| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/03/2002 | CN1343086A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 04/03/2002 | CN1082332C Multilayer printed circuit board |
| 04/03/2002 | CN1082251C 坐标输入装置 Coordinate input means |
| 04/02/2002 | US6366486 Power supply device for enhancing heat-dissipating effect |
| 04/02/2002 | US6366469 Electrical component stacking system |
| 04/02/2002 | US6366467 Dual-socket interposer and method of fabrication therefor |
| 04/02/2002 | US6366466 Multi-layer printed circuit board with signal traces of varying width |
| 04/02/2002 | US6366443 Ceramic chip capacitor of conventional volume and external form having increased capacitance from use of closely-spaced interior conductive planes reliably connecting to positionally-tolerant exterior pads through multiple redundant vias |
| 04/02/2002 | US6366331 Active matrix liquid-crystal display device having improved terminal connections |
| 04/02/2002 | US6366192 Structure of making a thick film low value high frequency inductor |
| 04/02/2002 | US6365975 Chip with internal signal routing in external element |
| 04/02/2002 | US6365974 Flex circuit substrate for an integrated circuit package |
| 04/02/2002 | US6365962 Flip-chip on flex for high performance packaging applications |
| 04/02/2002 | US6365949 Substrate having a unidirectional conductivity perpendicular to its surface, devices comprising such a substrate and methods for manufacturing such a substrate |
| 04/02/2002 | US6365844 Printed wiring board |
| 04/02/2002 | US6365843 Multilayer printed wiring board |
| 04/02/2002 | US6365842 Electrical circuits, circuits, and electrical couplings |
| 04/02/2002 | US6365841 Printed circuit board with resist coating defining reference marks |
| 04/02/2002 | US6365839 Multi-layer printed circuit board with dual impedance section |
| 04/02/2002 | US6365828 Electromagnetic interference suppressing device and circuit |
| 04/02/2002 | US6365786 Bromination of bisphenol a with an alkali or alkaline earth metal bromide or bromate or hydrobromic acid in the presence of hydrochloric acid and sodium laurel sulfate |
| 04/02/2002 | US6365440 Method for contacting a circuit chip |
| 04/02/2002 | US6365265 Photosensitive insulating paste and thick-film multi-layer circuit substrate |
| 04/02/2002 | US6365260 Arrangement for heat dissipation in chip modules on multilayered ceramic carriers, in particular multichip modules |
| 04/02/2002 | US6364712 Filter device for at least one electrical line connectable externally to a housing |
| 04/02/2002 | US6364668 Electrical connection system and method for flat circuits |
| 04/02/2002 | US6364458 Pivoted printhead handle with recessed rest position |
| 04/02/2002 | US6364205 Chip card having a contact zone and method of producing such a chip card |
| 04/02/2002 | US6363846 Screen printing apparatus having a camera apparatus |
| 04/02/2002 | CA2255701C Apparatus and method for mounting an electronic component to a substrate |
| 04/02/2002 | CA2080832C Fluorinated poly(arylene ethers) |
| 04/02/2002 | CA2070836C Electronic articles containing a fluorinated poly(arlene ether) dielectric |
| 03/28/2002 | WO2002025833A2 Circuit for compensating the effects of crosstalk |
| 03/28/2002 | WO2002025797A2 Electronic transformer/inductor devices and methods for making same |
| 03/28/2002 | WO2002025777A2 Press (non-soldered) contacts for high current electrical connections in power modules |
| 03/28/2002 | WO2002025732A2 Power module with integrated capacitor |
| 03/28/2002 | WO2002025731A1 Electronic equipment |
| 03/28/2002 | WO2002025709A2 Integrated thin film capacitor/inductor/interconnect system and method |
| 03/28/2002 | WO2002025704A2 Leadframe-based module dc bus design to reduce module inductance |
| 03/28/2002 | WO2002025703A2 Substrate-level dc bus design to reduce module inductance |
| 03/28/2002 | WO2002025673A2 Method and apparatus for forming a magnetic component on a printed circuit board |
| 03/28/2002 | WO2002025411A1 Security module |
| 03/28/2002 | WO2002025302A2 Gps receiver with mounted antenna and pcb integrated shield |
| 03/28/2002 | WO2002025070A1 Connecting device for routing control and power signals to an internal combustion engine valve actuators |
| 03/28/2002 | WO2002025010A1 Nonwoven fabric for electrical insulation, prepreg, and laminate |
| 03/28/2002 | WO2002024992A1 Multi-component fibers having reversible thermal properties |
| 03/28/2002 | WO2002024788A1 Material for insulating film, coating varnish for insulating film, and insulating film and semiconductor device using the same |
| 03/28/2002 | WO2002024785A1 Heat-resistant resin precursor, heat-resistant resin and insulating film and semiconductor device |
| 03/28/2002 | WO2002024592A1 Glass fiber coating for inhibiting conductive anodic filament formation in electronic supports |
| 03/28/2002 | WO2001099479A3 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
| 03/28/2002 | WO2001097583A3 Molded electronic assembly |
| 03/28/2002 | WO2001091184A3 Semiconductor component comprising a surface metallization |
| 03/28/2002 | WO2001074960A3 Halogen free flame retardant adhesive resin coated composite |
| 03/28/2002 | WO2001029928A3 Device for electrically and mechanically connecting two printed circuit boards |
| 03/28/2002 | US20020037804 Compacts; low temperature sintering; barium, titanium, rare earth oxides |
| 03/28/2002 | US20020037757 Antenna arrangement in a mobile station |
| 03/28/2002 | US20020037756 Battery-operated wireless-communication apparatus and method |
| 03/28/2002 | US20020037656 Interconnect structure |
| 03/28/2002 | US20020037473 Printed circuit substrate with controlled placement covercoat layer |
| 03/28/2002 | US20020037369 Coating composition for producing electrically conductive coatings |
| 03/28/2002 | US20020037363 Imaging an external appearance of the resin extruded from a resin application device; and automatically adjusting an amount of the resin extruded from the resin application device based on the external appearance |
| 03/28/2002 | US20020036511 Printed circuit board and method of manufacturing the same |
| 03/28/2002 | US20020036345 High frequency flip chip module and assembling method thereof |
| 03/28/2002 | US20020036341 Printed board unit |
| 03/28/2002 | US20020036236 Memory card, and receptacle for same |
| 03/28/2002 | US20020036099 Circuit board for transmitting signals, method for producing the same, and electronic device having the same |
| 03/28/2002 | US20020036055 Device transfer method |
| 03/28/2002 | US20020036054 Printed circuit board and method manufacturing the same |
| 03/28/2002 | DE10065540A1 Method for producing a strip conductor from a cupriferous metal particle suspension sprays the strip conductor with the suspension using a stencil mask or focussing spray device onto a plastic card body's substrate. |
| 03/28/2002 | DE10048466C1 Electrical contacting device for flexible circuit board has sliding element between contact spring and flexible circuit board for movement of contact spring into its end position |
| 03/28/2002 | DE10045466A1 Production of a thick layer/thin layer hybrid circuit on metal oxide substrates comprises applying conducting pathways, resistance surfaces and insulating layers on an insulating layer of a metal oxide produced |
| 03/28/2002 | DE10043205A1 Epoxy resin mixture for production of composites, e.g. prepregs and laminates for printed circuit boards, contains special phosphorus-modified epoxy resin, dicyandiamide or aromatic amine and hardening accelerator |
| 03/28/2002 | DE10043194A1 Glaskeramikmasse und Verwendung der Glaskeramikmasse Glass ceramic material and use of the glass ceramic mass |
| 03/28/2002 | DE10042653A1 Ceramic multiple layer circuit element for linking adjacent electrically conductive elements has stacked ceramic layers with different relative permittivities and green ceramic foil with lowered crystallizing temperature. |
| 03/28/2002 | CA2423123A1 Multi-component fibers having reversible thermal properties |
| 03/27/2002 | EP1191828A2 Improvements to printed circuit board connections |
| 03/27/2002 | EP1191635A2 Interconnect structure |
| 03/27/2002 | EP1191555A2 Formation of an embedded capacitor plane using a thin polyimide dielectric |
| 03/27/2002 | EP1191551A2 Resistor component with multiple layers of resistive material |
| 03/27/2002 | EP1191550A2 Resistor component with multiple layers of resistive material |
| 03/27/2002 | EP1190609A1 Microfiber dielectrics which facilitate laser via drilling |
| 03/27/2002 | EP1190608A1 Porous power and ground planes for reduced pcb delamination and better reliability |
| 03/27/2002 | EP1190606A1 High density substrate and methods for manufacturing same |
| 03/27/2002 | EP1189849A1 Sizing compositions, fiber strands, fabrics and methods for cleaning sized fiber glass strands |
| 03/27/2002 | EP1106040B1 Method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections |
| 03/27/2002 | EP0947124B1 A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion |
| 03/27/2002 | EP0730815B1 High capacitance sheet adhesives and process for making the same |
| 03/27/2002 | CN2483937Y Flexible circuit board |
| 03/27/2002 | CN1342041A Electronic device of sealed electronic element and manufacturing method and printed wiring board |
| 03/27/2002 | CN1342040A Method for applying gluewater on circuit board carrier and circuit board manufactured according to this method |
| 03/27/2002 | CN1342035A Circuit device and its manufacturing method |
| 03/27/2002 | CN1081808C Module structure and electronic device |
| 03/27/2002 | CN1081658C Laminate struction compirsing at least one crued polyphenylene ether resin composition layer |
| 03/27/2002 | CA2321010A1 Process for producing a printed circuit |
| 03/26/2002 | US6362997 Memory system for use on a circuit board in which the number of loads are minimized |
| 03/26/2002 | US6362996 Terminating circuit module used in a computer system |
| 03/26/2002 | US6362974 Stacked processor construction and a method for producing same |
| 03/26/2002 | US6362973 Multilayer printed circuit board with placebo vias for controlling interconnect skew |
| 03/26/2002 | US6362969 Arrangement for supporting a circuit board |
| 03/26/2002 | US6362968 Computer system motherboard stiffener |