Patents for H05K 1 - Printed circuits (98,583) |
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06/18/2002 | US6407150 Reacting phenolic compound and dicyclopentadiene, 4-vinylcyclohexene, 5-vinylnorborn-2-ene, a-pinene, or limonene in friedel-crafts catalyst presence; reacting epihalohydrin; good color tone, heat resistance; |
06/18/2002 | US6407020 Ceramics composition |
06/18/2002 | US6407017 Mixture containing binder |
06/18/2002 | US6406990 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
06/18/2002 | US6406791 Mixture of titanate and glass |
06/18/2002 | US6406774 Electrically conductive composition for use in through hole of electric component |
06/18/2002 | US6405920 Enhanced mounting pads for printed circuit boards |
06/18/2002 | CA2232425C Functionally gradient material and its use in a semiconductor circuit substrate |
06/18/2002 | CA2060563C Process for mounting miniature electronic components with weld connection tabs on a flexible substrate |
06/18/2002 | CA2055148C Method of forming an electrically conductive contact on a substrate |
06/13/2002 | WO2002047450A1 Circuit board producing method and circuit board producing device |
06/13/2002 | WO2002047209A1 Contact structure and production method thereof and probe contact assembly using same |
06/13/2002 | WO2002047148A2 Electrically isolated via in a multilayer ceramic package |
06/13/2002 | WO2002047099A1 A connection between a conductive substrate and a laminate |
06/13/2002 | WO2002046323A2 Uv curable ink-jet legend ink for printing on printed circuit boards |
06/13/2002 | WO2002046322A2 Heat curable ink-jet ink for printing on printed circuit boards |
06/13/2002 | WO2002046312A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg |
06/13/2002 | WO2002046280A1 Etchant for thermoplastic polyimide resin |
06/13/2002 | WO2002046263A1 Resin formulation, method for curing the same, and its use |
06/13/2002 | WO2002045799A1 Freeform substrates and devices |
06/13/2002 | WO2002045474A2 Board integrated resilient contact elements array and method of fabrication |
06/13/2002 | WO2002032198A3 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device |
06/13/2002 | WO2002030166A3 Compliant attachment interface |
06/13/2002 | WO2002028711A3 Dual mode light source for aircraft external lighting |
06/13/2002 | WO2002025833A3 Circuit for compensating the effects of crosstalk |
06/13/2002 | WO2002025797A3 Electronic transformer/inductor devices and methods for making same |
06/13/2002 | WO2002005440A3 Radio communication device having an in-situ strain sensor |
06/13/2002 | WO2000078105A9 Multi-connection via |
06/13/2002 | US20020072878 Deterioration diagnostic method and equipment thereof |
06/13/2002 | US20020072585 PPE derivatives and resin composition having the same |
06/13/2002 | US20020072482 Such as sodium polyacrylate in excess alkali; removal of conductive paste residue from screening masks used in ceramic semiconductor substrate manufacture |
06/13/2002 | US20020072257 Electrical connection box for a vehicle |
06/13/2002 | US20020072255 Riser card assembly and method for its installation |
06/13/2002 | US20020071935 Provides contact surface between the solder pad and solder paste to produce wetting effect, for forming strong bonding force and enhancing conductivity |
06/13/2002 | US20020071642 Installation structure and method for optical parts and electric parts |
06/13/2002 | US20020071602 Component-mounting method and component-mounting apparatus |
06/13/2002 | US20020071263 Functional asymmetrical circuit substrate assembly including a mirror-symmetrical component layout |
06/13/2002 | US20020071260 Electronic board assembly including two elementary boards each carrying connectors on an edge thereof |
06/13/2002 | US20020071258 High performance capacitor |
06/13/2002 | US20020071256 Electronic circuit housing with trench vias and method of fabrication therefor |
06/13/2002 | US20020071252 Heat sink element and high-frequency electronic circuit substrate using such |
06/13/2002 | US20020071238 Multi-layer capacitor, wiring board, and high-frequency circuit |
06/13/2002 | US20020071104 Image sensing apparatus including a microcontroller |
06/13/2002 | US20020071085 Method for interconnecting a flat panel display having a non-transparent substrate and devices formed |
06/13/2002 | US20020071084 Lcd module |
06/13/2002 | US20020071082 Display device |
06/13/2002 | US20020071066 Compact display assembly |
06/13/2002 | US20020070838 Over-voltage protection for electronic circuits |
06/13/2002 | US20020070834 Multi-layer and user-configurable micro-printed circuit board |
06/13/2002 | US20020070831 Electronic transformer/inductor devices and methods for making same |
06/13/2002 | US20020070825 Wiring structure for transmission line |
06/13/2002 | US20020070611 Controller system for pool and/or spa |
06/13/2002 | US20020070437 Intermediate base for a semiconductor module, a semiconductor module using the intermediate base and a method for producing the intermediate base |
06/13/2002 | US20020070423 Thin-film electronic component and motherboard |
06/13/2002 | US20020070048 Adhesives and adhesive films |
06/13/2002 | US20020069523 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder and method of mounting the same |
06/13/2002 | US20020069518 Processing assembly and method |
06/13/2002 | US20020069510 Head gimbal assembly method |
06/13/2002 | DE10157434A1 Verdrahtungsschaltungselement für ein Fahrzeug Wiring circuit member for a vehicle |
06/13/2002 | DE10153725A1 Struktur zum Herausführen flexibler Leiterelemente Structure for leading flexible conductor elements |
06/13/2002 | DE10112355C1 Temperature-sensitive electronic component mounting method uses removable protection device for protecting component during mounting process |
06/13/2002 | DE10111185A1 Ceramic-metal substrate has profiling in metal layer for reducing thermodynamic stresses provided in vicinity of electrical components or contact elements |
06/13/2002 | DE10060407A1 Laser beam boring device e.g. for boring blind holes in multi layer circuit boards, uses frequency-sensitive plasma radiation detector for detecting radiation intensity during boring of holes |
06/13/2002 | DE10059176A1 Intermediate carrier for semiconductor module has its lower surface provided with recesses for defining outer terminals cooperating with printed circuit board |
06/13/2002 | DE10057494A1 Anordnung auf einem Schaltungsträger und einer Leiterplatte oder einer Leiterplattenanordnung Arrangement on a circuit board and a circuit board or a printed circuit board assembly |
06/13/2002 | CA2431751A1 A connection between a conductive substrate and a laminate |
06/13/2002 | CA2429683A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg |
06/12/2002 | EP1213952A2 Circuit substrate and manufacturing method thereof |
06/12/2002 | EP1213951A2 Component-mounting method and component-mounting apparatus |
06/12/2002 | EP1213924A1 Portable telephone provided with image pickup device |
06/12/2002 | EP1212927A1 A printed circuit board assembly |
06/12/2002 | EP1212899A2 AN INTEGRATED RF MxN SWITCH MATRIX |
06/12/2002 | EP1110277B1 Printed circuit board arrangement with a multipole plug-in connector |
06/12/2002 | EP0753101B1 Engine components including ceramic-metal composites |
06/12/2002 | CN1353865A Power feed and heat dissipating device for power semiconductor devices |
06/12/2002 | CN1353457A Combined part of metal base |
06/12/2002 | CN1353432A Capacitance element and its manufacturing method and solid electrolytic capacitor carrying capacitance element |
06/11/2002 | US6404660 Semiconductor package with a controlled impedance bus and method of forming same |
06/11/2002 | US6404649 Printed circuit board assembly with improved bypass decoupling for BGA packages |
06/11/2002 | US6404643 Article having an embedded electronic device, and method of making same |
06/11/2002 | US6404598 Flexible circuit routing configuration for a fine/coarse positioner for a tape drive |
06/11/2002 | US6404478 Liquid crystal display having capacitors on a substrate with equal resistance conductors electrically connecting the capacitors to a chip |
06/11/2002 | US6404309 Tuner with non-edge RF input pin/lead |
06/11/2002 | US6404214 Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device |
06/11/2002 | US6404179 Noise eliminating apparatus of high-frequency transmission system |
06/11/2002 | US6404081 Embedded backup energy storage unit |
06/11/2002 | US6404064 Flip-chip bonding structure on substrate for flip-chip package application |
06/11/2002 | US6404062 Semiconductor device and structure and method for mounting the same |
06/11/2002 | US6404052 Multi-layer flexible printed wiring board |
06/11/2002 | US6404044 Semiconductor package with stacked substrates and multiple semiconductor dice |
06/11/2002 | US6404043 Panel stacking of BGA devices to form three-dimensional modules |
06/11/2002 | US6403892 Coated means for connecting a chip and a card |
06/11/2002 | US6403891 Metallization removal under the laser mark area for substrates |
06/11/2002 | US6403757 Modified polyamide resin obtained from reaction of acid anhydride compound with epoxy-terminated polyamide |
06/11/2002 | US6403694 Borosilicate glass powder, crystalline sio2 powder dispersed with photopolymerization initiator, photocurable monomer, and binder comprising an acrylic/modified-cellulosic copolymer having carboxyl group and ethylenic unsaturated side chain |
06/11/2002 | US6403510 Aluminum nitride sintered body and manufacturing method thereof |
06/11/2002 | US6403401 Heat spreader hole pin 1 identifier |
06/11/2002 | US6403229 Cyanate ester based thermoset compositions |
06/11/2002 | US6403220 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith |
06/11/2002 | US6403218 Nickel spinel conductor paste for interior layer of ceramic multilayer electronic part |