| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/30/2002 | US6380754 Removable electrical interconnect apparatuses including an engagement proble |
| 04/30/2002 | US6380662 Piezoelectric oscillator |
| 04/30/2002 | US6380624 Stacked integrated circuit structure |
| 04/30/2002 | US6380616 Semiconductor component with a number of substrate layers and at least one semiconductor chip, and method of producing the semiconductor component |
| 04/30/2002 | US6380608 Multiple level spiral inductors used to form a filter in a printed circuit board |
| 04/30/2002 | US6380563 Opto-electric mounting apparatus |
| 04/30/2002 | US6380493 Circuit board |
| 04/30/2002 | US6380485 Enhanced wire termination for twinax wires |
| 04/30/2002 | US6380347 Nanoporous polymers comprising macrocycles |
| 04/30/2002 | US6380344 A cyanate ester composition comprising a cyanate ester in which the total content of imino carbonates, alkyl cyanamides, partially substituted cyanates and phenols as impurites is 5% or less, an epoxy resin, and a curing catalyst |
| 04/30/2002 | US6380343 Applying a curable resin to the flexible circuit which is polybutadiene polyol with a number-average molecular weight of 1,000-8,000 and having 2-10 hydroxy groups per molecuale, and a polybutadiene blocked polyisocyanate, and curing |
| 04/30/2002 | US6380076 Dielectric filling of electrical wiring planes |
| 04/30/2002 | US6380059 Method of breaking electrically conductive traces on substrate into open-circuited state |
| 04/30/2002 | US6380002 Method for fabricating a flexible substrate based ball grid array (BGA) package |
| 04/30/2002 | US6379800 Glyoxal-phenolic condensates with enhanced fluorescence |
| 04/30/2002 | US6379784 Aromatic polyimide laminate |
| 04/30/2002 | US6379781 Sheet shaped composite; conductive metal wires |
| 04/30/2002 | US6379772 Avoiding polymer fill of alignment sites |
| 04/30/2002 | US6379745 Applying conductor pattern to substrate; heating |
| 04/30/2002 | US6379193 Substrate connector assembly for a computer system |
| 04/30/2002 | US6379157 Communication connector with inductive compensation |
| 04/30/2002 | US6378424 Electronic part fabricated by intaglio printing and a method for fabricating the same |
| 04/30/2002 | US6378201 Method for making a printed circuit board |
| 04/30/2002 | US6378199 Multi-layer printed-wiring board process for producing |
| 04/25/2002 | WO2002034024A1 Sealed housing chamber for a motor vehicle electronic component and method for production thereof |
| 04/25/2002 | WO2002034023A1 Circuit forming board producing method, circuit forming board, and material for circuit forming board |
| 04/25/2002 | WO2002034022A1 Module support for electrical/electronic components |
| 04/25/2002 | WO2002034021A2 Carrier-based electronic module |
| 04/25/2002 | WO2002034020A1 An integrated circuit carrier |
| 04/25/2002 | WO2002034019A1 Method of manufacturing an integrated circuit carrier |
| 04/25/2002 | WO2002034018A1 A multi-chip integrated circuit carrier |
| 04/25/2002 | WO2002033798A1 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 04/25/2002 | WO2002033752A2 Electronic module having canopy-type carriers |
| 04/25/2002 | WO2002033557A2 Single-source or single-destination signal routing |
| 04/25/2002 | WO2002033492A1 Nonlinear image distortion correction in printed circuit board manufacturing |
| 04/25/2002 | WO2002032665A1 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article |
| 04/25/2002 | WO2002032503A1 Implantable medical device employing integral housing for a formable flat battery |
| 04/25/2002 | WO2002012114A3 Ceramic microelectromechanical structure |
| 04/25/2002 | WO2001080574A3 Splitter architecture for a telecommunication system |
| 04/25/2002 | WO2001065344A3 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 04/25/2002 | US20020049270 Less anisotropic films |
| 04/25/2002 | US20020049264 Epoxy resin composition, prepreg and metal-clad laminate |
| 04/25/2002 | US20020049042 RF module |
| 04/25/2002 | US20020049000 Battery connector |
| 04/25/2002 | US20020048977 Device connection method and structure thereof |
| 04/25/2002 | US20020048974 Electrical component housing structures and their method of manfacture |
| 04/25/2002 | US20020048973 Contact structure and production method thereof and probe contact assembly using same |
| 04/25/2002 | US20020048954 Contact structure and production method thereof and probe contact assembly using same |
| 04/25/2002 | US20020048927 Embedded capacitor multi-chip modules |
| 04/25/2002 | US20020048705 An anode thin film for a lithium secondary battery having a current collector and an anode active material layer formed therebetween, and active material layer is multiple layer thin film of silicon layer and silver layer |
| 04/25/2002 | US20020048666 Multilayered ceramic board, method for fabricating the same, and electronic device using multilayered ceramic board |
| 04/25/2002 | US20020048632 Polymer-wrapped single wall carbon nanotubes |
| 04/25/2002 | US20020048630 Constructed to prevent corners from peeling and raising off a substrate; has a spiral configuration and includes straight lines and corners connected to the straight lines. |
| 04/25/2002 | US20020048309 Method and apparatus for testing a temperature sensor |
| 04/25/2002 | US20020048159 Surface-mountable impedance device |
| 04/25/2002 | US20020048157 Memory module having series-connected printed circuit boards |
| 04/25/2002 | US20020048156 Flexible wiring substrate and its manufacturing method |
| 04/25/2002 | US20020048153 Electronic assembly and cooling thereof |
| 04/25/2002 | US20020048137 Two-layered embedded capacitor |
| 04/25/2002 | US20020047978 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
| 04/25/2002 | US20020047956 Display apparatus |
| 04/25/2002 | US20020047773 Resistor component with multiple layers of resistive material |
| 04/25/2002 | US20020047772 Electrical-resistant via hole and process of fabricating the same |
| 04/25/2002 | US20020047771 Resistor component with multiple layers of resistive material |
| 04/25/2002 | US20020047768 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device |
| 04/25/2002 | US20020047749 Chip element mounting method and surface-mount type crystal oscillator |
| 04/25/2002 | US20020047720 CSP BGA test socket with insert and method |
| 04/25/2002 | US20020047586 Plasma display device with alternately arranged sustain electrodes |
| 04/25/2002 | US20020047504 Solder-bonding structure and brushless motor having the same |
| 04/25/2002 | US20020047197 Semiconductor device module frame and group thereof |
| 04/25/2002 | US20020047193 Circuit carrier, in particular printed circuit board |
| 04/25/2002 | US20020047133 Chip carrier film, method of manufacturing the chip carrier film and liquid crystal dispaly using the chip carrier film |
| 04/25/2002 | US20020047109 Conductive paste |
| 04/25/2002 | US20020047092 Transmission line parasitic element discontinuity cancellation |
| 04/25/2002 | US20020047038 Circuit board bonding method, branch circuit and its designing method, waveguide-microstrip transition, and application to HF circuit, antenna and communication system |
| 04/25/2002 | US20020046881 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 04/25/2002 | US20020046878 Printed wiring board mounting structure |
| 04/25/2002 | US20020046872 Polymer-wrapped single wall carbon nanotubes |
| 04/25/2002 | DE10143919A1 Electroconductive paste for forming through hole conductor, contains organic vehicle containing solvent and binder spherical/granular form electroconductive metal powder, and resin powder having low water absorptivity |
| 04/25/2002 | DE10127268A1 Printed circuit board as a circuit carrier with two metal outer layers and a metal intermediate layer has insulating layers between the outer and intermediate layers with a cooling component on an outer layer linked via a heat path. |
| 04/25/2002 | DE10054088C1 Kunststoff-Spritzgussteil und Verwendung Plastic injection molding and using |
| 04/25/2002 | DE10052247A1 Schaltungsstrukturen auf thermisch gespritzten Schichten Circuit patterns on thermally sprayed coatings |
| 04/25/2002 | DE10051884A1 Verfahren zur Herstellung von Leiterfolie-Trägergehäuse-Einheiten A process for the production of printed circuit film carrier housing units |
| 04/25/2002 | DE10051547A1 Mounting rack for electrical or electronic components, comprises at least one conduction web with small thermal conduction selection |
| 04/25/2002 | DE10050856A1 Arrangement for preventing or limiting propagation of HF interference over electric line carrying DV voltage or DC or low frequency AC voltage or AC, has line joined to line loaded with reference potential via capacitance |
| 04/25/2002 | CA2425946A1 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node |
| 04/25/2002 | CA2425708A1 Implantable medical device employing integral housing for a formable flat battery |
| 04/24/2002 | EP1199915A2 Circuit structures on thermally sprayed layers |
| 04/24/2002 | EP1199913A2 Method for making units comprising a circuit foil and a carrier housing |
| 04/24/2002 | EP1199912A2 Carrier structure for spatial shaping of a circuit foil and method therefor |
| 04/24/2002 | EP1199775A2 Method of electrically connecting two devices and structure therefore |
| 04/24/2002 | EP1199746A2 Resin-moulded semiconductor device with heat radiating electrode |
| 04/24/2002 | EP1199588A1 Optoelectronic substrate, circuit board, and method of manufacturing optoelectronic substrate |
| 04/24/2002 | EP1199328A1 Thermally conductive polymer sheet |
| 04/24/2002 | EP1198977A1 Electric load |
| 04/24/2002 | EP1198860A1 Electrical transmission arrangement |
| 04/24/2002 | EP1198831A1 Method for selectively coating ceramic surfaces |
| 04/24/2002 | EP1198532A1 Dielectric material including particulate filler |
| 04/24/2002 | CN1346536A Predistortion generator coupled with RF amplifier |
| 04/24/2002 | CN1346524A Inverted microstrip transmission line integrated in a multilayers structure |