Patents for H05K 1 - Printed circuits (98,583)
04/2002
04/10/2002EP1195746A2 Semiconductor device, semiconductor module and hard disk
04/10/2002EP1195629A2 Flexible circuits with strain relief
04/10/2002EP1195356A1 Composite metal titanate in plate form and method for preparation thereof
04/10/2002EP1195082A2 Printed circuit fabrication
04/10/2002EP1195081A1 Transition between asymmetric stripline and microstrip in cavity
04/10/2002EP1195080A1 Transition between symmetric stripline and asymmetric stripline
04/10/2002EP1195079A1 An arrangement for mounting chips in multilayer printed circuit boards
04/10/2002EP1194978A1 Electrical transmission arrangement
04/10/2002EP1194955A1 High-density electronic package, and method for making same
04/10/2002EP1194857A1 Method for marking a hardware variant of an electrical or electronic hardware unit
04/10/2002EP1046198B1 Electric connector
04/10/2002EP0692137B1 Compositions and methods for providing anisotropic conductive pathways and bonds between two sets of conductors
04/10/2002CN2485915Y Back inserting needle for circuit board
04/10/2002CN1344133A Mfg. method of circuit device
04/10/2002CN1344046A Card edge inserting assembly
04/10/2002CN1344036A Flat type LED and mfg. method thereof
04/10/2002CN1344025A Distribution base, its mfg. method, displaying device and electronic device
04/10/2002CN1082783C Multilayer printed circuit boards
04/10/2002CN1082705C Electrically conductive paste
04/09/2002US6370292 Printed circuit board and method for its manufacture
04/09/2002US6370291 Printed circuit board waveguide
04/09/2002US6370257 Apparatus including an electroacoustic transducer having terminal contacts which extend in the direction of the transducer axis and including a printed circuit board having mating contacts
04/09/2002US6370053 Memory address driver circuit
04/09/2002US6370034 Printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices
04/09/2002US6370033 Electronic device having printed circuit board joined to cavity resonance filter
04/09/2002US6370032 Compliant microelectronic mounting device
04/09/2002US6370030 Device and method in electronics systems
04/09/2002US6370027 Semiconductor module and heat sink used in such module
04/09/2002US6370013 Electric element incorporating wiring board
04/09/2002US6370012 Capacitor laminate for use in printed circuit board and as an interconnector
04/09/2002US6370010 Multi-layer capacitor, wiring board, and high-frequency circuit
04/09/2002US6369877 System, method and article of manufacture for direct image processing of printed circuit boards
04/09/2002US6369595 CSP BGA test socket with insert and method
04/09/2002US6369445 Method and apparatus for edge connection between elements of an integrated circuit
04/09/2002US6369444 Packaging silicon on silicon multichip modules
04/09/2002US6369383 Flexboard reflector
04/09/2002US6369336 Printed circuit board
04/09/2002US6369335 Mother substrate, substrate element and method for manufacturing the same
04/09/2002US6369334 Printed circuit board with wire adds and component adds having 7-shaped and semicircular terminations
04/09/2002US6369333 Flexible connection system
04/09/2002US6369332 Metal-base multilayer circuit substrate with heat conducting adhesive
04/09/2002US6368980 Resist mark having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer and method for manufacturing semiconductor wafer having it
04/09/2002US6368698 Base webs for printed circuit board production using the foam process and acrylic fibers
04/09/2002US6368378 Paste to be fired for forming circuit board and method for preparing surface-modified silver powder
04/09/2002US6368146 Alignment mechanism for a high density electrical connector
04/09/2002US6368142 Interlayer connection structure
04/09/2002US6368115 Method and apparatus for connecting circuit boards
04/09/2002US6367678 Process for stacking layers that form a multilayer printed circuit
04/04/2002WO2002028155A1 Low-inductance connector for printed-circuit board
04/04/2002WO2002027786A1 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
04/04/2002WO2002011506A3 Vapor chamber with integrated pin array
04/04/2002WO2002003766A3 Process for thick film circuit patterning
04/04/2002WO2001096990A3 Usb-compliant personal key using a smartcard processor and a smartcard reader emulator
04/04/2002WO2001095435A3 Multiple function high current interconnect with integrated bus bar
04/04/2002WO2001093324A3 Substrate adapted to accommodate a circuit configuration and method for producing the same
04/04/2002WO2001089275A3 Electrically connecting integrated circuits and transducers
04/04/2002WO2001063985A3 Electronic supports and methods and apparatus for forming apertures in electronic supports
04/04/2002US20020040104 Vinyl-terminated polybutadiene and butadiene-styrene copolymers containing urethane and/or ester residues, and the electrical laminates obtained therefrom
04/04/2002US20020040085 Polymer matrix composites
04/04/2002US20020040082 Polymeric coating compositions, polymer coated substrates,and methods of making and using the same
04/04/2002US20020039854 IC socket
04/04/2002US20020039847 Grid interposer
04/04/2002US20020039667 Composite magnetic material and magnetic molding material, magnetic powder compression molding material, and magnetic paint using the composite magnetic material, composite dielectric material and molding material, powder compression molding material, paint, prepreg, and substrate using the composite dielectric material, and electronic part
04/04/2002US20020039662 Non-silicone conductive paste for the electrical industry, and its use
04/04/2002US20020039645 Capable of being fired at low temperature; non-oxide ceramic filler and borosilicate glass having a glass transition temperature of 800 degrees C. or lower
04/04/2002US20020039644 Particularly, it relates to a printed wiring board for a very thin ball grid array type plastic package.
04/04/2002US20020039464 Optical reflective structures and method for making
04/04/2002US20020039267 Wiring board and electronic equipment
04/04/2002US20020039023 Inductive sensor
04/04/2002US20020038797 Arrangement for heating an assembled printed circuit board
04/04/2002US20020038725 Circuit board and production of the same
04/04/2002US20020038724 Chip scale package, printed circuit board, and method of designing a piinted circuit board
04/04/2002US20020038723 Mounting mechanism of metal plate on printed board
04/04/2002US20020038721 Wiring circuit board having bumps and method of producing same
04/04/2002US20020038582 Impregnating filler with polyarylene ether; melting; uniformdispersion
04/04/2002US20020038506 Manufacturing method of head arm assembly
04/04/2002DE10045072A1 Verfahren zur Herstellung einer elektrisch leitfähigen Struktur auf einer nichtplanen Oberfläche und Verwendung des Verfahrens A process for producing an electrically conductive pattern on a non-planar surface, and using the method
04/04/2002DE10040303A1 Circuit board production method, involves providing sounding pads connected to metallic edge of respective inside layer and sounding drilling in area of pads determining depth of inside layer
04/03/2002EP1194022A1 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board
04/03/2002EP1194021A2 Method of producing multilayer printed wiring board and multilayer printed wiring board
04/03/2002EP1193811A1 Electrical connector
04/03/2002EP1193803A1 IC socket
04/03/2002EP1193757A2 Conductive metal particles, conductive composite metal particles and applied products using the same
04/03/2002EP1193750A2 Micro soldering method and apparatus
04/03/2002EP1193280A1 Polyimide resin, resin composition with improved moisture resistance comprising the same, adhesive solution, filmy bonding member, layered adhesive film, and processes for producing these
04/03/2002EP1193050A1 Hydrolysis resistant, transparent, biaxially oriented film made from a crystallizable thermoplastic, and method for its preparation
04/03/2002EP1193040A1 Injection moulded plastic element and use
04/03/2002EP1192842A1 A method and an arrangement for the electrical contact of components
04/03/2002EP1192841A1 Intelligent power module
04/03/2002EP1192682A1 Ablative method for forming rf ceramic block filters
04/03/2002EP1192502A1 A display module
04/03/2002EP1192199A1 Phenol-novolacs with improved optical properties
04/03/2002EP0950271B1 Component for contacting a measuring unit and method for its production
04/03/2002EP0834242B1 Connection substrate
04/03/2002CN2484719Y Ceramic circuit-board of condenser-grid sensor in digital-display measuring device
04/03/2002CN1343440A Method and arrangement for electrical contact of componnets
04/03/2002CN1343365A Arrangement for enabling trimming on substrate and method of producing substrate that enables trimming
04/03/2002CN1343090A Connection method for printing insulating layer of laminated electronic device
04/03/2002CN1343089A Printed circuit board with channel and manufacturing method thereof
04/03/2002CN1343087A 线路板 PCB