| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/13/2002 | US6433272 Crosstalk reduction in constrained wiring assemblies |
| 08/13/2002 | US6432564 Applying conformation layer of glass before metallization |
| 08/13/2002 | US6432539 Electronic packages |
| 08/13/2002 | US6432497 Double-side thermally conductive adhesive tape for plastic-packaged electronic components |
| 08/13/2002 | US6432239 Method of producing ceramic multilayer substrate |
| 08/13/2002 | US6431883 Input/output connector for a mobile electric device |
| 08/13/2002 | US6431882 Connector with two rows of terminals having tail portions with similar impedance |
| 08/13/2002 | US6431879 Printed circuit board connector |
| 08/08/2002 | WO2002062118A1 A stackable microcircuit layer formed from a plastic encapsulated microcircuit and method of making the same |
| 08/08/2002 | WO2002061945A2 Method and device for equalisation of an oscillator for assembly on a circuit board |
| 08/08/2002 | WO2002061833A2 Substrate for an electric component and method for the production thereof |
| 08/08/2002 | WO2002061827A1 Semiconductor device and its manufacturing method |
| 08/08/2002 | WO2002061766A1 Conductive powder and conductive composition |
| 08/08/2002 | WO2002061765A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 08/08/2002 | WO2002060981A1 Glass epoxy board and magnetic head device |
| 08/08/2002 | US20020108052 Image forming apparatus having life information |
| 08/08/2002 | US20020107308 Curable epoxy resin compositions and the cured residues thereof |
| 08/08/2002 | US20020107307 (a) bromine-free epoxy resin and curing agent; (b) a flame retardant additive that is the condensation product of a brominated phenol and a cyanuric halide; and (c) thermoplastic resin, such as a polyphenylene ether |
| 08/08/2002 | US20020107140 Electrocatalyst powders, methods for producing powders and devices fabricated from same |
| 08/08/2002 | US20020106939 Control device and soldering method |
| 08/08/2002 | US20020106914 Flexible circuits |
| 08/08/2002 | US20020106833 Semiconductor device and method for fabricating same |
| 08/08/2002 | US20020106822 Test coupon for measuring a dielectric constant of a memory module board and method of use |
| 08/08/2002 | US20020106577 Photosensitive copper paste and method of forming copper pattern using the same |
| 08/08/2002 | US20020106521 Thermosetting low-dielectric resin composition and use thereof |
| 08/08/2002 | US20020106510 Tensile strength; having no self fusion-bonding ability or self-adhering ability |
| 08/08/2002 | US20020106496 Ceramic based multi-site electrode arrays and methods for their production |
| 08/08/2002 | US20020105791 Processor power delivery system |
| 08/08/2002 | US20020105790 Circuit component |
| 08/08/2002 | US20020105775 Electronic component and method for producing same |
| 08/08/2002 | US20020105774 Electrocoating process to form a dielectric layer in an organic substrate to reduce loop inductance |
| 08/08/2002 | US20020105760 Wiring member of suspension for disc drive |
| 08/08/2002 | US20020105358 Method and apparatus for forming electric circuit |
| 08/08/2002 | US20020105348 Electronically measuring pin-to-pad alignment using resistive pads |
| 08/08/2002 | US20020105087 High performance silicon contact for flip chip |
| 08/08/2002 | US20020105083 Multi-layer interconnect module and method of interconnection |
| 08/08/2002 | US20020105075 Semiconductor module and method for fabricating the semiconductor module |
| 08/08/2002 | US20020105068 Stacked semiconductor device structure |
| 08/08/2002 | US20020105058 Magnetic shielding for integrated circuits |
| 08/08/2002 | US20020105042 Flexible circuit with two stiffeners for optical module packaging |
| 08/08/2002 | US20020104874 Semiconductor chip package comprising enhanced pads |
| 08/08/2002 | US20020104683 Press-fit pin connection checking method and system |
| 08/08/2002 | US20020104681 Multilayer circuit board |
| 08/08/2002 | US20020104677 Electrical conductor |
| 08/08/2002 | US20020104676 Film composite, method for producing the same and its use |
| 08/08/2002 | US20020104671 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 08/08/2002 | US20020104669 Methods and apparatus for shielding printed circuit board circuits |
| 08/08/2002 | US20020104369 Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| 08/08/2002 | DE10164314A1 Herstellungsverfahren für eine dielektrische Vorrichtung in Schichtbauweise und ein Elektrodenpastenmaterial Production method of a dielectric device layer in construction and an electrode paste material |
| 08/08/2002 | DE10105089A1 Elektrischer Leiter Electrical conductor |
| 08/08/2002 | DE10104574A1 Substrat für ein elektrisches Bauelement und Verfahren zur Herstellung Substrate for an electrical component and method for preparing |
| 08/07/2002 | EP1229772A1 Circuit board and method for manufacturing the same, and electronic apparatus comprising it |
| 08/07/2002 | EP1229771A1 Method for manufacturing printed wiring board |
| 08/07/2002 | EP1229770A1 Method for manufacturing printed-circuit board |
| 08/07/2002 | EP1229769A1 Carrier-foiled copper foil circuit, printed circuit board manufacturing method using the circuit, and printed circuit board |
| 08/07/2002 | EP1229768A1 Carrier-foiled composite copper foil, method for manufacturing printed circuit board with resistance circuit, and printed circuit board having resistance circuit |
| 08/07/2002 | EP1229767A1 Bus bar arrangement with an integrated printed circuit board |
| 08/07/2002 | EP1229618A2 Discharge gap apparatus |
| 08/07/2002 | EP1229556A2 Electrical line |
| 08/07/2002 | EP1229555A1 Shielded flat cable |
| 08/07/2002 | EP1229367A2 Optical connector and a structure with a mounted connector |
| 08/07/2002 | EP1229081A1 Novel polyimide copolymer and metal laminate containing the same |
| 08/07/2002 | EP1229079A1 Thermosetting resin composition and use thereof |
| 08/07/2002 | EP1228529A1 Dip formation of flip-chip solder bumps |
| 08/07/2002 | EP1228285A1 Electronic control device for controlling electric units of motor vehicle doors which have different equipment |
| 08/07/2002 | EP1228130A2 Improved pct formulations containing halogenated imides, sodium antimonate, and reinforcing fibers |
| 08/07/2002 | CN1363204A Electric load |
| 08/07/2002 | CN1363125A Ablative method for forming RF ceramic block filters |
| 08/07/2002 | CN1363100A Soft magnetic powder and composite magnetic material using same |
| 08/07/2002 | CN1362851A Lead frame and manufacture method thereof, and manufacture method of heat-conducting substrate |
| 08/07/2002 | CN1362785A High-frequency switch assembly and high-frequency instrument mounting said high-frequency switch assembly |
| 08/07/2002 | CN1362757A Circuit board terminal |
| 08/07/2002 | CN1362739A Semiconductor baseplate and its fabrication process |
| 08/07/2002 | CN1362712A Conducting metal particles, conducting composite metal particles and applied products using same |
| 08/07/2002 | CN1362538A Method for forming copper for chrome-plating of printed circuit board |
| 08/07/2002 | CN1088727C Thermosetting resin composition, solidfying material, preformed material, metal armoured laminated plate and circuit board |
| 08/06/2002 | US6430111 Electronic timepiece |
| 08/06/2002 | US6430059 Integrated circuit package substrate integrating with decoupling capacitor |
| 08/06/2002 | US6430057 Device for interfacing an integrated circuit chip with a printed circuit board |
| 08/06/2002 | US6430054 Electrical junction box |
| 08/06/2002 | US6430047 Standardized test board for testing custom chips |
| 08/06/2002 | US6430030 High k dielectric material with low k dielectric sheathed signal vias |
| 08/06/2002 | US6430025 Multilayer capacitor |
| 08/06/2002 | US6430017 Thermal protection for surge suppressors |
| 08/06/2002 | US6429763 Apparatus and method for PCB winding planar magnetic devices |
| 08/06/2002 | US6429752 Electrical transmission line arrangement having displaced conductor sections |
| 08/06/2002 | US6429630 Apparatus for providing regulated power to an integrated circuit |
| 08/06/2002 | US6429547 Time switch |
| 08/06/2002 | US6429536 Semiconductor device |
| 08/06/2002 | US6429401 Apparatus for verification of assembled printed circuit boards |
| 08/06/2002 | US6429390 Structure and method for forming the same of a printed wiring board having built-in inspection aids |
| 08/06/2002 | US6429387 Electronic component and mounting method and device therefor |
| 08/06/2002 | US6429386 Imbedded die-scale interconnect for ultra-high speed digital communications |
| 08/06/2002 | US6429385 Non-continuous conductive layer for laminated substrates |
| 08/06/2002 | US6429383 Apparatus and method for improving circuit board solder |
| 08/06/2002 | US6429381 High density interconnect multichip module stack and fabrication method |
| 08/06/2002 | US6429312 N-aminoalkyldibenzothiopencarboxamide receptor subtype specific ligands |
| 08/06/2002 | US6429114 Method for fabricating a multilayer ceramic substrate |
| 08/06/2002 | US6429113 Method for connecting an electrical device to a circuit substrate |
| 08/06/2002 | US6429112 Multi-layer substrates and fabrication processes |