Patents for H05K 1 - Printed circuits (98,583)
06/2002
06/04/2002CA2024933C Uniform current and voltage distribution device
05/2002
05/30/2002WO2002043455A1 Method of manufacturing ceramic multi-layer substrate, and unbaked composite laminated body
05/30/2002WO2002043379A1 Folder type multi display device
05/30/2002WO2002043299A2 A daughter board for a prototyping system
05/30/2002WO2002043084A1 System, printed circuit board, charger device, user device, and apparatus
05/30/2002WO2002043081A1 Electrical insulating plate, prepreg laminate and method for producing them
05/30/2002WO2002042947A1 A prototyping system
05/30/2002WO2001073957A3 Battery-operated wireless-communication apparatus and method
05/30/2002WO2001069971A3 Hearing aid with a flexible shell
05/30/2002WO2001063646A3 Multi-layered multi-chip module
05/30/2002US20020065971 Memory unit and method of assembling a computer
05/30/2002US20020065390 Subjecting polymer having micro-domain structure made up of a polyimide precursor and a dispersed low molecular weight substance or polyimide into extraction with supercritical carbon dioxide and cosolvent
05/30/2002US20020065346 Hydrolysis-resistant, transparent, biaxially oriented film made from a crystallizable thermoplastic, and process for its production
05/30/2002US20020065331 Having low dielectric constants useful in electronic component manufacture
05/30/2002US20020065102 Portable telephone provided with image pickup device
05/30/2002US20020065052 Complete outdoor radio unit for LMDS
05/30/2002US20020064947 Wiring substrate and manufacturing method of the same along with electroless copper plating solution used therefor
05/30/2002US20020064902 Method for fabricating large area flexible electronics
05/30/2002US20020064899 Semiconductor device substrate and semiconductor device fabrication method
05/30/2002US20020064674 Part
05/30/2002US20020064098 Timepiece comprising means for allowing electric access to electric or electronic components of this timepiece
05/30/2002US20020064034 Nested plug-in modules
05/30/2002US20020064033 Gigabyte memory module and methods for making the same
05/30/2002US20020064031 Wiring circuit member for vehicle
05/30/2002US20020064029 Stacked power amplifier module
05/30/2002US20020063600 High-frequency circuit
05/30/2002US20020063333 Low capacitance wiring layout and method for making same
05/30/2002US20020063326 Electronic part unit and circuit board apparatus
05/30/2002US20020063325 Substrate structure
05/30/2002US20020063269 Graded-dielectric structures for phase-shifting high speed signals within microstrip structures
05/30/2002US20020062990 Through-hole wiring board
05/30/2002US20020062989 Grounding terminal and mounting structure of the same on a printed circuit board
05/30/2002US20020062987 Multilayer circuit board and method of manufacturing the same
05/30/2002US20020062982 Microstrip line for microwave applications
05/30/2002US20020062926 Resin composition with excellent dielectric property
05/30/2002US20020062924 Definable integrated passives for circuitry
05/30/2002US20020062557 Cooler chip fabrication method
05/30/2002CA2427958A1 A daughter board for a prototyping system
05/30/2002CA2399246A1 A prototyping system
05/29/2002EP1209959A2 Multilayer circuit board and method of manufacturing the same
05/29/2002EP1209957A2 Substrate structure
05/29/2002EP1209736A2 Semiconductor device and method of fabricating semiconductor device
05/29/2002EP1209474A1 System and method for measuring the power consumed by a circuit on a printed circuit board
05/29/2002EP1209184A1 Photosensitive low-permittivity polyimide and method of forming positive polyimide film pattern from the same
05/29/2002EP1208727A1 Device and bridge card for a computer
05/29/2002EP1208618A1 Control device and soldering method
05/29/2002EP1208267A1 Wholly aromatic polyamide fiber paper and laminated sheet therefrom
05/29/2002EP1208159A1 Cyanate ester based thermoset compositions
05/29/2002EP1103170B1 Printed circuit board with a heatsink and method for mounting a heatsink
05/29/2002EP1060145B1 Inorganic lubricant-coated glass fiber strands and products including the same
05/29/2002EP1051748A4 A vertical connector based packaging solution for integrated circuits
05/29/2002EP0952917B1 Laminate for printed circuit boards
05/29/2002DE10159685A1 Verdrahtungssubstrat, Verdrahtungsplatte und Montagestruktur für ein Verdrahtungssubstrat Wiring substrate, the wiring board and mounting structure for the wiring substrate
05/29/2002DE10153726A1 Flexible Schaltkreistafel und Verbindung der Struktur davon Flexible circuit board and connecting the structure thereof
05/29/2002DE10149912A1 Compact and robust pedal power measurement device has a force branching mechanism that branches a part of the pedal force axially onto a measurement capacitor, the change in capacitance being used to measure the applied force
05/29/2002DE10065896A1 Electronic component used in flip-chip technology comprises a screen against electromagnetic scattering fields, and a semiconductor chip made from a semiconductor substrate having an active upper side and a passive rear side
05/29/2002DE10058660A1 Lighting arrangement for motor vehicle with LEDs arranged on conductor track carrier
05/29/2002DE10056184A1 Bohrunterlage Drilling
05/29/2002CN2494100Y Pressing bonding pad for printed circuit board
05/29/2002CN1351815A Flexible printed wiring board and its production method
05/29/2002CN1351749A Magnetic tape cassette
05/29/2002CN1351376A Semiconductor modules and manufacture thereof
05/29/2002CN1351375A Modular assembly and electronic component
05/29/2002CN1351092A Midezole-phosphate as accelerator for dicyandiamide in epoxy composition in a separated container
05/29/2002CN1085877C Flexible circuit board fitting structure and recording copying device of using the same
05/28/2002US6396978 Optical wavelength division multiplexer/demultiplexer having patterned opaque regions to reduce optical noise
05/28/2002US6396713 Attenuation of electromagnetic waves; signal, powrer, grounding layers
05/28/2002US6396712 Method and apparatus for coupling circuit components
05/28/2002US6396709 Printed-circuit board having rigid and elastically deformable sections and device having such a printed-circuit board
05/28/2002US6396706 Self-heating circuit board
05/28/2002US6396665 Head suspension assembly with a relay printed circuit board having openings through which electrodes protude
05/28/2002US6396387 Thin films resistors
05/28/2002US6396264 Triplate striplines used in a high-frequency circuit and a shielded-loop magnetic field detector
05/28/2002US6396255 System and method for determining the polarity of an electrostatic event
05/28/2002US6396199 Ultrasonic linear or curvilinear transducer and connection technique therefore
05/28/2002US6396143 Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board
05/28/2002US6396141 Tape ball grid array with interconnected ground plane
05/28/2002US6396135 Substrate for use in semiconductor packaging
05/28/2002US6396128 Fixing structure and fixing method for semiconductor integrated circuit apparatus
05/28/2002US6396082 Light-emitting diode
05/28/2002US6396001 Printed circuit board and method of making the same
05/28/2002US6396000 Printed circuit board and method for reducing radio frequency interference emissions from conductive traces on a printed circuit board
05/28/2002US6395999 Electronic power module and a method of manufacturing such a module
05/28/2002US6395997 Flat circuit with connector
05/28/2002US6395996 Multi-layered substrate with a built-in capacitor design
05/28/2002US6395995 Apparatus for coupling integrated circuit packages to bonding pads having vias
05/28/2002US6395993 Multilayer flexible wiring boards
05/28/2002US6395992 Heat bonding using polyimide
05/28/2002US6395658 Ceramic containing barium oxide
05/28/2002US6395630 Stacked integrated circuits
05/28/2002US6395582 Methods for forming ground vias in semiconductor packages
05/28/2002US6395399 Metallic foil, e.g. copper, having a polyimide layer produced by forming a film of a polyamic acid varnish followed by imidating and having a specific expansion coefficient and softening point; printed circuits; noncurling
05/28/2002US6395378 PCB and method for making PCB with thin copper layer
05/28/2002US6395374 Method of making microwave, multifunction modules using fluoropolymer composite substrates
05/28/2002US6395337 Substrate with ceramic coating for camber modification and method for making
05/28/2002US6395332 Fine copper powder and process for producing the same
05/28/2002US6395121 Method for making fabric-based, adhesively mounted printed circuit for upholstered seats and the like
05/28/2002US6395118 Method for manufacturing ceramic substrate and non-fired ceramic substrate
05/28/2002US6395117 Method for producing ceramic green sheet
05/28/2002US6394853 Data connector for selective switching between at least two distinct mating connector plugs