| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 01/30/2002 | CN1333648A System and method for supplying anti-high voltage ability in contact pin of high density flexible pin connector |
| 01/30/2002 | CN1333647A Mirror surface type circuit board |
| 01/30/2002 | CN1333562A Semiconductor module and making method thereof |
| 01/30/2002 | CN1078805C Solder pad for printed circuit boards |
| 01/29/2002 | US6343171 Systems based on opto-electronic substrates with electrical and optical interconnections and methods for making |
| 01/29/2002 | US6343164 Optoelectric multichip module |
| 01/29/2002 | US6343001 Multilayer capacitance structure and circuit board containing the same |
| 01/29/2002 | US6342977 Substrate with check-land, and check-land connecting device |
| 01/29/2002 | US6342955 Image reading/recording apparatus |
| 01/29/2002 | US6342827 Thermal fuse for fixing on a circuit substrate |
| 01/29/2002 | US6342766 Power module for high intensity discharge lamp |
| 01/29/2002 | US6342682 Printed wiring board and manufacturing method thereof |
| 01/29/2002 | US6342680 Plastic formed of conductive resin comprising thermoplastic resin, lead-free solder that melts during plasticization, metal powder or mixture of metal powder and metal short fibers that assists fine dispersion of solder particles in resin |
| 01/29/2002 | US6342572 Flame retardant benzocyclobutene resin with reduced brittleness |
| 01/29/2002 | US6342455 Process for forming an integrated circuit |
| 01/29/2002 | US6342454 Forming integrated circuits, applying metal films to substrates, lithographically patterns of circuits on substrates, heat resistant dielectric polymer, heating, coupling |
| 01/29/2002 | US6342400 Dye penetrant test for semiconductor package assembly solder joints |
| 01/29/2002 | US6342333 Photosensitive resin composition, patterning method, and electronic components |
| 01/29/2002 | US6342322 Photosensitive composition and calcined pattern obtained by use thereof |
| 01/29/2002 | US6342308 Copper foil bonding for printed circuits |
| 01/29/2002 | US6342276 Method for making a field emission display |
| 01/29/2002 | US6342266 Method for monitoring solder paste printing process |
| 01/29/2002 | US6342164 Pinhole-free dielectric films |
| 01/29/2002 | US6341976 Method and device for the attachment of electrical components to a circuit board |
| 01/29/2002 | US6341966 Electrical connector connecting system and intermediate board support for the same |
| 01/29/2002 | US6341844 Apparatus using overlaid flexible cable for electrically connecting relatively moveable parts |
| 01/29/2002 | US6341728 Memory card, and receptacle for same |
| 01/29/2002 | US6341417 Pre-patterned substrate layers for being personalized as needed |
| 01/29/2002 | CA2184373C Fabrication multilayer combined rigid/flex printed circuit board |
| 01/24/2002 | WO2002007487A1 Production method for copper-clad laminated sheet |
| 01/24/2002 | WO2002007486A1 Method for producing an electrical and/or mechanical connection between flexible thin-film substrates |
| 01/24/2002 | WO2002007485A1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 01/24/2002 | WO2002007190A2 Polymer matrix composites |
| 01/24/2002 | WO2002006399A1 Halogen-free flame-retardant epoxy resin compoisition, halogen-free flame-retardant epoxy resin composition for build-up type multilayer boards, prepregs, copper-clad laminates, printed wiring boards, resin films with copper foil or carriers, and build-up type laminates and multilayer boards |
| 01/24/2002 | US20020010898 System and method for designing a printed board adopted to suppress electromagnetic interference |
| 01/24/2002 | US20020010311 Polyimide composition having improved peel strength when clad |
| 01/24/2002 | US20020010288 Copper clad laminates |
| 01/24/2002 | US20020010286 Multifunctional cyanate ester and epoxy blends |
| 01/24/2002 | US20020009926 Electrical connector having customizable circuit board wafers |
| 01/24/2002 | US20020009919 Wiring unit |
| 01/24/2002 | US20020009908 Wire-to-board connector |
| 01/24/2002 | US20020009906 Balanced-transmission cable-and-connector unit |
| 01/24/2002 | US20020009904 Probe card |
| 01/24/2002 | US20020009578 Flexible multilayer wiring board |
| 01/24/2002 | US20020009539 Process for screening features on an electronic substrate with a low viscosity paste |
| 01/24/2002 | US20020008967 Power module with a circuit arrangement comprising active semiconductor components and passive components, and method for producing same |
| 01/24/2002 | US20020008966 Microelectronic contacts with asperities and methods of making same |
| 01/24/2002 | US20020008963 Inter-circuit encapsulated packaging |
| 01/24/2002 | US20020008631 Slim profile indicating instruments |
| 01/24/2002 | US20020008599 Multi-layer microwave circuits and methods of manufacture |
| 01/24/2002 | US20020008542 Programmable apparatus and method for programming a programmable device |
| 01/24/2002 | US20020008321 Connection structure |
| 01/24/2002 | US20020008314 Semiconductor integrated circuit and printed wiring substrate provided with the same |
| 01/24/2002 | US20020008307 Substrate film structure |
| 01/24/2002 | US20020008264 Chip decoupling capacitor |
| 01/24/2002 | US20020008238 Electronic circuit unit suitable for miniaturization |
| 01/24/2002 | US20020008228 Surface treatment of metal particles |
| 01/24/2002 | US20020008093 Laser processing method and equipment for printed circuit board |
| 01/24/2002 | US20020007967 Wiring unit |
| 01/24/2002 | US20020007966 Structure for high speed printed wiring boards with multiple differential impedance-controlled layer |
| 01/24/2002 | US20020007964 Printed circuit board and electronic package using same |
| 01/24/2002 | US20020007961 Wired circuit board |
| 01/24/2002 | US20020007908 Circuit board having thereon coupled ceramic capacitors and method for the manufacture thereof |
| 01/24/2002 | US20020007679 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor |
| 01/24/2002 | US20020007678 Semiconductor sensor chip and method for producing the chip, and semiconductor sensor and package for assembling the sensor |
| 01/24/2002 | US20020007677 Printed circuit board inclinometer/accelerometer |
| 01/24/2002 | DE10132786A1 Schicht mit flexibler gedruckter Schaltung Layer of flexible printed circuit |
| 01/24/2002 | DE10034152A1 Vertical arrangement for connecting memory chips uses pair of circuit boards for high data rate |
| 01/24/2002 | DE10032849A1 Elektrisches Gerät mit einem Gehäuse aus verfestigtem polymeren Werkstoff Electrical device having a housing of solidified polymeric material |
| 01/24/2002 | DE10032339A1 Device for computer with two or more boards has bridge card joined to two boards independently of plugs on boards for plug-in cards |
| 01/23/2002 | EP1175132A1 Surface-treated copper foil and method for manufacturing the surface-treated copper foil |
| 01/23/2002 | EP1175131A2 Compact fluorescent lamp |
| 01/23/2002 | EP1174951A2 System and method for providing high voltage withstand capability between pins of a high-density compliant pin connector |
| 01/23/2002 | EP1174766A2 Process for patterning non-photoimagable ceramic tape |
| 01/23/2002 | EP1174745A2 Optoelectronic surface- mountable module |
| 01/23/2002 | EP1174709A2 Cream solder inspection |
| 01/23/2002 | EP1174310A1 Electric current and signal conductor |
| 01/23/2002 | EP1174237A1 Electrical apparatus with a reinforced polymer plastic housing |
| 01/23/2002 | EP1173501A1 Microwave-transparent thermosetting resin compositions, electrical laminates obtained therefrom, and process of producing these |
| 01/23/2002 | EP1042946B1 Hybrid circuit with a heat dissipation system |
| 01/23/2002 | EP0933010B1 Printable compositions, and their application to dielectric surfaces used in the manufacture of printed circuit boards |
| 01/23/2002 | CN2473745Y Base board with static protection |
| 01/23/2002 | CN1332704A Glass fiber-reinforced prepegs, laminates, electronic circuit boards and methods for assembling fabric |
| 01/23/2002 | CN1332601A Electronic circuit unit |
| 01/23/2002 | CN1332600A Plane mounted electronic circuit unit |
| 01/23/2002 | CN1332599A Plane mounted electronic circuit unit |
| 01/23/2002 | CN1332598A Printed-wiring board with cavity for mounting electronic component and manufacture thereof |
| 01/23/2002 | CN1332468A Electrode-ballast joint of small plate integral fluorescent lamp |
| 01/23/2002 | CN1332265A Electronic line chip |
| 01/22/2002 | US6341071 Stress relieved ball grid array package |
| 01/22/2002 | US6341066 Electronic control unit having drive element and control processing element |
| 01/22/2002 | US6341063 Installation structure of printed-circuit board for electronic control unit |
| 01/22/2002 | US6340841 Build-up board package for semiconductor devices |
| 01/22/2002 | US6340798 Printed circuit board with reduced crosstalk noise and method of forming wiring lines on a board to form such a printed circuit board |
| 01/22/2002 | US6340797 Printed circuit board having signal patterns of varying widths |
| 01/22/2002 | US6340796 Printed wiring board structure with integral metal matrix composite core |
| 01/22/2002 | US6340546 Which, on heating, become heat-resistant polyimide polymers suitable for surface-protecting films, interlayer insulating films |
| 01/22/2002 | US6340518 Flexible metal-clad laminates and preparation of the same |
| 01/22/2002 | CA2245377C Electrical connector having time-delayed signal compensation |
| 01/22/2002 | CA2199796C An electronic-circuit assembly and its manufacturing method |