| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 07/25/2002 | WO2002057928A2 Signaling on an electromagnetically-coupled bus |
| 07/25/2002 | WO2002057925A2 System and method for providing an improved common control bus for use in on-line insertion of line replaceable units in wireless and wireline access systems |
| 07/25/2002 | WO2002057919A2 Redundant telecommunication system using standby unit memory updating apparatus and method of operation |
| 07/25/2002 | WO2002057343A1 Polyaryl ketone resin film and laminates therof with metal |
| 07/25/2002 | WO2002057100A2 Electric heating system for a motor vehicle |
| 07/25/2002 | WO2002057085A1 Electrodes for a drop-on-demand printer |
| 07/25/2002 | WO2002057075A2 Multi-level web structure in use for thin sheet processing |
| 07/25/2002 | WO2002011500A3 Printed circuit board comprising embedded capacitor and method of forming same |
| 07/25/2002 | WO2001073865A3 Continuous processing of thin-film batteries and like devices |
| 07/25/2002 | WO2001003244A9 Clockspring using flexible printed wiring |
| 07/25/2002 | WO2001002468A9 Composites of powdered fillers and polymer matrix and process for preparing them |
| 07/25/2002 | US20020100010 Field programmable printed circuit board |
| 07/25/2002 | US20020099466 Circuit Production method |
| 07/25/2002 | US20020098965 Containing a diopside crystal phase and a cordierite phase, the remainder being a glass phase and/or other ceramic crystal phases, and having an open porosity of not larger than 1%. |
| 07/25/2002 | US20020098869 System and method for on-line insertion of line replaceable units in wireless and wireline access systems |
| 07/25/2002 | US20020098858 Apparatus for reallocating communication resources to establish a priority call in a fixed wireless access communication system |
| 07/25/2002 | US20020098807 Wearable device |
| 07/25/2002 | US20020098799 Apparatus and method for operating a subscriber interface in a fixed wireless system |
| 07/25/2002 | US20020098743 Power connector |
| 07/25/2002 | US20020098727 Electrical connector |
| 07/25/2002 | US20020098723 Board connector and method of attaching board connector |
| 07/25/2002 | US20020098722 Connector structure, female connector, and male connector |
| 07/25/2002 | US20020098721 Shielded carrier for land grid array connectors and a process for fabricating same |
| 07/25/2002 | US20020098618 Method and apparatus for transferring a feature pattern from an inked surface to a substrate |
| 07/25/2002 | US20020098611 Micro-electromechanical process for fabrication of integrated multi-frequency communication passive components |
| 07/25/2002 | US20020098444 Aromatic polyimide precursor, wherein a 10 mu m thick polyimide film made from the resin and deposited on a silicon substrate has light transmittance at a wavelength of 365 nm of at least 1% and a residual stress of at most 25 MPa. |
| 07/25/2002 | US20020098330 A glass-ceramic for a ceramic electronic part made from a borosilicate glass powder containing boron oxide, silica, atleast one oxide selected from calcium, barium and magnesium; a ceramic powder; and an additive powder |
| 07/25/2002 | US20020098319 Connection material |
| 07/25/2002 | US20020097962 Single and multilayer waveguides and fabrication process |
| 07/25/2002 | US20020097694 Method for establishing a prioirity call in a fixed wireless access communication system |
| 07/25/2002 | US20020097685 Apparatus and method for creating signal and profiles at a receiving station |
| 07/25/2002 | US20020097670 Redundant telecommunication system using memory equalization apparatus and method of operation |
| 07/25/2002 | US20020097566 Semiconductor module |
| 07/25/2002 | US20020097564 System and method for providing an improved common control bus for use in on-line insertion of line replaceable units in wireless and wireline access systems |
| 07/25/2002 | US20020097550 Capacitor unit, method for producing the same, and solid electrolytic capacitor |
| 07/25/2002 | US20020097440 Procedure for photo engraving in high definition on metal |
| 07/25/2002 | US20020097366 Method for decreasing misalignment of a printed circuit board and a liquid crystal display device with the printed circuit board |
| 07/25/2002 | US20020097353 Liquid crystal display device and a method for manufacturing a grounding device |
| 07/25/2002 | US20020097134 Thick film circuit with fuse |
| 07/25/2002 | US20020097117 Voltage tunable laminated dielectric materials for microwave applications |
| 07/25/2002 | US20020097107 Balun transformer for a satellite television tuner |
| 07/25/2002 | US20020096782 Package structure of an image sensor and method for packaging the same |
| 07/25/2002 | US20020096759 Thermal conductive substrate and semiconductor module using the same |
| 07/25/2002 | US20020096732 Semiconductor device |
| 07/25/2002 | US20020096357 Circuit board |
| 07/25/2002 | US20020095785 Methods of manufacturing wiring substrate and electron source substrate and image forming apparatus with the same |
| 07/25/2002 | DE10201818A1 High-resolution photoengraving on metal, especially metal-coated ceramics |
| 07/25/2002 | DE10101359A1 Verfahren zur Herstellung einer elektronischen Baugruppe A process for preparing an electronic assembly |
| 07/25/2002 | DE10101091A1 Hydraulisches Kraftfahrzeug-Getriebesteuergerät mit Kunststoff-Hydraulikverteilerplatte und darin integrierten Leitern und Verfahren zu dessen Herstellung Hydraulic motor vehicle transmission control unit with plastic hydraulic distributor plate and is integrated ladders and method for its manufacture |
| 07/25/2002 | DE10062962A1 Holding device for fastening an electrical component like a capacitor on a supporting substrate has a holder for the component and wiring for making a connection between the component's connectors and contacts on the substrate. |
| 07/25/2002 | CA2434150A1 High-g mounting arrangement for electronic chip carrier |
| 07/25/2002 | CA2431993A1 Layered dielectric nanoporous materials and methods of producing same |
| 07/24/2002 | EP1225795A2 Method and apparatus for forming electric circuit |
| 07/24/2002 | EP1225664A2 Electrical component with conductive tracks |
| 07/24/2002 | EP1225629A2 Component built-in module and method of manufacturing the same |
| 07/24/2002 | EP1225248A1 Resin moldings for application in electronical components |
| 07/24/2002 | EP1225192A1 Polyimides and polyamic acids |
| 07/24/2002 | EP1225048A1 Electrode for a drop-on-demand printer |
| 07/24/2002 | EP1224848A1 Flexible electronic circuitry and method of making same |
| 07/24/2002 | EP1224847A1 Flexible circuit board and method for making a flexible circuit board |
| 07/24/2002 | EP1053507A4 Integral thin-film metal resistor with improved tolerance and simplified processing |
| 07/24/2002 | EP1029431A4 Via pad geometry supporting uniform transmission line structures |
| 07/24/2002 | EP0958717A4 Backplane for high speed data processing system |
| 07/24/2002 | EP0892987B1 Method for manufacturing multi-chip modules utilizing direct lead attach |
| 07/24/2002 | CN2501657Y Surface double-layer board special for multi-layer distributing base board drilling work |
| 07/24/2002 | CN1360743A Antenna for contactless cards, hybrid cards and electronic labels |
| 07/24/2002 | CN1360465A Parts mounting baseplate and making method therefor |
| 07/24/2002 | CN1360464A Method for mfg. multilayer matrix and multilayer matrix made thereby |
| 07/24/2002 | CN1360460A Circuit base board and method for mfg. same |
| 07/24/2002 | CN1360373A 折叠式电子设备 Foldable electronic device |
| 07/24/2002 | CN1360367A Electric connector |
| 07/24/2002 | CN1360320A Synthetic multi-layer ceramic electronic component and mfg. method thereof |
| 07/24/2002 | CN1360072A Copper aloy foil for laminated board |
| 07/24/2002 | CN1088325C Earthing terminal structure |
| 07/24/2002 | CN1088322C Method for forming fiducial mark in resin stencil and stencil formed thereby |
| 07/24/2002 | CN1088321C Method of making circuitized substrate using two different metallization processes |
| 07/24/2002 | CN1088320C Device and method for perforating printed circuit board |
| 07/24/2002 | CN1088319C Thick-film conductor circuit and production method therefor |
| 07/24/2002 | CN1088074C 热塑性聚酰亚胺聚合物 Thermoplastic polyimide polymer |
| 07/24/2002 | CN1088006C Metallic body with vapor deposited treatment layer(s) and adhesion-promoting layer |
| 07/23/2002 | US6424734 Fiducial mark search using sub-models |
| 07/23/2002 | US6424547 Power supply module utilizing expansion power supply units to increase power supply capacity |
| 07/23/2002 | US6424541 Electronic device attachment methods and apparatus for forming an assembly |
| 07/23/2002 | US6424539 Low profile GBIC guide rail assembly |
| 07/23/2002 | US6424536 Circuit board protection method and apparatus |
| 07/23/2002 | US6424535 Hybrid circuit with contact surfaces (solder pads) |
| 07/23/2002 | US6424516 Controlling viscosity; mixture of copper, nickel, or alloy thereof, glass and vehicle |
| 07/23/2002 | US6424400 Display panel including a printed circuit board having a larger opening than the outside shape of the driving IC chip |
| 07/23/2002 | US6424241 Fine tuning system for voltage controlled oscillators |
| 07/23/2002 | US6424233 Complex electronic component with a first multilayer filter having a cavity in which a second filter is mounted |
| 07/23/2002 | US6424030 Semiconductor memory module having double-sided stacked memory chip layout |
| 07/23/2002 | US6424026 Power module with closely spaced printed circuit board and substrate |
| 07/23/2002 | US6423982 Diamond interconnection substrate and a manufacturing method therefor |
| 07/23/2002 | US6423940 Temperature stabilization scheme for a circuit board |
| 07/23/2002 | US6423939 Micro soldering method and apparatus |
| 07/23/2002 | US6423909 Circuit board construction for differential bus distribution |
| 07/23/2002 | US6423908 Substrate for use in forming electronic package |
| 07/23/2002 | US6423906 Surface mount package for long lead devices |
| 07/23/2002 | US6423905 Printed wiring board with improved plated through hole fatigue life |
| 07/23/2002 | US6423904 Laminate printed circuit board with leads for plating |