US20010054905 Probe card assembly and kit |
| 12/27/2001 | US20010054770 Panel stacking of BGA devices to form three-dimensional modules |
| 12/27/2001 | US20010054758 Three-dimensional memory stacking using anisotropic epoxy interconnections |
| 12/27/2001 | US20010054757 Multi-layer wiring board substrate and semiconductor device using the multi-layer wiring substrate |
| 12/27/2001 | US20010054754 Surface-mounting type electronic circuit unit suitable for miniaturization and easy to manufacture |
| 12/27/2001 | US20010054753 Semiconductor package and mount board, and mounting method using the same |
| 12/27/2001 | US20010054513 Package substrate |
| 12/27/2001 | US20010054512 Printed circuit board configuration with a multipole plug-in connector |
| 12/27/2001 | US20010054511 High-insulated stud and printed circuit board therewith |
| 12/27/2001 | US20010054481 Method for making multilayer board having a cavity |
| 12/26/2001 | CN1328716A Controlling heat expansion of electrical couplings |
| 12/26/2001 | CN1328713A High density electrical connector |
| 12/26/2001 | CN1328709A Wideband RF port structure using coplanar waveguide and BGA I/O |
| 12/26/2001 | CN1328644A Probe card for probing wafers with raised contact elements |
| 12/26/2001 | CN1328584A Liquid crystalline polyesters having surprisingly good combination of low melting point, high heat distortion temp, low melt viscosity, and high tensile elongation |
| 12/26/2001 | CN1328413A Electronic ballast for discharging lamp |
| 12/26/2001 | CN1076638C Grafted thermoplastic elastomer barrier layer |
| 12/25/2001 | US6334190 System for the manipulation of secure data |
| 12/25/2001 | US6333857 Printing wiring board, core substrate, and method for fabricating the core substrate |
| 12/25/2001 | US6333856 Arrangement for mounting chips in multilayer printed circuit boards |
| 12/25/2001 | US6333837 Flexible circuit suspension |
| 12/25/2001 | US6333721 Identification element and method of manufacturing an identification element |
| 12/25/2001 | US6333710 Method for measuring the time delay between two periodic pulse signals of the same frequency |
| 12/25/2001 | US6333668 Semiconductor device for suppressing current peak flowing to/from an external power supply |
| 12/25/2001 | US6333635 Probe card for testing an integrated circuit chip |
| 12/25/2001 | US6333603 Organic light emission device display module |
| 12/25/2001 | US6333563 Electrical interconnection package and method thereof |
| 12/25/2001 | US6333472 Reduction of crosstalk in data transmission system |
| 12/25/2001 | US6333471 Sheet metal component for double pattern conduction and printed circuit board |