| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/06/2002 | US6428914 Electrode layer embedded in substrate in such a manner that electrode layer and substrate are in one plane, insulating layer formed on surface of a composite of substrate and electrode layer; high quality displays |
| 08/06/2002 | US6428719 Etching process to selectively remove copper plating seed layer |
| 08/06/2002 | US6428644 Process and apparatus for producing a laminate for electronic parts |
| 08/06/2002 | US6428362 Jack including crosstalk compensation for printed circuit board |
| 08/06/2002 | US6428361 Surface mountable connector assembly including a printed circuit board |
| 08/06/2002 | US6428360 Memory module with offset notches for improved insertion and stability and memory module connector |
| 08/06/2002 | US6428335 Bus bar with terminal insulator and connector guide therefor |
| 08/06/2002 | US6428327 Flexible adapter for use between LGA device and printed circuit board |
| 08/06/2002 | US6428189 L.E.D. thermal management |
| 08/06/2002 | US6427901 System and method for forming stable solder bonds |
| 08/06/2002 | US6427892 Specialized tool adapted for a process for manufacture and interconnection between adjoining printed wiring boards |
| 08/06/2002 | US6427325 Flowable compositions and use in filling vias and plated through-holes |
| 08/01/2002 | WO2002060229A1 A method for the implementation of electronic components in via-holes of a multi-layer multi-chip module |
| 08/01/2002 | WO2002060137A1 Electromagnetically-coupled bus system |
| 08/01/2002 | WO2002060086A1 An electromagnetic coupler |
| 08/01/2002 | WO2002059411A2 Non-woven sheet of aramid floc |
| 08/01/2002 | WO2002059209A1 Polyimide resin precursor solution, laminates for electronic components made by using the solution and process for production of the laminates |
| 08/01/2002 | WO2002041079A3 Positive type photosensitive epoxy resin composition and printed circuit board using the same |
| 08/01/2002 | WO2002025302A3 Gps receiver with mounted antenna and pcb integrated shield |
| 08/01/2002 | WO2002011505A3 Circuit board protection method and apparatus |
| 08/01/2002 | WO2001084581B1 Predetermined symmetrically balanced amalgam with complementary paired portions comprising shielding electrodes and shielded electrodes and other predetermined element portions for symmetrically balanced and complementary energy portion conditioning |
| 08/01/2002 | US20020104034 Signal trace phase delay |
| 08/01/2002 | US20020103555 Computer system and printed circuit board manufactured in accordance with a quasi-Monte Carlo simulation technique for multi-dimensional spaces |
| 08/01/2002 | US20020103318 Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers |
| 08/01/2002 | US20020103303 Graft-modifying a ring-opening polymer of a norbornene monomer with an unsaturated epoxy or carboxylic compounds; impregnating resins for prepregs, sheets, and interlayer insulating films |
| 08/01/2002 | US20020103270 Photo- or heat-curable resin composition and multilayer printed wiring board |
| 08/01/2002 | US20020102501 Photosensitive resin composition and method for formation of resist pattern by use thereof |
| 08/01/2002 | US20020102496 Thin film circuit substrate and manufacturing method therefor |
| 08/01/2002 | US20020102495 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 08/01/2002 | US20020102494 Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
| 08/01/2002 | US20020102441 Aluminum nitride substrate and thin film substrate therewith, and manufacturing method thereof |
| 08/01/2002 | US20020102206 Laminate for printed circuit boards |
| 08/01/2002 | US20020102075 Optical connector and structure of optical connector-packaging/mounting portion |
| 08/01/2002 | US20020101724 Electrical junction box |
| 08/01/2002 | US20020101723 Coaxial wiring within SOI semiconductor, PCB to system for high speed operation and signal quality |
| 08/01/2002 | US20020101309 Voltage tunable laminated dielectric materials for microwave applications |
| 08/01/2002 | US20020101294 Single to differential logic level interface for computer systems |
| 08/01/2002 | US20020101283 RF amplifier |
| 08/01/2002 | US20020101256 Detecting failures in printed circuit boards |
| 08/01/2002 | US20020100986 Electronic device |
| 08/01/2002 | US20020100982 Wafer level package and method for manufacturing the same |
| 08/01/2002 | US20020100967 Semiconductor plastic package and process for the production thereof |
| 08/01/2002 | US20020100966 Method for fabricating a multilayer ceramic substrate |
| 08/01/2002 | US20020100965 Semiconductor module and electronic component |
| 08/01/2002 | US20020100955 Method and apparatus for extending fatigue life of solder joints semiconductor device |
| 08/01/2002 | US20020100913 Substrate having fine line, electron source and image display apparatus |
| 08/01/2002 | US20020100612 Insertion of electrical component within a via of a printed circuit board |
| 08/01/2002 | US20020100611 Insertion of electrical component within a via of a printed circuit board |
| 08/01/2002 | US20020100609 Junction flexible wiring circuit board |
| 08/01/2002 | US20020100608 Multilayer printed wiring board and a process of producing same |
| 08/01/2002 | US20020100607 Electrical component and a shuntable/shunted electrical component and method for shunting and deshunting |
| 08/01/2002 | US20020100600 Stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 08/01/2002 | DE10162950A1 Auf ETM basierende Batterie On ETM-based battery |
| 08/01/2002 | DE10156341A1 Verdrahtungsaufbau für Übertragungsleitung Wiring structure for transmission line |
| 08/01/2002 | DE10104269A1 Verfahren und Vorrichtung zum Abgleichen eines an einer Leiterplatte anzubringenden Oszillators Method and apparatus for adjusting a to be attached to a printed circuit board oscillator |
| 08/01/2002 | DE10103084A1 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation |
| 08/01/2002 | DE10102353A1 LED signal module has dust-tight thermally conducting leadthroughs providing thermally conducting connection from conducting tracks on first main board surface to second main surface |
| 07/31/2002 | EP1227710A1 Production method for copper-clad laminated sheet |
| 07/31/2002 | EP1227578A2 RF amplifier |
| 07/31/2002 | EP1227537A2 Balun transformer for a satellite television tuner |
| 07/31/2002 | EP1227115A2 Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it |
| 07/31/2002 | EP1226592A1 Multi-layered planar coil arrangement and method for production of a planar coil arrangement |
| 07/31/2002 | EP1226201A1 Highly stable packaging substrates and brominated indane derivatives |
| 07/31/2002 | EP1050077A4 High-density computer modules with stacked parallel-plane packaging |
| 07/31/2002 | EP0996955B1 Hybrid circuit arrangement with overload protection |
| 07/31/2002 | CN1362005A Insulation barrier on a printed circuit board |
| 07/31/2002 | CN1361915A Aqueous carbon composition and method for coating a non conductive substrate |
| 07/31/2002 | CN1361869A Multi-layered electronic parts |
| 07/31/2002 | CN1361656A Printing circuit board and method for producing printing circuit board |
| 07/31/2002 | CN1361655A Printing circuit board and method for producing printing circuit board |
| 07/31/2002 | CN1361558A Connection terminal and method for mounting the same terminal on electric circuit board |
| 07/31/2002 | CN1361548A Base board lay-out method and structure to reduce cross-talk of adjacent signals |
| 07/31/2002 | CN1088550C Installation structure for components with terminal |
| 07/31/2002 | CA2336283A1 Method of manufacturing resonant circuit devices |
| 07/30/2002 | US6426879 Load adjustment board and data processing apparatus |
| 07/30/2002 | US6426733 Electron source substrate and image-forming apparatus using the same |
| 07/30/2002 | US6426686 Microwave circuit packages having a reduced number of vias in the substrate |
| 07/30/2002 | US6426617 Hall effect current sensor system packaging |
| 07/30/2002 | US6426551 Composite monolithic electronic component |
| 07/30/2002 | US6426550 Interleaved signal trace routing |
| 07/30/2002 | US6426469 Printed board with signal wiring patterns that can measure characteristic impedance |
| 07/30/2002 | US6426467 Film carrier with adjacent electrical sorting pads |
| 07/30/2002 | US6426466 Peripheral power board structure |
| 07/30/2002 | US6426310 Fabric comprising para-aramid fiber chops bonded with each other by binder, including chops of poly-para-phenylene-diphenylether terephthalamide fibers and poly-para-phenylene terephthalamide fibers |
| 07/30/2002 | US6426154 Ceramic circuit board |
| 07/30/2002 | US6426143 Moulded part and flexible film with a protected printed conductor, and method for producing the same |
| 07/30/2002 | US6425771 IC socket |
| 07/30/2002 | US6425767 Linked PCB and the linking method thereof |
| 07/30/2002 | US6425766 Impedance control in edge card connector systems |
| 07/30/2002 | US6425691 Flexible circuits with strain relief |
| 07/25/2002 | WO2002058444A2 High-g mounting arrangement for electronic chip carrier |
| 07/25/2002 | WO2002058443A1 Contact pads and circuit boards incorporating same |
| 07/25/2002 | WO2002058442A1 Flexible printed wiring board |
| 07/25/2002 | WO2002058413A2 Apparatus and method for operating a subscriber interface in a fixed wireless system |
| 07/25/2002 | WO2002058411A2 System and method for on-line insertion of line replaceable units in wireless and wireline access systems |
| 07/25/2002 | WO2002058409A2 Apparatus and method for creating signal and channel profiles at a receiving station |
| 07/25/2002 | WO2002058277A1 System for coordination of tdd transmission bursts within and between cells in a wireless access system and method of operating said system |
| 07/25/2002 | WO2002058234A2 High frequency printed circuit board via |
| 07/25/2002 | WO2002058152A2 Electronic circuit device and method for manufacturing the same |
| 07/25/2002 | WO2002058145A2 Layered dielectric nanoporous materials and methods of producing same |