| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/04/2002 | WO2002035289A3 Method and materials for printing particle-enhanced electrical contacts |
| 07/04/2002 | WO2001073864A3 Thin-film battery having ultra-thin electrolyte and associated method |
| 07/04/2002 | WO2000070676A9 High-density electronic package, and method for making same |
| 07/04/2002 | US20020086598 Fabrics comprising resin compatible yarn with defined shape factor |
| 07/04/2002 | US20020086591 Connecting terminal and method of mounting the same onto a circuit board |
| 07/04/2002 | US20020086561 Wiring board |
| 07/04/2002 | US20020086549 Resist mask having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer |
| 07/04/2002 | US20020086459 Circuit mounting method, circuit mounted board, and semiconductor device |
| 07/04/2002 | US20020086171 Adhesive strength |
| 07/04/2002 | US20020086146 Contacts in which the gold and nickel layers are replaced with a single layer of a conductive ink; efficiency, simplification |
| 07/04/2002 | US20020086145 Printed wiring board and method of manufacturing a printed wiring board |
| 07/04/2002 | US20020085888 Electronic supports and methods and apparatus for forming apertures in electronic supports |
| 07/04/2002 | US20020085823 Layered circuit boards and methods of production thereof |
| 07/04/2002 | US20020085364 Electronic package with high density interconnect layer |
| 07/04/2002 | US20020085362 Low cost feature to indicate package orientation |
| 07/04/2002 | US20020085360 Layered circuit boards and methods of production thereof |
| 07/04/2002 | US20020085334 Multiple tier array capacitor and methods of fabrication therefor |
| 07/04/2002 | US20020085191 Device for exposure of a peripheral area of a film circuit board |
| 07/04/2002 | US20020085188 Apparatus and method for compensating for distortion of a printed circuit workpiece substrate |
| 07/04/2002 | US20020084876 Slotted ground plane for controlling the impedance of high speed signals on a printed circuit board |
| 07/04/2002 | US20020084868 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/04/2002 | US20020084778 Inner component board assembly for an electric utility meter |
| 07/04/2002 | US20020084536 Interconnected circuit board assembly and method of manufacture therefor |
| 07/04/2002 | US20020084533 Efficient multiple power and ground distribution of SMT IC packages |
| 07/04/2002 | US20020084528 Wafer level package and method for manufacturing the same |
| 07/04/2002 | US20020084524 Ball grid array package comprising a heat sink |
| 07/04/2002 | US20020084514 Wiring substrate for high frequency applications |
| 07/04/2002 | US20020084456 Multilayered wiring board and production method thereof |
| 07/04/2002 | US20020084332 Memory card, and receptacle for same |
| 07/04/2002 | US20020084312 Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to vias |
| 07/04/2002 | US20020084310 Heat bonding method and heat bonding device |
| 07/04/2002 | US20020084107 High frequency semiconductor chip package and substrate |
| 07/04/2002 | US20020084105 Via -in-pad with off-center geometry and methods of manufacture |
| 07/04/2002 | US20020084104 Multilayer circuit board having a capacitor and process for manufacturing same |
| 07/04/2002 | US20020084103 Silicon nitride ceramic substrate, silicon nitride ceramic circuit board using the substrate, and method of manufacturing the substrate |
| 07/04/2002 | US20020084091 Ceramic condenser module |
| 07/04/2002 | US20020084090 Tamper-responding encapsulated enclosure having flexible protective mesh structure |
| 07/04/2002 | US20020084019 Two-pack adhesive; A contains components selected from one or more acrylic monomers, peroxide, reducing agent, epoxy resin precursor and curing agent; B contains all of the remaining components which are not selected in A |
| 07/04/2002 | US20020083586 Process for producing multilayer circuit board |
| 07/04/2002 | US20020083585 Layered circuit boards and methods of production thereof |
| 07/04/2002 | US20020083570 Component mounting system and mounting method |
| 07/04/2002 | DE10156263A1 Schaltungseinheit und Verfahren zur Herstellung derselben Circuit unit and method of manufacturing the same |
| 07/04/2002 | DE10063876A1 Aus einer Vielzahl von Leuchtdioden bestehende Lichtquelle For a variety of light-emitting diodes existing light source |
| 07/04/2002 | DE10063714A1 Power semiconductor module comprises a housing, contacting elements, a semiconductor component and a ceramic substrate with a metal coating partially covering the first and the second surface of the ceramic substrate |
| 07/04/2002 | DE10063323A1 Bremschlußlicht als LED-Leiterplatte in einem spritzwassergeschützten Gehäuse Bremschlußlicht as LED circuit board in a splash-proof housing |
| 07/04/2002 | DE10062699A1 Cooling device for electronic controllers has cooling plate deformation filling bearer opening in force-locking manner to form fixed mechanical connection between cooling plate and bearer |
| 07/04/2002 | CA2432936A1 Manufacture of printed circuits using single layer processing techniques |
| 07/03/2002 | EP1220597A1 Structure for inspecting electrical component alignment |
| 07/03/2002 | EP1220591A2 Printed wiring board and method of manufacturing a printed wiring board |
| 07/03/2002 | EP1220590A1 A process for making multilayered cards for printed circuits |
| 07/03/2002 | EP1220589A2 Printed wiring board and method for manufacturing printed wiring board |
| 07/03/2002 | EP1220587A2 Process for contemporaneous manufacture and interconnection between adjoining wiring boards |
| 07/03/2002 | EP1220364A2 Connecting terminal and method of mounting the same onto a circuit board |
| 07/03/2002 | EP1220328A1 Photo-interrupter and semiconductor device using it |
| 07/03/2002 | EP1220316A2 High-frequency switching module and high-frequency apparatus equipped with the same |
| 07/03/2002 | EP1219994A2 Semiconductor device, optoelectronic board, and production methods therefor |
| 07/03/2002 | EP1219437A2 Terminals for circuit board |
| 07/03/2002 | EP1219149A1 Method and article for the connection and repair of flex and other circuits |
| 07/03/2002 | EP1219148A1 Flex circuit having repairable connector tail |
| 07/03/2002 | EP1218896A1 Split inductor with fractional turn of each winding and pcb including same |
| 07/03/2002 | EP1218891A1 Conductor composition |
| 07/03/2002 | EP1218848A1 Registration control during workpiece processing |
| 07/03/2002 | EP1218732A1 Patterned laminates and electrodes with laser defined features |
| 07/03/2002 | EP1218202A1 Method and compositions for printing substrates |
| 07/03/2002 | EP1218178A1 An adhesion promoting layer for use with epoxy prepregs |
| 07/03/2002 | EP1218115A2 Ultrasonic linear or curvilinear transducer and connection technique therefore |
| 07/03/2002 | EP0759832B1 Product vending system with pneumatic product delivery |
| 07/03/2002 | CN1357216A Method and appts. for interconnecting multiple devices on circuit board |
| 07/03/2002 | CN1356863A Multi-layer circuit board and its preparing process |
| 07/03/2002 | CN1356862A Substrate structure |
| 07/03/2002 | CN1356861A Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element |
| 07/03/2002 | CN1356842A Portable telephone equipped with camera unit |
| 07/03/2002 | CN1356702A High-voltage variable resistor |
| 07/03/2002 | CN1356606A Timer including mechanism electrically connected to electric or electronic element of timer |
| 07/03/2002 | CN1356579A Method for improving error of PCB and LCD with said PCB |
| 07/03/2002 | CN1356368A Adhesive |
| 07/03/2002 | CN1356348A Polyamide resin, polyamide resin composition and its shaper product, and process for preparing its substrate for electronic elements |
| 07/03/2002 | CN1356292A Silicon nitride powder, its sintered body, substrate and circuit board and thermoelectric element module thereof |
| 07/03/2002 | CN1356288A Glass-ceramic composition for ceramic-type electromic element, ceramic-type electronic element and process for preparing malti-layer ceramic-type electronic element |
| 07/03/2002 | CN1087102C Semiconductor appts. |
| 07/02/2002 | US6415397 Automated multi-PC-motherboard memory-module test system with robotic handler and in-transit visual inspection |
| 07/02/2002 | US6415346 Pre-charging logic cards for hot insertion |
| 07/02/2002 | US6415104 Heating elements comprising polybutadiene and polyisoprene based thermosetting compositions |
| 07/02/2002 | US6414869 Quad in-line memory module |
| 07/02/2002 | US6414850 Method and apparatus for decoupling ball grid array devices |
| 07/02/2002 | US6414847 Integral dielectric heatspreader |
| 07/02/2002 | US6414835 Capacitive filtered feedthrough array for an implantable medical device |
| 07/02/2002 | US6414561 Connector imbalance compensation apparatus and method |
| 07/02/2002 | US6414506 Interconnect for testing semiconductor dice having raised bond pads |
| 07/02/2002 | US6414441 Flat carrier with an indicating device |
| 07/02/2002 | US6414382 Film carrier tape, semiconductor assembly, semiconductor device and method of manufacturing the same, mounted board, and electronic instrument |
| 07/02/2002 | US6414263 Processing method of printed wiring board |
| 07/02/2002 | US6414248 Compliant attachment interface |
| 07/02/2002 | US6414247 Glass ceramic board |
| 07/02/2002 | US6414246 Printed circuit board (PCB) |
| 07/02/2002 | US6413620 Ceramic wiring substrate and method of producing the same |
| 07/02/2002 | US6413619 Method of making ceramic member and marked ceramic member |
| 07/02/2002 | US6413589 Ceramic coating method |
| 07/02/2002 | US6413102 Center bond flip chip semiconductor carrier and a method of making and using it |
| 07/02/2002 | US6412702 Non-contact IC card having an antenna coil formed by a plating method |