Patents for H05K 1 - Printed circuits (98,583)
06/2002
06/20/2002WO2002049165A1 I-channel surface-mount connector
06/20/2002WO2002049139A1 Process for securing a microwave module to a support
06/20/2002WO2002049103A2 Microelectronic package having bumpless laminated interconnection layer
06/20/2002WO2002049048A2 Multi-layer and user-configurable micro-printed circuit board
06/20/2002WO2002048236A1 Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg
06/20/2002WO2002047899A1 Lightweight circuit board with conductive constraining cores
06/20/2002WO2002047856A2 Irregular shaped copper particles and methods of use
06/20/2002WO2002021886A3 Manufacturing fire retardant circuit boards without the use of fire retardant resin additives
06/20/2002WO2002003397A3 Insulation material for use in high-frequency electronic parts
06/20/2002WO2001099480A3 Printed circuit board having inductive vias
06/20/2002WO2001080574A9 Splitter architecture for a telecommunication system
06/20/2002WO2001060119A3 Lighting body
06/20/2002WO2000057405A9 Method for shunting and deshunting an electrical component and a shuntable/shunted electrical component
06/20/2002US20020077447 Curable polyphenylene ether resin, composition made therefrom, and process for preparing the resin
06/20/2002US20020076974 Spring-loaded heat sink assembly for a circuit assembly
06/20/2002US20020076960 Folding-type electronic apparatus comprising two base members hinge-connected by a hinge connector with an FPC
06/20/2002US20020076956 Electrical connector
06/20/2002US20020076953 Connecting structure of connector - flexible cable and flexible cable
06/20/2002US20020076952 I-channel surface-mount connector with extended flanges
06/20/2002US20020076951 I-channel surface-mount connector
06/20/2002US20020076948 Method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
06/20/2002US20020076919 Composite interposer and method for producing a composite interposer
06/20/2002US20020076912 Method form producing micro bump
06/20/2002US20020076910 High density electronic interconnection
06/20/2002US20020076903 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
06/20/2002US20020076657 Coating the photosensitive paste on a substrate to a thickness in consideration of the photocurable depth known beforehand, exposing, developing; rectangular cross-section and superior high-frequency transmission
06/20/2002US20020076650 I-line photoresist compositions
06/20/2002US20020076543 Layered dielectric nanoporous materials and methods of producing same
06/20/2002US20020076539 Process for producing a multi-layer printer wiring board
06/20/2002US20020076536 Electronic component and method of manufacturing the same
06/20/2002US20020076535 Thermosetting fluorinated dielectrics and multilayer circuit boards
06/20/2002US20020076522 Selective PCB stiffening with preferentially oriented fibers
06/20/2002US20020076497 Method of forming selective electroless plating on polymer surfaces
06/20/2002US20020076095 Automatic optical inspection of printed circuit board packages with polarity
06/20/2002US20020076041 Method for fixing the substrate of an acoustic transducer
06/20/2002US20020075664 Method and apparatus for providing electromagnetic shielding
06/20/2002US20020075662 Stack-type expansible electronic device
06/20/2002US20020075660 Multilayered board comprising folded flexible circuits and methods of manufacture
06/20/2002US20020075658 Module part and electronic device
06/20/2002US20020075640 Expandable computer board with dual shield housing solutions
06/20/2002US20020075637 Computer printed circuit system board with LVD SCSI device direct connector
06/20/2002US20020075633 Electrolytic capacitor, circuit board containing electrolytic capacitor, and method for producing the same
06/20/2002US20020075610 Disc drive shunting device
06/20/2002US20020075597 Method and apparatus for folding thin flexible parts that are used in a disc drive
06/20/2002US20020075253 Flat panel display device
06/20/2002US20020075131 Cermet thin film resistors
06/20/2002US20020075120 Embedded transformer
06/20/2002US20020075116 System, printed circuit board, charger device, user device, and apparatus
06/20/2002US20020075106 High frequency module device and method for its preparation
06/20/2002US20020075105 Microwave circuit packages having a reduced number of vias in the substrate
06/20/2002US20020075104 Coaxial type signal line and manufacturing method thereof
06/20/2002US20020075096 Component carrier
06/20/2002US20020075093 Signal transmission unit
06/20/2002US20020075084 High-frequency module
06/20/2002US20020074686 Extruding and casting composition of resin solution containing poly(amic acid) varnish; electronics, mechanical properties
06/20/2002US20020074667 Wiring board, semiconductor device, and process for production of wiring board
06/20/2002US20020074654 Wiring substrate, wiring board, and wiring substrate mounting structure
06/20/2002US20020074641 Microelectronic package having a bumpless laminated interconnection layer
06/20/2002US20020074557 Substrate having fine lines, method for manufacturing the same, electron-source substrate, and image display apparatus
06/20/2002US20020074415 Memory card, and receptacle for same
06/20/2002US20020074164 Circuit board and electronic equipment using the same
06/20/2002US20020074161 Interconnect
06/20/2002US20020074160 Printed circuit board layout
06/20/2002US20020074157 Apparatus and method for connecting high-frequency circuit boards provided with connecting electrodes formed on bar-shaped member
06/20/2002US20020074144 High-frequency current suppression body using magnetic loss material exhibiting outstanding complex permeability characteristics
06/20/2002DE10148656A1 Schaltungskomponente Circuit component
06/20/2002DE10133660A1 Multilayer circuit module for wireless communication system has passive high frequency components and passive base component layer
06/20/2002DE10127704A1 Harzformulierung, Verfahren zu ihrer Härtung und ihre Verwendung Resin formulation, method of curing and their use
06/20/2002DE10062840A1 Durchkontaktierung von flexiblen Leiterplatten Through connection of flexible printed circuits
06/20/2002DE10060620A1 Plug-in board for computer, has component circuit board and peripheral connection circuit board connectable to each other
06/20/2002DE10032849C2 Elektrisches Gerät mit einem Gehäuse aus verfestigtem polymeren Werkstoff Electrical device having a housing of solidified polymeric material
06/19/2002EP1215948A2 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method
06/19/2002EP1215748A1 Composite high frequency apparatus
06/19/2002EP1215701A2 Substrate having fine line, electron source and image display apparatus
06/19/2002EP1215700A2 Uer ces lignes
06/19/2002EP1215690A2 Ceramic condenser module
06/19/2002EP1215514A1 Photoelectric wiring board, packaging board, and photoelectric wiring board producing method
06/19/2002EP1215087A2 Electrical connection box for a vehicle
06/19/2002EP1214741A2 Control device, particularly for use in automotive engineering
06/19/2002EP0778308B1 Aromatic polyamide film, process for producing the same, and magnetic recording medium and solar cell produced by using the same
06/19/2002CN2496215Y Heat radiating device
06/19/2002CN1354580A Signal transmission device suitable for fast signal transmission, circuit block and integrated circuit
06/19/2002CN1354510A Power semiconductor device
06/19/2002CN1354481A Conducting resin and ceramic electronic unit using it
06/19/2002CN1354208A Conductive ink composition
06/19/2002CN1086492C Detection tag
06/18/2002US6407931 DC to DC converter
06/18/2002US6407930 Structure of printed circuit board with stacked daughter board
06/18/2002US6407906 Multiterminal-multilayer ceramic capacitor
06/18/2002US6407895 PWB ESD discharger
06/18/2002US6407796 Tape carrier package and display device using the same
06/18/2002US6407652 Adapters for RF connectors
06/18/2002US6407508 Driver IC packaging module and flat display device using the same
06/18/2002US6407469 Controller system for pool and/or spa
06/18/2002US6407460 Multilayer circuit board
06/18/2002US6407345 Printed circuit board and method of production thereof
06/18/2002US6407344 Multilayer circuit board
06/18/2002US6407343 Multilayer wiring board
06/18/2002US6407342 Printed circuit board capable of preventing electrical short during soldering process
06/18/2002US6407340 Electric conductor with a surface structure in the form of flanges and etched grooves