| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/19/2002 | US6358772 Semiconductor package having semiconductor element mounting structure of semiconductor package mounted on circuit board and method of assembling semiconductor package |
| 03/19/2002 | US6358767 Method of manufacturing semiconductor device |
| 03/19/2002 | US6358627 Rolling ball connector |
| 03/19/2002 | US6358439 For forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices |
| 03/19/2002 | US6358390 Obtaining a surface charge on ceramic materiall depositing an electroconductive material on surface of ceramic material; activating electroconductive material; electrolytically plating metal on surface of electroconductive material |
| 03/19/2002 | US6358351 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same |
| 03/19/2002 | US6358094 Low inductance connector with enhanced capacitively coupled contacts for power applications |
| 03/19/2002 | US6358089 Connector for printed wiring board |
| 03/19/2002 | US6358064 Z-axis electrical interconnect |
| 03/19/2002 | US6357414 Air manifold mounting for engine control circuitry |
| 03/19/2002 | US6357108 Depaneling system having multiple router stations |
| 03/19/2002 | US6357106 Method for mounting parts and making an IC card |
| 03/15/2002 | CA2357317A1 Substrate for electronic circuit and electronic module using said substrate |
| 03/14/2002 | WO2002021887A1 Durable laminated electronics assembly using epoxy preform |
| 03/14/2002 | WO2002021886A2 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives |
| 03/14/2002 | WO2002021477A1 Apparatus and method for securing electronic information |
| 03/14/2002 | WO2002003421A3 Semiconductor chip package with embedded capacitors |
| 03/14/2002 | WO2001093280A8 Halogen-free film composite, method for producing the same and its use |
| 03/14/2002 | WO2001085840A3 Thermosetting resins and laminates |
| 03/14/2002 | WO2001028081A3 Single board motor controller |
| 03/14/2002 | US20020032279 Epoxy resin modified with a side chain having a reactive phosphorus-containing compound, e.g., 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide |
| 03/14/2002 | US20020031953 Card edge connector assembly |
| 03/14/2002 | US20020031948 Connector for module |
| 03/14/2002 | US20020031940 Electric device having a housing made of solidified polymeric material |
| 03/14/2002 | US20020031925 Power connector |
| 03/14/2002 | US20020031918 Method of manufacture of ceramic composite wiring structures for semiconductor devices |
| 03/14/2002 | US20020031728 Methods of manufacturing electroconductive film, and image forming apparatus including the same film |
| 03/14/2002 | US20020031650 Electronic chip package |
| 03/14/2002 | US20020031642 Method for producing filled vias in electronic components |
| 03/14/2002 | US20020030979 Circuit board system for optiming contact pin layout in an integrated circuit |
| 03/14/2002 | US20020030978 Wiring Board, method for producing same, display device, and electronic device |
| 03/14/2002 | US20020030977 Fan control circuit and package |
| 03/14/2002 | US20020030974 Bridging board |
| 03/14/2002 | US20020030973 Surface mounted conduction heat sink |
| 03/14/2002 | US20020030971 Electronic appliance |
| 03/14/2002 | US20020030940 Head gimbal assembly |
| 03/14/2002 | US20020030872 Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
| 03/14/2002 | US20020030809 Mounting information-collecting device, connector, and mounting information-collecting method |
| 03/14/2002 | US20020030577 Thin-film resistor, wiring substrate, and method for manufacturing the same |
| 03/14/2002 | US20020030573 Insulating ceramic compact, ceramic multilayer substrate, and ceramic electronic device |
| 03/14/2002 | US20020030445 Chip type light emitting diode and method of manufacture thereof |
| 03/14/2002 | US20020030306 Method and device for making holes in ceramic green sheets |
| 03/14/2002 | US20020030297 Integrated circuits of low dielectric material prepared using removable pore forming material |
| 03/14/2002 | US20020030268 Hybrid integrated circuit device |
| 03/14/2002 | US20020030266 Semiconductor device, substrate for a semiconductor device, method of manufacture thereof, and electronic instrument |
| 03/14/2002 | US20020030256 Memory card |
| 03/14/2002 | US20020030250 Thick film millimeter wave transceiver module |
| 03/14/2002 | US20020029905 Method for manufacturing modular board |
| 03/14/2002 | US20020029904 Printed circuit board with smd components |
| 03/14/2002 | US20020029903 Adapter for a ball grid array device |
| 03/14/2002 | US20020029902 Microelectronic assemblies having solder-wettable pads and conductive elements |
| 03/14/2002 | US20020029875 Electronic apparatus provided with an electronic circuit substrate |
| 03/14/2002 | US20020029838 Multilayered board and method for fabricating the same |
| 03/14/2002 | US20020029837 Manufacturing apparatus for manufacturing electronic monolithic ceramic components |
| 03/14/2002 | US20020029704 Screen printing paste, screen printing method, and baked thick film body |
| 03/14/2002 | US20020029670 Gang punch tool assembly |
| 03/14/2002 | US20020029486 Board for measuring offset of component mounting apparatus, and method for measuring offset of component mounting apparatus |
| 03/14/2002 | DE10136285A1 Integrierte Halbleiterschaltungsvorrichtung und Verfahren zum Anbringen von Schaltungsblöcken in der integrierten Halbleiterschaltungsvorrichtung A semiconductor integrated circuit apparatus and method for attaching of circuit blocks in the semiconductor integrated circuit device |
| 03/14/2002 | DE10048179C1 Epoxidharzzusammensetzung mit halogenfreiem, phosphorfreiem Flammschutzmittel Epoxy resin with halogen-free, phosphate-free flame retardants |
| 03/14/2002 | DE10042764A1 Verfahren zur Herstellung eines massereichen ohmschen Widerstands und elektronische Baueinheit Process for the preparation of a massive ohmic resistor and electronic assembly |
| 03/14/2002 | DE10036900A1 Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner Method for contacting a flexible circuit board with a contact partner and assembly of flexible printed circuit board and Partners |
| 03/14/2002 | DE10007642C2 Verfahren zum Trennen von Substraten im Nutzenformat mit vorgegebenen Sollbruchstellen A method of separating substrates in the panel format with predetermined breaking points |
| 03/14/2002 | CA2419805A1 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives |
| 03/13/2002 | EP1187523A2 High-frequency module and manufacturing method of the same |
| 03/13/2002 | EP1187520A2 Electrical circuit board and a method for making the same |
| 03/13/2002 | EP1187519A2 Electrical circuit board and a method for making the same |
| 03/13/2002 | EP1187514A2 Printed wiring board |
| 03/13/2002 | EP1187320A2 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 03/13/2002 | EP1187261A2 Connecting structure for electronic signal transmission |
| 03/13/2002 | EP1187259A2 Electrical connection box for a vehicle |
| 03/13/2002 | EP1187258A1 Fuse relay junction block for use in automobiles |
| 03/13/2002 | EP1187212A2 Display apparatus |
| 03/13/2002 | EP1187204A2 Circuit device and method of manufacturing the same |
| 03/13/2002 | EP1187198A2 Metal-ceramic circuit board and manufacturing method thereof |
| 03/13/2002 | EP1186938A2 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module and electronic equipment adopting same |
| 03/13/2002 | EP1186213A1 Method and apparatus for reducing electrical resonances and noise propagation in power distribution circuits employing plane conductors |
| 03/13/2002 | EP0836631B1 A microfiber-reinforced porous polymer film |
| 03/13/2002 | CN2482313Y Flexible printed circuit board structure |
| 03/13/2002 | CN1340289A Circuit forming board and method of manufacturing circuit forming board |
| 03/13/2002 | CN1340288A Surface-treated copper foil and its preparing method |
| 03/13/2002 | CN1340163A Method for verification of polarity, presence, alignment of components and short circuit on a printed circuit board |
| 03/13/2002 | CN1340067A Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 03/13/2002 | CN1339941A Line board and its producing mehtod |
| 03/13/2002 | CN1339940A Multiplayer circuit base and its producing method |
| 03/13/2002 | CN1339939A Printed circuit board and electronic equipment with said printed circuit board |
| 03/13/2002 | CN1339886A Front end module of mobile communication device |
| 03/13/2002 | CN1339729A Computer system without parallel systematic bus |
| 03/13/2002 | CN1339692A Plate for measuring deviation of element mounting device and its measuring method |
| 03/13/2002 | CN1339538A Fire-retarded resin and fire-retardedresin composition containing said resin |
| 03/13/2002 | CN1339537A Resin composition with phosphorous compound having epoxy radical and its use |
| 03/13/2002 | CN1339525A Resin firming agent containing phosphorus and nitrogen and fireproof resin composition containing said firming agent |
| 03/13/2002 | CN1080984C Panel assembly structure |
| 03/13/2002 | CN1080981C Printed wiring board |
| 03/13/2002 | CN1080937C Printed circuit board bearing plate for ball grid array integrated circuit component |
| 03/13/2002 | CN1080642C Process for producing laminated board |
| 03/12/2002 | US6357023 Connector assembly for testing memory modules from the solder-side of a PC motherboard with forced hot air |
| 03/12/2002 | US6357022 Testing memory modules on a solder-side adaptor board attached to a PC motherboard |
| 03/12/2002 | US6356717 Flexible circuit board |
| 03/12/2002 | US6356455 Thin integral resistor/capacitor/inductor package, method of manufacture |
| 03/12/2002 | US6356451 Multi-layered substrate, method for manufacturing the multi-layered substrate and electric apparatus |