Patents for H05K 1 - Printed circuits (98,583)
07/2002
07/11/2002WO2002054839A2 Layered circuit boards and methods of production thereof
07/11/2002WO2002054838A1 Via-in-pad with off-center geometry and methods of manufacture
07/11/2002WO2002054540A1 Reduced-size board-to-board connector
07/11/2002WO2002054477A1 A method and an arrangement for providing vias in printed circuit boards
07/11/2002WO2002054421A2 Multiple tier array capacitor and methods of fabrication therefor
07/11/2002WO2002054420A1 Laminated circuit board and production method for electronic part, and laminated electronic part
07/11/2002WO2002054414A2 Fat conductor
07/11/2002WO2002054122A2 Layered circuit boards and methods of production thereof
07/11/2002WO2002054121A2 Layered circuit boards and methods of production thereof
07/11/2002WO2002054090A1 Inner component board assembly for an electric utility meter
07/11/2002WO2002053807A1 Device and method for electrochemically treating a band-shaped product
07/11/2002WO2002053622A1 Addition copolymers of cyclic olefins containing sulfur
07/11/2002WO2002033798B1 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
07/11/2002WO2002032665A9 A method of manufacturing a fabric article to include electronic circuitry and an electrically active textile article
07/11/2002WO2002030165A3 Apparatus for coupling power to electronics module
07/11/2002US20020091185 Polycarboxy/polyol fiberglass binder
07/11/2002US20020091058 Glass ceramics dielectric material and sintered glass ceramics
07/11/2002US20020090846 Interface connector for a hardware device
07/11/2002US20020090844 Segmented replaceable backplane system for electronic apparatus
07/11/2002US20020090754 Interconnect assembly and z-connection method for fine pitch substrates
07/11/2002US20020090540 Electrical contacting device for an electrochemical fuel cell
07/11/2002US20020090524 For flexible printed circuit board; heat resistance, high strength
07/11/2002US20020090501 Graphitized carbon fibers obtained by spinning, infusibilizing, carbonizing, pulverizing, then graphitizing mesophase pitch; for use in development of semiconductors, electronics, power/light sources
07/11/2002US20020089834 Reduced crosstalk ultrasonic piezo film array on a printed circuit board
07/11/2002US20020089833 Dual-socket interposer and method of fabrication therefor
07/11/2002US20020089830 Wiring pattern decision method considering electrical length and multi-layer wiring board
07/11/2002US20020089828 Semiconductor power element heat dissipation board, and conductor plate therefor and heat sink material and solder material
07/11/2002US20020089825 .Circuit substrate unit and electronic equipment
07/11/2002US20020089810 Integrated thin film capacitor/inductor/interconnect system and method
07/11/2002US20020089798 Interlayer structure with multiple insulative layers with different frequency characteristics
07/11/2002US20020089793 Magnetic head actuator having finely movable tracking device
07/11/2002US20020089634 Wiring substrate, display device, semiconductor chip, and electronic equipment
07/11/2002US20020089405 Method and apparatus for forming a magnetic component on a printed circuit board
07/11/2002US20020089236 Controller system for pool and/or spa
07/11/2002US20020089074 Process for high shear gas-liquid reactions
07/11/2002US20020089057 Semiconductor device including a semiconductor pellet having bump electrodes to pad electrodes of an interconnect board and method for manufacturing same
07/11/2002US20020088977 Stacked capacitor and method of forming the same as well as semiconductor device using the same and circuit board using the same
07/11/2002US20020088355 Apparatus for displacing an article during screening
07/11/2002US20020088277 Conformal fluid data sensor
07/11/2002US20020088116 Method of making a CTE compensated chip interposer
07/11/2002DE10162228A1 Verbindungsstruktur einer Verbindungsvorrichtung und eines flexiblen Kabels und flexibles Kabel A connection device and connection structure of a flexible cable and flexible cable
07/11/2002DE10156262A1 Schaltereinheit Switch unit
07/11/2002DE10150507A1 Verbindungsverfahren und Verbindungsstruktur von Anschlussflächenelektroden und Prüfverfahren für den Verbindungszustand derselben Connection method and connection structure of pad electrodes and test methods for the connection state of the same
07/11/2002DE10149272A1 Optische Maus mit vereinfachtem Aufbau Optical mouse with simplified structure
07/11/2002DE10125476A1 Thermal safety cutout for use with a semiconductor switching element soldered to strip conductor connectors on a printed circuit board as an SMD component breaks a power feed in a strip conductor.
07/11/2002DE10065856A1 Verfahren zur Herstellung von schaltungstragenden Kunststoffgehäusen elektronischer Bauteile Process for the preparation of circuitry supporting plastic packages electronic components
07/11/2002DE10064577A1 Control arrangement in optical transmission/reception module, includes circuit board with radio frequency lines which are connected to package terminals in parallel to board plane
07/11/2002DE10064221A1 Printed circuit board for improving cooling effect with an SMD component has holes near a component to be cooled with regard to contact/cooling surfaces of the component to be cooled.
07/11/2002DE10061588A1 Large-scale integrated circuit has electrical components with radio interface having transmission and reception units for exchanging data using multiple access method
07/11/2002DE10060070A1 Kabelbaumanordnung, insbesondere für Fahrzeuge Cable harness assembly, in particular for vehicles
07/11/2002DE10040303C2 Verfahren zum definierten Tiefenbohren von Sacklöchern (blind vias) in mehrlagigen Leiterplatten (Multilayer) Defined method for deep drilling blind holes (blind vias) in multilayer printed circuit boards (multilayer)
07/11/2002DE10036900C2 Verfahren zur Kontaktierung einer flexiblen Leiterplatte mit einem Kontaktpartner und Anordnung aus flexibler Leiterplatte und Kontaktpartner Method for contacting a flexible circuit board with a contact partner and assembly of flexible printed circuit board and Partners
07/11/2002CA2433612A1 Layered circuit boards and methods of production thereof
07/11/2002CA2433217A1 Interconnecting module for the base of electronic equipment casing
07/11/2002CA2431339A1 Layered circuit boards and methods of production thereof
07/10/2002EP1221829A2 Segmented replaceable backplane system for electronic apparatus
07/10/2002EP1221753A2 A coreless superthin PCB transformer and noncontact battery charger using the same
07/10/2002EP1221717A2 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same
07/10/2002EP1221134A2 Chip card and a method for producing a chip card
07/10/2002EP0738385B1 Measuring probe
07/10/2002CN1358410A Surface treated copper foil and mehtod for preparing the same and copper-clad laminate using the same
07/10/2002CN1358409A Surface treated copper foil and method for preparing the same and copper-clad laminate using the same
07/10/2002CN1358342A Variable capacitance coupling antenna
07/10/2002CN1358131A Method for producing of three-dimensionally arranged conducting and connecting structures for volumetric and energy flows
07/10/2002CN1358059A Structure of reducing mutual inductance between adjacent wires on substrate
07/10/2002CN1357783A 液晶显示器 LCD Monitor
07/10/2002CN1357647A Wiring substrate and its making process and chemical copper plating solution therein
07/10/2002CN1087511C Apparatus for providing controlled impedance in electrical contact
07/09/2002US6418552 Method and apparatus for optimizing trace lengths to maximize the speed of a clocked bus
07/09/2002US6418034 Stacked printed circuit board memory module and method of augmenting memory therein
07/09/2002US6418032 Printed wiring board
07/09/2002US6418031 Method and means for decoupling a printed circuit board
07/09/2002US6418030 Multi-chip module
07/09/2002US6418029 Interconnect system having vertically mounted passive components on an underside of a substrate
07/09/2002US6418023 Vertical surface mount apparatus with thermal carrier
07/09/2002US6418021 Electronic circuit apparatus and method for assembling the same
07/09/2002US6417747 Low cost, large scale RF hybrid package for simple assembly onto mixed signal printed wiring boards
07/09/2002US6417744 Transition between asymmetric stripline and microstrip in cavity
07/09/2002US6417688 Method and apparatus for implementing a highly robust, fast, and economical five load bus topology based on bit mirroring and a well terminated transmission environment
07/09/2002US6417463 Depopulation of a ball grid array to allow via placement
07/09/2002US6417462 Low cost and high speed 3-load printed wiring board bus topology
07/09/2002US6417461 Circuit substrate
07/09/2002US6417460 Multi-layer circuit board having signal, ground and power layers
07/09/2002US6417459 Printed circuit board, and prepreg for a printed circuit board
07/09/2002US6417062 Method of forming ruthenium oxide films
07/09/2002US6417027 High density stackable and flexible substrate-based devices and systems and methods of fabricating
07/09/2002US6416849 Method and structure to reduce low force pin pull failures in ceramic substrates
07/09/2002US6416625 Manufacturing method of fluoro based composite boards
07/09/2002US6416361 Small form-factor pluggable transceiver cage
07/09/2002US6416350 Contact for conductor foil
07/09/2002US6416341 Plastic molding with electrical contacts
07/09/2002US6416333 Extension boards and method of extending boards
07/09/2002US6416139 Vehicle brake control assembly with an integral vehicle motion sensor
07/09/2002CA2195314C Solder pad for printed circuit boards
07/04/2002WO2002052910A2 Manufacture of printed circuits using single layer processing techniques
07/04/2002WO2002052909A2 Flexible printed circuit board
07/04/2002WO2002052908A1 Printed wiring board and method of manufacturing the same
07/04/2002WO2002052589A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device
07/04/2002WO2002052588A1 Semiconductor device, and method and apparatus for manufacturing semiconductor device
07/04/2002WO2002052321A2 Device for the transmission of optical signals by means of planar light guides