Patents for H05K 1 - Printed circuits (98,583)
06/2002
06/18/2002US6407150 Reacting phenolic compound and dicyclopentadiene, 4-vinylcyclohexene, 5-vinylnorborn-2-ene, a-pinene, or limonene in friedel-crafts catalyst presence; reacting epihalohydrin; good color tone, heat resistance;
06/18/2002US6407020 Ceramics composition
06/18/2002US6407017 Mixture containing binder
06/18/2002US6406990 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier
06/18/2002US6406791 Mixture of titanate and glass
06/18/2002US6406774 Electrically conductive composition for use in through hole of electric component
06/18/2002US6405920 Enhanced mounting pads for printed circuit boards
06/18/2002CA2232425C Functionally gradient material and its use in a semiconductor circuit substrate
06/18/2002CA2060563C Process for mounting miniature electronic components with weld connection tabs on a flexible substrate
06/18/2002CA2055148C Method of forming an electrically conductive contact on a substrate
06/13/2002WO2002047450A1 Circuit board producing method and circuit board producing device
06/13/2002WO2002047209A1 Contact structure and production method thereof and probe contact assembly using same
06/13/2002WO2002047148A2 Electrically isolated via in a multilayer ceramic package
06/13/2002WO2002047099A1 A connection between a conductive substrate and a laminate
06/13/2002WO2002046323A2 Uv curable ink-jet legend ink for printing on printed circuit boards
06/13/2002WO2002046322A2 Heat curable ink-jet ink for printing on printed circuit boards
06/13/2002WO2002046312A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg
06/13/2002WO2002046280A1 Etchant for thermoplastic polyimide resin
06/13/2002WO2002046263A1 Resin formulation, method for curing the same, and its use
06/13/2002WO2002045799A1 Freeform substrates and devices
06/13/2002WO2002045474A2 Board integrated resilient contact elements array and method of fabrication
06/13/2002WO2002032198A3 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device
06/13/2002WO2002030166A3 Compliant attachment interface
06/13/2002WO2002028711A3 Dual mode light source for aircraft external lighting
06/13/2002WO2002025833A3 Circuit for compensating the effects of crosstalk
06/13/2002WO2002025797A3 Electronic transformer/inductor devices and methods for making same
06/13/2002WO2002005440A3 Radio communication device having an in-situ strain sensor
06/13/2002WO2000078105A9 Multi-connection via
06/13/2002US20020072878 Deterioration diagnostic method and equipment thereof
06/13/2002US20020072585 PPE derivatives and resin composition having the same
06/13/2002US20020072482 Such as sodium polyacrylate in excess alkali; removal of conductive paste residue from screening masks used in ceramic semiconductor substrate manufacture
06/13/2002US20020072257 Electrical connection box for a vehicle
06/13/2002US20020072255 Riser card assembly and method for its installation
06/13/2002US20020071935 Provides contact surface between the solder pad and solder paste to produce wetting effect, for forming strong bonding force and enhancing conductivity
06/13/2002US20020071642 Installation structure and method for optical parts and electric parts
06/13/2002US20020071602 Component-mounting method and component-mounting apparatus
06/13/2002US20020071263 Functional asymmetrical circuit substrate assembly including a mirror-symmetrical component layout
06/13/2002US20020071260 Electronic board assembly including two elementary boards each carrying connectors on an edge thereof
06/13/2002US20020071258 High performance capacitor
06/13/2002US20020071256 Electronic circuit housing with trench vias and method of fabrication therefor
06/13/2002US20020071252 Heat sink element and high-frequency electronic circuit substrate using such
06/13/2002US20020071238 Multi-layer capacitor, wiring board, and high-frequency circuit
06/13/2002US20020071104 Image sensing apparatus including a microcontroller
06/13/2002US20020071085 Method for interconnecting a flat panel display having a non-transparent substrate and devices formed
06/13/2002US20020071084 Lcd module
06/13/2002US20020071082 Display device
06/13/2002US20020071066 Compact display assembly
06/13/2002US20020070838 Over-voltage protection for electronic circuits
06/13/2002US20020070834 Multi-layer and user-configurable micro-printed circuit board
06/13/2002US20020070831 Electronic transformer/inductor devices and methods for making same
06/13/2002US20020070825 Wiring structure for transmission line
06/13/2002US20020070611 Controller system for pool and/or spa
06/13/2002US20020070437 Intermediate base for a semiconductor module, a semiconductor module using the intermediate base and a method for producing the intermediate base
06/13/2002US20020070423 Thin-film electronic component and motherboard
06/13/2002US20020070048 Adhesives and adhesive films
06/13/2002US20020069523 Mounting structure of integrated circuit device having high effect of buffering stress and high reliability of connection by solder and method of mounting the same
06/13/2002US20020069518 Processing assembly and method
06/13/2002US20020069510 Head gimbal assembly method
06/13/2002DE10157434A1 Verdrahtungsschaltungselement für ein Fahrzeug Wiring circuit member for a vehicle
06/13/2002DE10153725A1 Struktur zum Herausführen flexibler Leiterelemente Structure for leading flexible conductor elements
06/13/2002DE10112355C1 Temperature-sensitive electronic component mounting method uses removable protection device for protecting component during mounting process
06/13/2002DE10111185A1 Ceramic-metal substrate has profiling in metal layer for reducing thermodynamic stresses provided in vicinity of electrical components or contact elements
06/13/2002DE10060407A1 Laser beam boring device e.g. for boring blind holes in multi layer circuit boards, uses frequency-sensitive plasma radiation detector for detecting radiation intensity during boring of holes
06/13/2002DE10059176A1 Intermediate carrier for semiconductor module has its lower surface provided with recesses for defining outer terminals cooperating with printed circuit board
06/13/2002DE10057494A1 Anordnung auf einem Schaltungsträger und einer Leiterplatte oder einer Leiterplattenanordnung Arrangement on a circuit board and a circuit board or a printed circuit board assembly
06/13/2002CA2431751A1 A connection between a conductive substrate and a laminate
06/13/2002CA2429683A1 Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg
06/12/2002EP1213952A2 Circuit substrate and manufacturing method thereof
06/12/2002EP1213951A2 Component-mounting method and component-mounting apparatus
06/12/2002EP1213924A1 Portable telephone provided with image pickup device
06/12/2002EP1212927A1 A printed circuit board assembly
06/12/2002EP1212899A2 AN INTEGRATED RF MxN SWITCH MATRIX
06/12/2002EP1110277B1 Printed circuit board arrangement with a multipole plug-in connector
06/12/2002EP0753101B1 Engine components including ceramic-metal composites
06/12/2002CN1353865A Power feed and heat dissipating device for power semiconductor devices
06/12/2002CN1353457A Combined part of metal base
06/12/2002CN1353432A Capacitance element and its manufacturing method and solid electrolytic capacitor carrying capacitance element
06/11/2002US6404660 Semiconductor package with a controlled impedance bus and method of forming same
06/11/2002US6404649 Printed circuit board assembly with improved bypass decoupling for BGA packages
06/11/2002US6404643 Article having an embedded electronic device, and method of making same
06/11/2002US6404598 Flexible circuit routing configuration for a fine/coarse positioner for a tape drive
06/11/2002US6404478 Liquid crystal display having capacitors on a substrate with equal resistance conductors electrically connecting the capacitors to a chip
06/11/2002US6404309 Tuner with non-edge RF input pin/lead
06/11/2002US6404214 Substrate for inspecting electronic device, method of manufacturing substrate, and method of inspecting electronic device
06/11/2002US6404179 Noise eliminating apparatus of high-frequency transmission system
06/11/2002US6404081 Embedded backup energy storage unit
06/11/2002US6404064 Flip-chip bonding structure on substrate for flip-chip package application
06/11/2002US6404062 Semiconductor device and structure and method for mounting the same
06/11/2002US6404052 Multi-layer flexible printed wiring board
06/11/2002US6404044 Semiconductor package with stacked substrates and multiple semiconductor dice
06/11/2002US6404043 Panel stacking of BGA devices to form three-dimensional modules
06/11/2002US6403892 Coated means for connecting a chip and a card
06/11/2002US6403891 Metallization removal under the laser mark area for substrates
06/11/2002US6403757 Modified polyamide resin obtained from reaction of acid anhydride compound with epoxy-terminated polyamide
06/11/2002US6403694 Borosilicate glass powder, crystalline sio2 powder dispersed with photopolymerization initiator, photocurable monomer, and binder comprising an acrylic/modified-cellulosic copolymer having carboxyl group and ethylenic unsaturated side chain
06/11/2002US6403510 Aluminum nitride sintered body and manufacturing method thereof
06/11/2002US6403401 Heat spreader hole pin 1 identifier
06/11/2002US6403229 Cyanate ester based thermoset compositions
06/11/2002US6403220 Phosphorus element-containing crosslinking agents and flame retardant phosphorus element-containing epoxy resin compositions prepared therewith
06/11/2002US6403218 Nickel spinel conductor paste for interior layer of ceramic multilayer electronic part