Patents for H05K 1 - Printed circuits (98,583)
05/2002
05/28/2002US6394836 Terminal connection structure of flat circuit belt
05/28/2002US6394835 Wiring unit with paired in-line insulation displacement contacts
05/28/2002US6394281 Hermetic sealing
05/28/2002US6393696 Method for manufacturing printed circuit board
05/23/2002WO2002041676A1 Method for increasing the dielectric rigidity and insulating resistance between printed circuit board tracks
05/23/2002WO2002041674A1 Arrangement consisting of a circuit carrier and a printed circuit board, or a printed circuit board assembly
05/23/2002WO2002041673A2 Adding electrical resistance in series with bypass capacitors to achieve a desired value of electrical impedance between conductors of an electrical power distribution structure
05/23/2002WO2002041397A2 Low profile integrated module interconnects
05/23/2002WO2002041343A1 Electronic component-use substrate and electronic component
05/23/2002WO2002041154A2 Universal serial bus (usb) interface for mass storage device
05/23/2002WO2002041079A2 Positive type photosensitive epoxy resin composition and printed circuit board using the same
05/23/2002WO2001084629A3 Detector for computer tomographs
05/23/2002WO2001080574B1 Splitter architecture for a telecommunication system
05/23/2002WO2001037622A3 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer
05/23/2002US20020062083 Ultrasonic endoscope
05/23/2002US20020062082 Ultrasonic endoscope
05/23/2002US20020061629 Method of manufacturing multilayered ceramic substrate and green ceramic laminate
05/23/2002US20020061415 Resin/copper/metal laminate and method of producing same
05/23/2002US20020061410 Electrical resistance, electrodes
05/23/2002US20020061401 Conductive metal particles, conductive composite metal particles and applied products using the same
05/23/2002US20020061388 Printed circuit board having a pattern of traces formed by screen-printing
05/23/2002US20020061154 Optical-electric printed wiring board, printed circuit board, and method of fabricating optical-electric printed wiring board
05/23/2002US20020060906 Interconnecting method of wiring in printed circuit boards and printed circuit board unit
05/23/2002US20020060661 Liquid crystal display device
05/23/2002US20020060366 Multilayer wiring substrate having differential signal wires and a general signal wire in different planes
05/23/2002US20020060361 Semiconductor package for three-dimensional mounting, fabrication method thereof , and semiconductor device
05/23/2002US20020060356 Power semiconductor device
05/23/2002US20020060318 Routable high-density interfaces for integrated circuit devices
05/23/2002US20020060289 Ion reflectron comprising a flexible printed circuit board
05/23/2002US20020060146 Switch unit
05/23/2002US20020060092 Method for connecting electrical components
05/23/2002US20020060091 Ceramic circuit board and method of manufacturing the same
05/23/2002US20020060090 Printed circuit board and manufacturing method of the printed circuit board
05/23/2002US20020060087 Cable and method of manufacturing it
05/23/2002US20020059875 Screen printing apparatus and method of the same
05/23/2002US20020059871 Position adjustment in laser-assisted pressing
05/23/2002US20020059723 Electronic package for electronic components and method of making same
05/23/2002DE10065895C1 Electronic component used as an integrated circuit comprises a screen for electromagnetic scattering, a semiconductor chip made from a semiconductor substrate and an electrically conducting trenched layer
05/23/2002DE10056904A1 Connector device for electrical circuit boards uses electrically-conductive spring elements clipped over surface-mounted contact bodies
05/23/2002DE10056112A1 Data storage device embedded in circuit board for recycling information etc. has transponder coil and semiconductor device with connections to circuit board
05/23/2002DE10055560A1 Vehicle interior lighting device has lighting medium applied as coating to part of circuit board on which power supply components are mounted
05/23/2002DE10038390C1 Funktionell asymmetrische Schaltungsträgeranordnung mit spiegelsymmetrischer Bauteileanordnung Functionally asymmetric circuit carrier assembly with a mirror-symmetrical arrangement of components
05/23/2002CA2427923A1 Positive type photosensitive epoxy resin composition and printed circuit board using the same
05/23/2002CA2400321A1 Electronic component-use substrate and electronic component
05/22/2002EP1207730A1 Electroplating solution, method for fabricating multilayer printed wiring board using the solution, and multilayer printed wiring board
05/22/2002EP1207728A1 Automatic seperator and method to obtain circuits for microelectronics
05/22/2002EP1207727A2 Compliant laminate connector
05/22/2002EP1207726A2 Conductive ink composition
05/22/2002EP1207566A2 Anode thin film for lithium secondary battery
05/22/2002EP1207493A1 Memory card
05/22/2002EP1206825A1 Universal energy conditioning interposer with circuit architecture
05/22/2002EP1206725A1 Connector arrangement
05/22/2002EP0659032B1 Electronic component
05/22/2002CN1350770A Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
05/22/2002CN1350690A Ultra-small resistor-capacitor thin film network for inverted mounting to a surface
05/22/2002CN1350421A Element mounting system and mounting method
05/22/2002CN1350350A 电池连接器 Battery Connector
05/22/2002CN1350323A Lead wire frame and method for manufacturing lead wire frame
05/22/2002CN1350310A Helix inductor
05/22/2002CN1350201A Wiring base plate, display device, semiconductor chip and electronic machine
05/22/2002CN1350031A Fire-retardant resin composition, preliminary-dip piece, laminated board, metal cladded laminated board, printed circuit-board and multi-layer printed circuit board
05/21/2002US6393329 Base board, power supply unit and CPU unit mounted thereon in programmable controller system
05/21/2002US6392899 Processor power delivery system
05/21/2002US6392898 Package substrate
05/21/2002US6392897 Circuit module
05/21/2002US6392896 Semiconductor package containing multiple memory units
05/21/2002US6392778 Opto-electronic element
05/21/2002US6392530 Resistor array board
05/21/2002US6392523 Surface-mounting-type coil component
05/21/2002US6392426 Methods of forming apparatuses and a method of engaging electrically conductive test pads on a semiconductor substrate
05/21/2002US6392301 Chip package and method
05/21/2002US6392291 Semiconductor component having selected terminal contacts with multiple electrical paths
05/21/2002US6392289 Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same
05/21/2002US6392259 Semiconductor chip with surface covering
05/21/2002US6392207 Electric heating device, especially for use in motor vehicles
05/21/2002US6392174 Printed circuit board with fixed contacts of switch formed thereon and switch using same
05/21/2002US6392165 Adapter for a ball grid array device
05/21/2002US6392164 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor
05/21/2002US6392163 Controlled-shaped solder reservoirs for increasing the volume of solder bumps
05/21/2002US6392162 Double-sided flexible jumper assembly and method of manufacture
05/21/2002US6392161 Mounting substrate
05/21/2002US6392160 Backplane for radio frequency signals
05/21/2002US6392159 Embedded structure for engineering change and repair of circuit boards
05/21/2002US6392148 Wire harness joint
05/21/2002US6392142 Printed wiring board mounting structure
05/21/2002US6392004 Electronics
05/21/2002US6392003 Flame retardant
05/21/2002US6391979 Reacting p-hydroxystyrene and epichlorhydrin
05/21/2002US6391932 Dielectric polyimide
05/21/2002US6391812 Silicon nitride sintered body and method of producing the same
05/21/2002US6391684 Lead frame and manufacturing method thereof
05/21/2002US6391681 Semiconductor component having selected terminal contacts with multiple electrical paths
05/21/2002US6391678 Method for controlling solderability of a conductor and conductor formed thereby
05/21/2002US6391669 Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices
05/21/2002US6391526 Thick film low value high frequency inductor, and method of making the same
05/21/2002US6391473 Cu plated ceramic substrate and a method of manufacturing the same
05/21/2002US6391087 Adding alkali hydroxide to copper salt
05/21/2002US6391082 Composites of powdered fillers and polymer matrix
05/21/2002US6390857 Electrical connector having leading cap for facilitating printed circuit board in the connector into a mating connector
05/21/2002US6390830 Bus bar-connecting structure