| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/23/2002 | US6423780 Heterobifunctional monomers and uses therefor |
| 07/23/2002 | US6423624 Ball array layout |
| 07/23/2002 | US6423577 Method for reducing an electrical noise inside a ball grid array package |
| 07/23/2002 | US6423470 Photoimageable; flexibility |
| 07/23/2002 | US6423441 Battery pack signal routing system |
| 07/23/2002 | US6422901 Surface mount device and use thereof |
| 07/23/2002 | US6422877 Apparatus for coupling power to an electronics module |
| 07/23/2002 | US6422687 Electronically addressable microencapsulated ink and display thereof |
| 07/18/2002 | WO2002056655A1 Circuit board and production method therefor |
| 07/18/2002 | WO2002056652A2 Method for the production of an electronic component |
| 07/18/2002 | WO2002056651A1 Circuit board and production method thereof |
| 07/18/2002 | WO2002056464A1 Filtering circuit and power supply device equipped with same |
| 07/18/2002 | WO2002056335A1 Circuit assembly for inclusion within fluorescent lamp |
| 07/18/2002 | WO2002056154A2 Usb securing device with keypad |
| 07/18/2002 | WO2002055977A2 Air data sensor |
| 07/18/2002 | WO2002055908A1 Plastic control plate for the gearbox control device of a hydraulic motor vehicle |
| 07/18/2002 | WO2002055907A1 Hydraulic motor-vehicle gearbox control device with a plastic hydraulic distribution plate and conductors integrated therein |
| 07/18/2002 | WO2002055603A1 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| 07/18/2002 | WO2002055431A2 Wafer level interconnection |
| 07/18/2002 | WO2002055255A1 Device for laser beam drilling of blind holes in multi-layer printed circuit boards |
| 07/18/2002 | WO2002038318B1 Method for defined mechanical drilling of electric printed circuit boards or printed circuit board stacks and drilling support for use in this method |
| 07/18/2002 | WO2002035554A8 Electroconductive metal paste and method for production thereof |
| 07/18/2002 | US20020094929 Glass ceramic sintered product and process for production thereof |
| 07/18/2002 | US20020094705 High speed, high density interconnect system for differential and single-ended transmission applications |
| 07/18/2002 | US20020094604 Method for fabricating a multilayer ceramic substrate |
| 07/18/2002 | US20020094603 Three-dimensional memory stacking using anisotropic epoxy interconnections |
| 07/18/2002 | US20020094491 Laser ablatable material and its use |
| 07/18/2002 | US20020094423 Multilayer ceramic wiring board and process for producing same |
| 07/18/2002 | US20020093803 Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
| 07/18/2002 | US20020093802 High-g mounting arrangement for electronic chip carrier |
| 07/18/2002 | US20020093800 Connection arrangements for electrical devices |
| 07/18/2002 | US20020093793 Light source comprising a large number of light-emitting diodes |
| 07/18/2002 | US20020093562 Laser printing method and apparatus |
| 07/18/2002 | US20020093402 Voltage tunable laminated dielectric materials for microwave applications |
| 07/18/2002 | US20020093401 Voltage tunable laminated dielectric materials for microwave applications |
| 07/18/2002 | US20020093361 Engagement probes |
| 07/18/2002 | US20020093259 Brushless motor |
| 07/18/2002 | US20020093109 Composition and method for containing metal ions in electronic devices |
| 07/18/2002 | US20020093095 Heat spreader hole pin 1 identifier |
| 07/18/2002 | US20020093091 Method of fabricating a ground-ball bonding structure without trapped air for tape ball grid array application |
| 07/18/2002 | US20020093080 Process carrier for flexible substrates |
| 07/18/2002 | US20020092676 Compliant layer for encapsulated cloumns |
| 07/18/2002 | US20020092675 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| 07/18/2002 | US20020092674 Surface-mounting substrate and structure comprising substrate and part mounted on the substrate |
| 07/18/2002 | US20020092672 Contact pads and circuit boards incorporating same |
| 07/18/2002 | US20020092610 Supporting substrate to be bonded with semiconductor bare chip and method of thermocompression-bonding the same |
| 07/18/2002 | US20020092600 Multi-level web structure in use for thin sheet processing |
| 07/18/2002 | US20020092392 Punching unit |
| 07/18/2002 | US20020092163 Mounting a flexible printed circuit to a heat sink |
| 07/18/2002 | US20020092159 Multi-layer interconnect |
| 07/18/2002 | DE10115976A1 Mobile radio terminal is flexible circuit board without housing with voice control device, with which all functions can be controlled by voice input, wireless power receiver |
| 07/18/2002 | DE10101957A1 Electromechanical part has stamped and/or molded electrically conducting conductor frame encased in plastic, conducting tracks applied to plastic body, IC(s) connected to frame/track(s) |
| 07/18/2002 | DE10100180A1 Circuit board with connection pads for connecting to electronic component has measurement pads next to connection pads and connected to at least one connection pad or evaluation circuit |
| 07/18/2002 | DE10065643A1 Vorrichtung und Verfahren zum elektrochemischen Behandeln von bandförmigem und plattenförmigem Gut Apparatus and method for electrochemical treatment of strip-shaped and board-shaped |
| 07/18/2002 | CA2770436A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/18/2002 | CA2660875A1 Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same |
| 07/18/2002 | CA2434217A1 Air data sensor |
| 07/17/2002 | EP1223794A1 Wiring board having connector and method of manufacturing the same |
| 07/17/2002 | EP1222843A1 Base webs for printed circuit board production using the foam process and acrylic fibers |
| 07/17/2002 | EP1222725A1 Universal multi-functional common conductive shield structure for electrical circuitry and energy conditioning |
| 07/17/2002 | EP1222034A1 Method of forming a thin metal layer on an insulating substrate |
| 07/17/2002 | EP1196463A4 Epoxy resin prepared from p-hydroxystyrene having high functionality, low melt viscosity with high glass transition temperature |
| 07/17/2002 | CN1359606A 印刷电路板 A printed circuit board |
| 07/17/2002 | CN1359538A Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
| 07/17/2002 | CN1359475A Optical wavelength division multiplexer/demultiplexer having preformed passively aligned optics |
| 07/17/2002 | CN1359258A Deformation-resistant installation structure for portable apparatus |
| 07/17/2002 | CN1359256A Flexible wire distribution board and making method |
| 07/17/2002 | CN1087898C High-frequency electron device |
| 07/17/2002 | CN1087761C Process for increasing adhesive capacity of polyimide to active metal |
| 07/17/2002 | CN1087669C Nickel powder and preparation process thereof |
| 07/16/2002 | US6421783 Microprocessor and main board mounting arrangement |
| 07/16/2002 | US6421253 Durable laminated electronics assembly using epoxy preform |
| 07/16/2002 | US6421250 Multi in-line memory module and matching electronic component socket |
| 07/16/2002 | US6421225 Electric component |
| 07/16/2002 | US6421013 Tamper-resistant wireless article including an antenna |
| 07/16/2002 | US6420900 Semiconductor memory |
| 07/16/2002 | US6420790 Semiconductor device |
| 07/16/2002 | US6420789 Ball grid array chip packages having improved testing and stacking characteristics |
| 07/16/2002 | US6420778 Differential electrical transmission line structures employing crosstalk compensation and related methods |
| 07/16/2002 | US6420664 Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate |
| 07/16/2002 | US6420662 Wiring board |
| 07/16/2002 | US6420660 Film used as a substrate for integrated circuits |
| 07/16/2002 | US6420659 Flexible wiring board pieces and wiring sheets |
| 07/16/2002 | US6420658 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 07/16/2002 | US6420476 Composite dielectric material composition, and film, substrate, electronic part and molded article produced therefrom |
| 07/16/2002 | US6420441 Dispersing removable crosslinked polymer porogens in a polysiloxane, curing, and heating to remove porogen; low dielectric constant; high porosity; insulation materials |
| 07/16/2002 | US6420096 Less metal is required compared to other thin film methods; metallic base layer, photoresist layer, electroconductive layer on exposed regions; photoresist is removed and the metallic base layer is etched |
| 07/16/2002 | US6420093 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 07/16/2002 | US6420018 Low thermal expansion circuit board and multilayer wiring circuit board |
| 07/16/2002 | US6420017 Preventing the burst or void phenomenon of a copper paste, through hole copper clad laminates with a paper phenol or a paper epoxy used as a base; discharging out gas from the through hole |
| 07/16/2002 | US6419981 Impregnated glass fiber strands and products including the same |
| 07/16/2002 | US6419980 Process for producing an automatic-machine-bondable ceramic circuit carrier, and automatic-machine-bondable ceramic circuit carrier |
| 07/16/2002 | US6419523 Small form-factor pluggable transceiver cage |
| 07/16/2002 | US6419502 Electrical connector assembly with improved contact arrangement |
| 07/16/2002 | US6419501 Connector for flexible printed circuit board |
| 07/16/2002 | US6418616 Full additive process with filled plated through holes |
| 07/16/2002 | US6418615 Method of making multilayered substrate for semiconductor device |
| 07/12/2002 | CA2367600A1 High speed, high density interconnect system for differential and single-ended transmission applications |
| 07/11/2002 | WO2002054847A2 Interconnecting module for the base of electronic equipment casing |
| 07/11/2002 | WO2002054843A1 Production method of circuit board module |