| Patents for H05K 1 - Printed circuits (98,583) |
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| 06/11/2002 | US6403201 Substrate material for wiring and substrate material for printed circuit using the same |
| 06/11/2002 | US6403200 Insulator ceramic is composed of an magnesium oxide-magnesium aluminate (mgo-mgal2o4) ceramic powder, and a glass powder containing oxides of silicon, boron and with or without alumina, also contains oxides of 1a, 11a, zinc and copper |
| 06/11/2002 | US6403199 Insulating ceramic, multilayer ceramic substrate, ceramic electronic parts and laminated ceramic electronic parts |
| 06/11/2002 | US6403146 Process for the manufacture of printed circuit boards |
| 06/11/2002 | US6402569 Molded bus bar system |
| 06/11/2002 | US6402530 Junction box |
| 06/11/2002 | US6402527 Structure for connecting terminals on wiring board |
| 06/11/2002 | US6402031 Modular architecture sensing and computing platform |
| 06/11/2002 | US6401332 Processing printed circuits and printed circuits thus obtained |
| 06/06/2002 | WO2002045469A1 Electrical component, arrangement for said component and method for producing said arrangement |
| 06/06/2002 | WO2002045162A2 Interposer for a semiconductor module, semiconductor produced using such an interposer and method for producing such an interposer |
| 06/06/2002 | WO2002045161A1 Integral-type ceramic circuit board and method of producing same |
| 06/06/2002 | WO2002045160A1 Flexible electronic device |
| 06/06/2002 | WO2002044913A2 Topology for 66 mhz pci bus riser card system |
| 06/06/2002 | WO2002044274A1 Liquid thermosetting resin composition, printed wiring boards and process for their production |
| 06/06/2002 | WO2002025673A3 Method and apparatus for forming a magnetic component on a printed circuit board |
| 06/06/2002 | WO2002016475A3 Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate |
| 06/06/2002 | WO2002014404A3 Polyarylether-polyetherimide compositions |
| 06/06/2002 | WO2002009485A3 Flip chip package, circuit board thereof and packaging method thereof |
| 06/06/2002 | WO2001073866A3 Method and apparatus for integrated-battery devices |
| 06/06/2002 | US20020068417 Stereolithographic method and apparatus for fabricating spacers for semiconductor devices and resulting structures |
| 06/06/2002 | US20020068389 Fexible electronic device |
| 06/06/2002 | US20020068173 Silicone oligomer, a specified amount of metal hydrate such as aluminum hydroxide, and a resin; heat resistance, free of bromine compounds |
| 06/06/2002 | US20020068170 Useful electrical, mechanical, and chemical properties including applications in antennas, electromagnetic and electro-optic devices, and high-toughness materials |
| 06/06/2002 | US20020068145 Silicon-containing polyoxypolyolefin or polyolefin type elastomer with conductive particles; electromagnetically shielded housing; heat conducting pad; performance and mechanical properties |
| 06/06/2002 | US20020067590 Cover connecting mechanism |
| 06/06/2002 | US20020067587 High performance capacitor |
| 06/06/2002 | US20020067486 Solderability assessment |
| 06/06/2002 | US20020067456 Liquid crystal display element |
| 06/06/2002 | US20020067452 Active matrix liquid-crystal display device |
| 06/06/2002 | US20020067441 Liquid crystal display having capacitors on a substrate with equal resistance conductors electrically connecting the capacitors to a chip |
| 06/06/2002 | US20020067244 High-voltage variable resistor |
| 06/06/2002 | US20020067235 High Q spiral inductor |
| 06/06/2002 | US20020067183 Methods of engaging electrically conductive pads on a semiconductor substrate |
| 06/06/2002 | US20020067181 Probe card assembly and kit, and methods of making same |
| 06/06/2002 | US20020066961 Circuit Substrate and manufacturing method thereof |
| 06/06/2002 | US20020066953 Insulating substrate including multilevel insulative ceramic layers joined with an intermediate layer |
| 06/06/2002 | US20020066949 BGA package and method of manufacturing the same |
| 06/06/2002 | US20020066948 Circuit board having interconnection ball lands and ball grid array (BGA) package using the circuit board |
| 06/06/2002 | US20020066940 Freeform substrates and devices |
| 06/06/2002 | US20020066881 Casting or embedding compound having electromagnetic shielding properties for manufacturing electronic components |
| 06/06/2002 | US20020066595 Wiring board and method of producing wiring board |
| 06/06/2002 | US20020066593 Method for forming an electrically isolated via in a multilayer ceramic package and an electrical connection formed with the via |
| 06/06/2002 | US20020066590 Board integrated resilient contact elements array and method of fabrication |
| 06/06/2002 | DE10146940A1 Leiterplatte und Verfahren zur Herstellung derselben Printed circuit board and method of manufacturing the same |
| 06/06/2002 | DE10116449A1 Steckerhaltestruktur zum sicheren Montieren eines Leiterplattensteckers in einem Gehäuse Plug holding structure for secure mounting a circuit board connector in a housing |
| 06/06/2002 | DE10059761A1 Injection molded circuit carrier or molded interconnect device |
| 06/06/2002 | DE10057606A1 Arrangement for contacting planar transformer ferrite core with earth has conducting track structure(s) on circuit board surface facing core; core and circuit board are joined by adhesive |
| 06/06/2002 | DE10056665A1 Lenkstockschalter, insbesondere für Fahrzeuge Steering column switch, in particular for vehicles |
| 06/06/2002 | DE10055040C1 Ceramic circuit board mounting method uses adhesive structure applied to support surface or underside of ceramic circuit board |
| 06/05/2002 | EP1211921A2 Part for soldering to a printed wiring board |
| 06/05/2002 | EP1211919A2 Tuner and receiver apparatus |
| 06/05/2002 | EP1211730A2 Stacked power amplifier module |
| 06/05/2002 | EP1211701A1 Planar inductor with a ferromagnetic core, and fabrication method therefor |
| 06/05/2002 | EP1211338A1 Flat synthetic fiber, method for preparing the same and non-woven fabric prepared using the same |
| 06/05/2002 | EP1211280A1 Process for producing a porous polyimide by removing low molecular weight substance using supercritical carbon dioxide |
| 06/05/2002 | EP1211139A1 Wire harness for vehicle |
| 06/05/2002 | EP1210849A1 Multi-connectable printed circuit board |
| 06/05/2002 | EP1210848A1 Bidirectional interface tool for pwb development |
| 06/05/2002 | EP1210733A1 Method for producing via-connections in a substrate and substrate equipped with same |
| 06/05/2002 | EP1210725A1 Ion reflectron comprising a flexible printed circuit board |
| 06/05/2002 | EP1105942B1 Contact device mainly intended for contact between electric components and circuit supports and method for producing said device |
| 06/05/2002 | EP1101193B1 Open-worked antenna for integrated circuit card, and integrated circuit card comprising same |
| 06/05/2002 | EP0806127B1 An environmentally desirable printed circuit and associated apparatus |
| 06/05/2002 | CN1352870A Composition and method for manufacturing integral resistor in printed circuit boards |
| 06/05/2002 | CN1352869A Sandwich-structured intelligent power module |
| 06/05/2002 | CN1352804A High-density electronic package and method for making same |
| 06/05/2002 | CN1352496A 双超外差调谐器 Double superheterodyne tuner |
| 06/05/2002 | CN1352473A Multiple line grid connector |
| 06/05/2002 | CN1086005C Pre-formed materials for printed circuit board |
| 06/04/2002 | US6401048 Circuit trace probe and method |
| 06/04/2002 | US6400576 Sub-package bypass capacitor mounting for an array packaged integrated circuit |
| 06/04/2002 | US6400575 Integrated circuits packaging system and method |
| 06/04/2002 | US6400573 Multi-chip integrated circuit module |
| 06/04/2002 | US6400419 Television tuner system |
| 06/04/2002 | US6400323 Antenna coil for IC card and manufacturing method thereof |
| 06/04/2002 | US6400241 Microwave circuit module and a device for connecting it to another module |
| 06/04/2002 | US6400234 Strip line feeding apparatus |
| 06/04/2002 | US6400172 Semiconductor components having lasered machined conductive vias |
| 06/04/2002 | US6400170 High current examining structure for a circuit protective element |
| 06/04/2002 | US6400169 Test socket with interposer for testing semiconductor components having contact balls |
| 06/04/2002 | US6400028 Alignment of vias in circuit boards or similar structures |
| 06/04/2002 | US6400019 Semiconductor device with wiring substrate |
| 06/04/2002 | US6400010 Substrate including a metal portion and a resin portion |
| 06/04/2002 | US6399903 Multifunctional laminate structure and process |
| 06/04/2002 | US6399899 Suspension board with circuit |
| 06/04/2002 | US6399898 Technique for coupling signals between circuit boards |
| 06/04/2002 | US6399897 Multi-layer wiring substrate |
| 06/04/2002 | US6399896 Circuit package having low modulus, conformal mounting pads |
| 06/04/2002 | US6399892 CTE compensated chip interposer |
| 06/04/2002 | US6399891 Alternating polyimide films, with a thermal expansion coefficient of 2-5 ppm/degrees c, and metal films; because thermal expansion coefficient is close to that of semiconductor element no breakage occurs at connecting parts |
| 06/04/2002 | US6399890 Printed circuit board having dual purpose profile |
| 06/04/2002 | US6399285 Method for forming a thin film and for manufacturing a thin film |
| 06/04/2002 | US6399282 Method for forming conductive pattern and producing ceramic multi-layer substrate |
| 06/04/2002 | US6399230 Multilayer ceramic circuit boards with embedded resistors |
| 06/04/2002 | US6399019 Silver and active metal optionally with copper or titanium oxide paste; temperature lower than eutectic point; high strength; thermal impact resistance; power modules |
| 06/04/2002 | US6398559 Connecting terminal and a connecting terminal assembly |
| 06/04/2002 | US6397459 Printed wiring board with mounted circuit elements using a terminal density conversion board |
| 06/04/2002 | CA2284075C Nickel composite particle and production process therefor |
| 06/04/2002 | CA2036241C Thin film electrical component |