| Patents for H05K 1 - Printed circuits (98,583) |
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| 04/24/2002 | CN1346513A Metal core substrate printed wiring board enabling thermally enhanced ball grid array (BGA) packages and method |
| 04/24/2002 | CN1346309A Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
| 04/24/2002 | CN1346180A 电路器件 Circuit devices |
| 04/24/2002 | CN1346177A Method for making RF module element iwth sound wave surface wave unit |
| 04/24/2002 | CN1346149A Chip size plug-in piece, printed circuit board and method for designing printed circuit board |
| 04/24/2002 | CN1346147A Circuit board with convex and making method thereof |
| 04/24/2002 | CN1083684C 印刷电路板 A printed circuit board |
| 04/23/2002 | US6377469 Housing having a back panel with conductive interconnects |
| 04/23/2002 | US6377468 Electric circuit apparatus |
| 04/23/2002 | US6377462 Circuit board assembly with heat sinking |
| 04/23/2002 | US6377457 Electronic assembly and cooling thereof |
| 04/23/2002 | US6377425 One-piece load beam and gimbal flexure using flexible circuit |
| 04/23/2002 | US6377142 Voltage tunable laminated dielectric materials for microwave applications |
| 04/23/2002 | US6376991 Circuit assembly for inclusion within fluorescent lamp |
| 04/23/2002 | US6376921 Semiconductor device, method for fabricating the semiconductor device, lead frame and method for producing the lead frame |
| 04/23/2002 | US6376917 Semiconductor device |
| 04/23/2002 | US6376908 Semiconductor plastic package and process for the production thereof |
| 04/23/2002 | US6376782 Resinous circuit board with pins improved in joining strength |
| 04/23/2002 | US6376779 Printed circuit board having a plurality of spaced apart scrap border support tabs |
| 04/23/2002 | US6376776 Circuit board holder |
| 04/23/2002 | US6376769 High-density electronic package, and method for making same |
| 04/23/2002 | US6376263 Non-destructive module placement verification |
| 04/23/2002 | US6376134 Automated, flow-through, dual side, laser direct imaging process and apparatus which provides capability to simultaneously register and image both sides of substrate in continuous flow-through process |
| 04/23/2002 | US6376055 Composition for ceramic substrate and ceramic circuit component |
| 04/23/2002 | US6376053 Inter-laminar adhesive film for multi-layer printed wiring board and multi-layer printed wiring board using the same |
| 04/23/2002 | US6376008 Resin/copper/metal laminate and method of producing same |
| 04/23/2002 | US6375868 Method for manufacturing paste for electroconductive thick film, paste for electroconductive thick film and laminated ceramic electronic part |
| 04/23/2002 | US6375866 Electroconductive silver and silver-coated copper flakes; curing binder and crosslinking agent; electromagnetic and radio frequency interference shielded housings of electronics and printing plates; durability, bonding strength |
| 04/23/2002 | US6375708 W-cu-ni alloy formed by direct sintering of a powder blend which eliminates the formation of brittle intermetallics and slumping |
| 04/23/2002 | US6375344 Data capture system with communicating and recharging docking apparatus and hand-held data terminal means cooperable therewith |
| 04/23/2002 | US6374733 Method of manufacturing ceramic substrate |
| 04/23/2002 | CA2205528C Data processing apparatus and method of data transmission of data processing apparatus |
| 04/18/2002 | WO2002032199A1 Printed circuit board and method for producing a printed circuit board of this type and for producing a laminar composite material for such a printed circuit board |
| 04/18/2002 | WO2002032198A2 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device |
| 04/18/2002 | WO2002032193A1 Method and structure for substrate having inserted electrodes for flat display device and the device using the structure |
| 04/18/2002 | WO2002031566A1 Printed circuit board with optical layers consisting of glass |
| 04/18/2002 | WO2002031563A1 Deflected coupling out of light guides which are embedded in a printed circuit board |
| 04/18/2002 | WO2002031562A1 Position fixing in printed circuit boards |
| 04/18/2002 | WO2002031449A1 Ceramic resistor card assembly for fuel sensor |
| 04/18/2002 | WO2002031068A1 Ink-jet ink and process for producing the same |
| 04/18/2002 | WO2002031054A1 Curable composition, varnish, and layered product |
| 04/18/2002 | WO2002030636A1 Circuit board production method and circuit board production data |
| 04/18/2002 | WO2002008347A3 Resist ink composition |
| 04/18/2002 | WO2002005606A3 Closed-grid bus architecture for wafer interconnect structure |
| 04/18/2002 | WO2001063994A3 Tamper proof case for electronic devices having memories with sensitive information |
| 04/18/2002 | US20020046342 Secure IR communication between a keypad and a token |
| 04/18/2002 | US20020045705 Unsaturated aromatic monomers such as dibromostyrene, styrene, divinylbenzene, meta-diisopropenylbenzene, and alpha-methylstyrene. |
| 04/18/2002 | US20020045532 A dielectric ceramics comprising an oxide containing, as a metal element, at least a rare earth element (Lanthenide), Aluminum, calcium or strontium and titanium, aluminum being present as cystal phase of beta and/or theata alumina |
| 04/18/2002 | US20020045394 Wiring board and a process of producing a wiring board |
| 04/18/2002 | US20020045370 Apparatus for routing a flexible circuit |
| 04/18/2002 | US20020045367 On-board type connector |
| 04/18/2002 | US20020045346 Formation of diamond particle interconnects |
| 04/18/2002 | US20020045281 Alignment check method on printed circuit board |
| 04/18/2002 | US20020045058 Injection-molded plastic part |
| 04/18/2002 | US20020045054 From a polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4'-oxydianiline and 22 to 78 mol % of 3,4'-oxydianiline, based on the overall diamine. |
| 04/18/2002 | US20020045042 Good adhesion of metal layer on surface of insulation activated by plasma treatment; molded circuit substrates |
| 04/18/2002 | US20020045033 Polyimide film, method of manufacture , and metal interconnect board with Polyimide film substrate |
| 04/18/2002 | US20020044441 Organic electronicluminescent (EL) device |
| 04/18/2002 | US20020044433 Converter device |
| 04/18/2002 | US20020044431 Microchip controller board and manufacturing method thereof |
| 04/18/2002 | US20020044423 Method and apparatus for mounting and packaging electronic components |
| 04/18/2002 | US20020044402 Noise eliminating apparatus of high-frequency transmission system |
| 04/18/2002 | US20020044401 Multi-functional energy conditioner |
| 04/18/2002 | US20020044329 Electrooptical unit and electronic apparatus |
| 04/18/2002 | US20020044215 Solid-state imaging apparatus and camera using the same |
| 04/18/2002 | US20020044033 Waveguide coupler |
| 04/18/2002 | US20020044030 Radio frequency module parts including surface elastic wave elements and manufacturing method thereof |
| 04/18/2002 | US20020044022 Oscillator and an oscillator characteristic adjustment method |
| 04/18/2002 | US20020043986 Ball grid array chip packages having improved testing and stacking characteristics |
| 04/18/2002 | US20020043718 Sockets for module extension and memory system using same |
| 04/18/2002 | US20020043556 Low-cost high-density gang-punch |
| 04/18/2002 | US20020043402 Printed circuit board with integral heat sink for semiconductor package |
| 04/18/2002 | US20020043400 Semiconductor device |
| 04/18/2002 | US20020043399 Multilayered wiring board, a production process for, and semiconductor device using, the same |
| 04/18/2002 | US20020043398 Conductive plastic, conductive circuits formed thereof, and method of forming the conductive circuits |
| 04/18/2002 | US20020043396 Connection method and connection structure of pad electrodes, and inspecting methods for connection state thereof |
| 04/18/2002 | US20020043395 Via connector and method of making same |
| 04/18/2002 | DE10051337A1 Semiconductor module used in electronic devices comprises a conductor plate having a lower insulation layer connected to a conducting layer via a device for shutting off the potential |
| 04/18/2002 | DE10047897A1 Electronic subassembly e.g. for SMD-components, has metal bridges/webs embedded in electrically-insulating material of assembly board |
| 04/18/2002 | DE10029630C2 Vorrichtung zum Schutz von elektronischen Baugruppen gegen Zerstörung durch elektrostatische Entladung Device for protecting electronic components against damage caused by electrostatic discharge |
| 04/17/2002 | EP1198165A2 Shielding method using a ferrite encapsulate coating |
| 04/17/2002 | EP1198161A1 Method for securing and processing thin film materials |
| 04/17/2002 | EP1198037A2 Apparatus for routing a flexible circuit |
| 04/17/2002 | EP1198031A2 Connector with reinforcing structure for securing the connector housing to a circuit board |
| 04/17/2002 | EP1197998A2 Antireflective porogens |
| 04/17/2002 | EP1197514A1 Incombustible resin composition, prepreg, laminated plate, metal-clad laminated plate, printed wiring board and multi-layer printed wiring board |
| 04/17/2002 | EP1197131A1 A via connector and method of making same |
| 04/17/2002 | EP1197130A1 Circuitry with integrated passive components and method for producing same |
| 04/17/2002 | EP1197129A2 Polybutadiene and polyisoprene based thermosetting compositions and method of manufacture |
| 04/17/2002 | EP1197128A1 A printed circuit board |
| 04/17/2002 | EP1196960A1 Electrical transmission arrangement |
| 04/17/2002 | EP1196830A1 A printed circuit production method |
| 04/17/2002 | EP1196820A2 Method for production of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 04/17/2002 | EP1196798A1 Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 04/17/2002 | EP1196463A1 Epoxy resin prepared from p-hydroxystyrene having high functionality, low melt viscosity with high glass transition temperature |
| 04/17/2002 | CN1345508A Vertical buzzer/earphone to reduce humming sounds |
| 04/17/2002 | CN1345388A Woven fabric reinforcement to optimize dimensional stability of laminated composite structures, including products for electrical and electronic applications |
| 04/17/2002 | CN1345176A Manufacture of modular board |
| 04/17/2002 | CN1345033A Magnetic head gimbal assembly |
| 04/17/2002 | CN1083115C Castable composition and rough dielectric sheet |