| Patents for H05K 1 - Printed circuits (98,583) |
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| 05/21/2002 | US6389940 Gang punch tool assembly |
| 05/21/2002 | US6389686 Process for fabricating a thin multi-layer circuit board |
| 05/16/2002 | WO2002039802A2 Methods of positioning components using liquid prime movers and related structures |
| 05/16/2002 | WO2002039799A1 Hybrid circuit for the control of electric motors that uses the cover of the reduction gear as heat dissipator |
| 05/16/2002 | WO2002039797A1 A dielectric spacing layer |
| 05/16/2002 | WO2002039796A1 Definable integrated passives for circuitry |
| 05/16/2002 | WO2002039794A2 System and method for fabricating printed circuit boards |
| 05/16/2002 | WO2002039793A2 Multi-layer printed circuit board fabrication system and method |
| 05/16/2002 | WO2002039498A2 Methods and systems for positioning substrates |
| 05/16/2002 | WO2002038318A1 Method for defined mechanical drilling of electric printed circuit boards or printed circuit board stacks and drilling support for use in this method |
| 05/16/2002 | WO2002023963A3 Method and apparatus for surface mounting electrical devices |
| 05/16/2002 | US20020058720 Preparing polymer having a micro-domain structure made up of a continuous phase comprising a polyimide precursor and discontinuous phase of dispersible compound; removing dispersible compound; converting precursor to polyimide |
| 05/16/2002 | US20020058449 Articles having defined surface profiles formed from fabrics comprising resin compatible yarn |
| 05/16/2002 | US20020058428 Circuit-board connecting terminal |
| 05/16/2002 | US20020058427 Electrical card connector for solderlessly electrically connecting to a printed circuit board |
| 05/16/2002 | US20020058396 Use of a reference fiducial on a semiconductor package to monitor and control a singulation method |
| 05/16/2002 | US20020058356 Semiconductor package and mount board, and mounting method using the same |
| 05/16/2002 | US20020058347 Semiconductor package with a controlled impedance bus and method of forming same |
| 05/16/2002 | US20020058140 Glass fiber coating for inhibiting conductive anodic filament formation in electronic supports |
| 05/16/2002 | US20020058137 Dielectric spacing layer |
| 05/16/2002 | US20020058131 Reducing warpage by use of low temperature sinterable ceramic and an inorganic particle which constrains the shrinkage and which is not sintered at a sintering temperature |
| 05/16/2002 | US20020057559 PCB structure for regulating constant power source and strengthening ground connections |
| 05/16/2002 | US20020057557 Circuit unit and method of producing same |
| 05/16/2002 | US20020057556 Deformation-resistant mounting structure of portable device |
| 05/16/2002 | US20020057555 Electronic unit |
| 05/16/2002 | US20020057554 Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate |
| 05/16/2002 | US20020057224 Portable communication terminal with reduced specific absorption rate |
| 05/16/2002 | US20020057171 Apparatus and method for pcb winding planar magnetic devices |
| 05/16/2002 | US20020057158 Surface-mount type switching power supply unit and mounting method for the same |
| 05/16/2002 | US20020057144 Print board and electronic device equipped with the print board |
| 05/16/2002 | US20020057137 Electromagnetic coupler flexible circuit |
| 05/16/2002 | US20020057136 Electromagnetic coupler circuit board |
| 05/16/2002 | US20020057029 Coil holder |
| 05/16/2002 | US20020056922 Semiconductor device, production method thereof, and coil spring cutting jig and coil spring guiding jig applied thereto |
| 05/16/2002 | US20020056890 Formation of a metallic interlocking structure |
| 05/16/2002 | US20020056571 Process for producing printed circuits and printed circuits thus obtained |
| 05/16/2002 | US20020056509 Manufacturing method of wiring board, and conductive paste used therein |
| 05/16/2002 | US20020056192 Method of producing multilayer printed wiring board and multilayer printed wiring board |
| 05/16/2002 | US20020056191 Method of suppressing the oxidation characteristics of nickel |
| 05/16/2002 | DE10152408A1 System for automatic mounting of electronic components onto a circuit board uses camera scanning of board |
| 05/16/2002 | DE10141910A1 Glass ceramic sintered product used as an insulating substrate in circuit boards consists of a gahnite crystal phase, a celsian crystal phase containing needle-like crystals and a further crystal phase |
| 05/16/2002 | DE10132543A1 Heisserhärtende fluorierte Dielektrika und mehrschichtige Leiterplatten Heisserhärtende fluorinated dielectrics and multilayer printed circuit boards |
| 05/16/2002 | DE10132235A1 Solid-state imaging device manufacturing method incorporates electrical imaging testing function |
| 05/16/2002 | DE10105163A1 Verfahren und Anordnung zum Kontaktieren von auf Sunbstratfolien angeordneten metallischen Kontaktflächen Method and apparatus for contacting arranged on Sunbstratfolien metallic contact surfaces |
| 05/16/2002 | DE10030144A1 Halbleitervorrichtung und zugehörige Einbaustruktur Semiconductor device and associated mounting structure |
| 05/15/2002 | EP1206171A2 Circuit board and method for manufacturing the same |
| 05/15/2002 | EP1206170A1 Bonded structure and electronic circuit board |
| 05/15/2002 | EP1205950A1 Coil holder |
| 05/15/2002 | EP1205804A2 Photosensitive resin composition and circuit board |
| 05/15/2002 | EP1205512A1 Process for producing porous polymide |
| 05/15/2002 | EP1205350A2 Steering column switch |
| 05/15/2002 | EP1205094A1 Component for assembly on a printed circuit board |
| 05/15/2002 | EP1205093A1 Printed circuit substrate with controlled placement covercoat layer |
| 05/15/2002 | EP1205005A1 Microstrip for microwave applications |
| 05/15/2002 | EP1204698A1 Impregnated glass fiber strands and products including the same |
| 05/15/2002 | EP1204697A1 Impregnated glass fiber strands and products including the same |
| 05/15/2002 | EP1204696A1 Impregnated glass fiber strands and products including the same |
| 05/15/2002 | EP1204613A1 Impregnated glass fiber strands and products including the same |
| 05/15/2002 | EP0956538B1 Modular data medium |
| 05/15/2002 | EP0798779B1 Ceramic circuit board |
| 05/15/2002 | CN1349573A Glass cloth and printed wiring board |
| 05/15/2002 | CN1349375A Method for fixing and treating film material |
| 05/15/2002 | CN1349374A Anti-jamming printed circuit board package and its combined inserting structure |
| 05/15/2002 | CN1349287A 电连接器 The electrical connector |
| 05/15/2002 | CN1349258A High density design for organic chip carrier |
| 05/15/2002 | CN1349195A 光学鼠标 Optical Mouse |
| 05/15/2002 | CN1348976A Binder and adhesive film |
| 05/15/2002 | CN1085035C Chemically grafted electrical device |
| 05/15/2002 | CN1084917C Electrically conductive paste materials and applications |
| 05/14/2002 | US6388895 Telecommunication main distribution frame structure |
| 05/14/2002 | US6388890 Technique for reducing the number of layers in a multilayer circuit board |
| 05/14/2002 | US6388889 Electrical connector housing |
| 05/14/2002 | US6388888 Semiconductor device and process for manufacturing the same, liquid crystal module and process for mounting the same |
| 05/14/2002 | US6388886 Semiconductor memory module and module system |
| 05/14/2002 | US6388883 Lead out structure for lead circuit section of flexible printed circuitry |
| 05/14/2002 | US6388636 Circuit module |
| 05/14/2002 | US6388339 Sealed-by-resin type semiconductor device and liquid crystal display module including the same |
| 05/14/2002 | US6388325 Multi-layer interconnect |
| 05/14/2002 | US6388230 Laser imaging of thin layer electronic circuitry material |
| 05/14/2002 | US6388208 Multi-connection via with electrically isolated segments |
| 05/14/2002 | US6388207 Electronic assembly with trench structures and methods of manufacture |
| 05/14/2002 | US6388206 Microcircuit shielded, controlled impedance “Gatling gun”via |
| 05/14/2002 | US6388205 Printed circuit board with shielded circuitry |
| 05/14/2002 | US6388203 Controlled-shaped solder reservoirs for increasing the volume of solder bumps, and structures formed thereby |
| 05/14/2002 | US6388201 Wired circuit board |
| 05/14/2002 | US6388200 Electronic interconnection medium having offset electrical mesh plane |
| 05/14/2002 | US6388198 Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
| 05/14/2002 | US6388046 Mixture containing thermoplastic resin |
| 05/14/2002 | US6388009 Controlling concentration of curing agents |
| 05/14/2002 | US6387990 Blend containing thermoplastic resin |
| 05/14/2002 | US6387830 Multilayer laminate |
| 05/14/2002 | US6387731 Method and apparatus for reducing BGA warpage caused by encapsulation |
| 05/14/2002 | US6387579 Method for direct image processing of printed circuit boards |
| 05/14/2002 | US6387507 Microelectronic package comprising high temperature co-fired ceramic body mated to low temperature co-fired ceramic body by bonding layer comprising electrically nonconductive portion and plurality of electrically conductive portions |
| 05/14/2002 | US6387505 Prepreg which is composed of mixture of polycarbodiimide resin and epoxy resin and which has film shape |
| 05/14/2002 | US6387205 Coating multilayer thermosetting resin on cloth fibers; curing |
| 05/14/2002 | US6386708 Projection display device |
| 05/14/2002 | CA2093528C Electrical connectors |
| 05/14/2002 | CA2062546C Microwave transceiver using technique of multilayer printed circuits |
| 05/10/2002 | WO2002037915A1 Electronic device for a motor vehicle |