| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/26/2002 | US6362525 Circuit structure including a passive element formed within a grid array substrate and method for making the same |
| 03/26/2002 | US6362463 High frequency heating apparatus |
| 03/26/2002 | US6362438 Enhanced plated-through hole and via contact design |
| 03/26/2002 | US6362437 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder, and method of mounting the same |
| 03/26/2002 | US6362436 Printed wiring board for semiconductor plastic package |
| 03/26/2002 | US6362435 Multi-layer conductor pad for reducing solder voiding |
| 03/26/2002 | US6362434 Magnetic prepreg, its manufacturing method and printed wiring board employing the prepreg |
| 03/26/2002 | US6362433 Flexible printed circuit board |
| 03/26/2002 | US6361923 Laser ablatable material and its use |
| 03/26/2002 | US6361866 Prepreg and laminated board |
| 03/26/2002 | US6361627 Process of controlling grain growth in metal films |
| 03/26/2002 | US6361369 Memory card, and receptacle for same |
| 03/26/2002 | US6361358 Flexible circuit board connecting structure |
| 03/26/2002 | US6361330 Mounting opto-electric modules on circuit boards |
| 03/26/2002 | US6361329 Header or receptacle for use in a power connector and process of assembling same |
| 03/26/2002 | US6361328 Surface-mounted low profile connector |
| 03/26/2002 | US6361146 Adhesive bonding laminates |
| 03/26/2002 | US6360935 Apparatus and method for assessing solderability |
| 03/26/2002 | US6360435 Bidirectional interface tool for PWB development |
| 03/26/2002 | US6360434 Circuit fabrication |
| 03/26/2002 | US6360433 Universal package and method of forming the same |
| 03/26/2002 | US6360431 Processor power delivery system |
| 03/26/2002 | CA2242802C Mounting structure for one or more semiconductor devices |
| 03/26/2002 | CA2237677C Printed wiring board |
| 03/26/2002 | CA2203723C 1,2-n-acyl-n-methylene-ethylenediamine, and electroconductive paste comprising it |
| 03/22/2002 | CA2337471A1 Resistor component with multiple layers of resistive material |
| 03/21/2002 | WO2002023963A2 Method and apparatus for surface mounting electrical devices |
| 03/21/2002 | WO2002023961A1 Method for producing an electrically conductive structure on a non-planar surface and the use of said method |
| 03/21/2002 | WO2002023959A1 Power module for high intensity discharge lamp |
| 03/21/2002 | WO2002023674A2 Thick film millimeter wave transceiver module |
| 03/21/2002 | WO2002023629A2 Electronic device manufacture |
| 03/21/2002 | WO2002023620A2 Connection for conducting high frequency signal between a circuit and a discrete electrical component |
| 03/21/2002 | WO2002023617A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same |
| 03/21/2002 | WO2002023579A1 Electronic device |
| 03/21/2002 | WO2002022704A1 Phosphorus-containing epoxy resin, flame-retardant highly heat-resistant epoxy resin composition containing the resin, and laminate |
| 03/21/2002 | WO2002022354A1 Resin compatibilized starch-oil sizing |
| 03/21/2002 | WO2001095349A3 Lighting assembly |
| 03/21/2002 | WO2001080316A3 Contactless interconnection system |
| 03/21/2002 | WO2001069680A3 Electronic module having a three dimensional array of carrier-mounted integrated circuit packages |
| 03/21/2002 | US20020035233 Blend containing phosphorous compound |
| 03/21/2002 | US20020035194 Mixture of borosilicate glass and crystalline glass |
| 03/21/2002 | US20020034894 Circuit board straddle mounted connector |
| 03/21/2002 | US20020034889 Power connector |
| 03/21/2002 | US20020034872 Semiconductor device and mounted semiconductor device structure |
| 03/21/2002 | US20020034839 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor |
| 03/21/2002 | US20020034825 Reactive dye or pigment that changes color when brought into contact with contaminants; preferably, testing liquid is the dye Nile blue and a surfactant |
| 03/21/2002 | US20020034667 Having enhanced electronic properties and are superior to thin film configurations because the thick films have lower loss tangents and are not dependant on substrate materials |
| 03/21/2002 | US20020034617 Method of manufacture of printed wiring boards and flexible circuitry |
| 03/21/2002 | US20020034614 Multilayer board using a glass-ceramic material which can be fired at low temperatures |
| 03/21/2002 | US20020034611 Process of forming a pattern on a substrate |
| 03/21/2002 | US20020034088 Leadframe-based module DC bus design to reduce module inductance |
| 03/21/2002 | US20020034068 Stacked printed circuit board memory module and method of augmenting memory therein |
| 03/21/2002 | US20020034059 Mounting structure for capacitors |
| 03/21/2002 | US20020033979 Method and apparatus for multiboard fiber optic modules and fiber optic module arrays |
| 03/21/2002 | US20020033678 Self-ballasted fluorescent lamp |
| 03/21/2002 | US20020033529 Power semiconductor module |
| 03/21/2002 | US20020033525 Packaging method and packaging structures of semiconductor devices |
| 03/21/2002 | US20020033524 Tape-carrier-package semiconductor device and a liquid crystal panel display using such a device as well as a method for testing the disconnection thereof |
| 03/21/2002 | US20020033411 Method and apparatus for flex circuit reflow attachment |
| 03/21/2002 | US20020033378 Printed wiring substrate and method for fabricating the same |
| 03/21/2002 | US20020033276 Inline and "Y" input-output bus topology |
| 03/21/2002 | US20020033275 Printed wiring board comprising substrate with conductor layer having penetrating throughhole filled with material comprising cured paste of epoxy resin, base metal powder filler, and imidazole compound curing agent |
| 03/21/2002 | US20020033273 Diverter device for a flexible circuit |
| 03/21/2002 | US20020033087 Cutter wheel for brittle sheets |
| 03/21/2002 | US20020032958 Method of manufacturing magnetic head assembly |
| 03/21/2002 | DE10119813A1 Leistungsmodul Power module |
| 03/20/2002 | EP1189494A2 Turning device for a flat conductor cable |
| 03/20/2002 | EP1189345A2 High frequency module device and method for its preparation |
| 03/20/2002 | EP1189310A2 Connector structure, female connector, and male connector |
| 03/20/2002 | EP1189291A2 Chip type light emitting diode and method of manufacture thereof |
| 03/20/2002 | EP1189277A1 Electronic circuit substrate and electronic module using such a substrate |
| 03/20/2002 | EP1189272A1 Module with built-in electronic elements and method of manufacture thereof |
| 03/20/2002 | EP1189250A1 Functionally asymmetrical circuit support arrangement with mirror-inverted assembly |
| 03/20/2002 | EP1189111A1 Production device for printed board, production method for printed board and printed board |
| 03/20/2002 | EP1188778A1 Thermosetting resin composition, and resin coated metal foil, prepreg and film-shaped adhesive all using the composition |
| 03/20/2002 | EP1188212A1 A multi-functional energy conditioner |
| 03/20/2002 | EP1188203A1 Surface mountable connector assembly including a printed circuit board |
| 03/20/2002 | EP1187793A1 Glass fiber composition |
| 03/20/2002 | EP1019960A4 Ball grid array semiconductor package and method for making the same |
| 03/20/2002 | CN1341165A Electrolytic copper foil and method for inspecting physical property thereof, and copper clad laminate using electrolytic copper foil |
| 03/20/2002 | CN1341164A Electrolytic copper foil |
| 03/20/2002 | CN1341044A Method for making segmented through holes in printed circuit boards |
| 03/20/2002 | CN1340991A Wiring baseplate and its manufacture method |
| 03/20/2002 | CN1340881A Connection structure for display module and printed base plate and semiconductor device, display module and electronic member |
| 03/20/2002 | CN1340856A RF module member including surface elastic wave element and its manufacture method |
| 03/20/2002 | CN1340850A Assembling method for monolithic electronic member and monolithic electronic member |
| 03/20/2002 | CN1340737A 照相机 Camera |
| 03/20/2002 | CN1340577A Conductive sizing material |
| 03/20/2002 | CN1081434C Multi-layer printed circuit board and method for mfg. same |
| 03/19/2002 | US6360060 Camera |
| 03/19/2002 | US6359784 Package for an electrical apparatus and method of manufacturing therefore |
| 03/19/2002 | US6359783 Integrated circuit socket having a built-in voltage regulator |
| 03/19/2002 | US6359561 Method of manufacturing and testing an electronic device, and an electronic device |
| 03/19/2002 | US6359536 High frequency multi-layer module with electronic component receiving aperture and conductive via |
| 03/19/2002 | US6359372 Circuit card assembly having controlled expansion properties |
| 03/19/2002 | US6359255 Method for forming a through hole in a ceramic green sheet |
| 03/19/2002 | US6359237 Multi-layer printed board |
| 03/19/2002 | US6359236 Mounting component with leads having polymeric strips |
| 03/19/2002 | US6359235 Electrical device mounting wiring board and method of producing the same |
| 03/19/2002 | US6359233 Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof |