| Patents for H05K 1 - Printed circuits (98,583) |
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| 08/20/2002 | US6437660 Method of increasing bus performance to reduce signal propagation delay and achieve incident wave switching |
| 08/20/2002 | US6437451 Test interconnect for semiconductor components having bumped and planar contacts |
| 08/20/2002 | US6437253 Terminal structure to which an electronic component is to be bonded |
| 08/20/2002 | US6437252 Method and structure for reducing power noise |
| 08/20/2002 | US6437251 Flexible board made by joining two pieces through an adhesive film |
| 08/20/2002 | US6437057 Novolak cyanate blends |
| 08/20/2002 | US6436735 Method for mounting an integrated circuit having reduced thermal stresses between a bond pad and a metallic contact |
| 08/20/2002 | US6436517 Continuous molded electronic circuits |
| 08/20/2002 | US6436467 Flexible printed board and method of manufacturing same |
| 08/20/2002 | US6436332 Low loss glass ceramic composition with modifiable dielectric constant |
| 08/20/2002 | US6436316 Thick film conductors |
| 08/20/2002 | US6435881 Device for the electrical and mechanical connection of two printed circuit boards |
| 08/20/2002 | US6434818 High-frequency circuit board and method of producing the same |
| 08/20/2002 | US6434817 Method for joining an integrated circuit |
| 08/20/2002 | CA2252866C Surface mount assembly for electronic components |
| 08/20/2002 | CA2218460C Mounting structure for a relay |
| 08/20/2002 | CA2115553C Plated compliant lead |
| 08/15/2002 | WO2002063934A1 Interconnect |
| 08/15/2002 | WO2002063788A1 Portable telephone |
| 08/15/2002 | WO2002063688A1 Hybrid integrated circuit device and method for fabricating the same and electronic device |
| 08/15/2002 | WO2002063686A2 High performance silicon contact for flip chip |
| 08/15/2002 | WO2002063553A1 Coupling element for double-interface smart card |
| 08/15/2002 | WO2002063261A2 Electronic pressure sensitive transducer apparatus and method for manufacturing same |
| 08/15/2002 | WO2002062757A1 Norbornene-based heterobifunctional monomers and uses therefor |
| 08/15/2002 | WO2002062727A1 Porous ceramic and method for preparation thereof, and microstrip substrate |
| 08/15/2002 | WO2002046322A3 Heat curable ink-jet ink for printing on printed circuit boards |
| 08/15/2002 | WO2002025777A3 Press (non-soldered) contacts for high current electrical connections in power modules |
| 08/15/2002 | WO2002017442A3 Communication connector with inductive compensation |
| 08/15/2002 | WO2001078354A3 Hands-free communication device |
| 08/15/2002 | WO2001047016A9 Method and apparatus for encoding information in an ic package |
| 08/15/2002 | US20020111398 Curable epoxy resin compositions and the cured residues thereof |
| 08/15/2002 | US20020111050 Press (non-soldered) contacts for high current electrical connections in power modules |
| 08/15/2002 | US20020111029 Laser micromachining and electrical structures formed thereby |
| 08/15/2002 | US20020110758 Overcoating elastic material onto substrate; forming stress profiles; photolithographical patterning |
| 08/15/2002 | US20020110752 Method for producing wiring configurations having coarse conductor structures and at least one region having fine conductor structures |
| 08/15/2002 | US20020110697 Nonwarping at higher temperatures for use with lead-free solder to enable the reflow process in which lead-free solder is used to mount electronics |
| 08/15/2002 | US20020110637 Substrate is coated with electroconductive film and subjected to baking; integrated circuits |
| 08/15/2002 | US20020110178 Infrared temperature sensor |
| 08/15/2002 | US20020110013 Coreless superthin PCB transformer and non-contact battery charger using the same |
| 08/15/2002 | US20020109974 Reduction of circuit board component exposure height |
| 08/15/2002 | US20020109814 Display element driving apparatus and display using the same |
| 08/15/2002 | US20020109775 Back-lighted fiducial recognition system and method of use |
| 08/15/2002 | US20020109634 Low cost antennas using conductive plastics or conductive composites |
| 08/15/2002 | US20020109573 Multilayer printed board with a double plane spiral interconnection structure |
| 08/15/2002 | US20020109264 Method of embedding at least one flexible conductive track foil, a conductive track unit as well as an embedding unit therefor |
| 08/15/2002 | US20020109239 Semiconductor device capable of preventing solder balls from being removed in reinforcing pad |
| 08/15/2002 | US20020109238 Pitch compensation in flip-chip packaging |
| 08/15/2002 | US20020109227 Metal bump |
| 08/15/2002 | US20020109213 Methods of making microelectronic assemblies including compliant interfaces |
| 08/15/2002 | US20020109074 Semiconductor device, optoelectronic board, and production methods therefor |
| 08/15/2002 | US20020109000 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
| 08/15/2002 | US20020108781 Printed wiring board and production thereof |
| 08/15/2002 | US20020108779 Multi-layered printed wiring board |
| 08/15/2002 | US20020108778 Apparatus for shielding transmission line effects on a printed circuit board |
| 08/15/2002 | US20020108777 Method and apparatus for coupling integrated circuit packages to bonding pads having vias |
| 08/15/2002 | US20020108776 Multilayer printed circuit board and method of making the same |
| 08/15/2002 | US20020108707 Bonding method and apparatus |
| 08/15/2002 | US20020108240 Low cost and high speed 3 load printed wiring board bus topology |
| 08/15/2002 | CA2337290A1 Foil/ink composite inductor |
| 08/14/2002 | EP1231825A1 Multilayer substrate module and portable wireless terminal |
| 08/14/2002 | EP1231824A2 Process for embedding at least one conductive flexible printed circuit in plastic, conductive printed circuit device and embedding device |
| 08/14/2002 | EP1231637A2 High dielectric constant composite material and multilayer wiring board using the same |
| 08/14/2002 | EP1231500A2 Electronically addressable microencapsulated ink and display thereof |
| 08/14/2002 | EP1231248A1 Conductive and resistive materials with electrical stability for use in electronics devices |
| 08/14/2002 | EP1231240A1 Heat resistant composition |
| 08/14/2002 | EP1231182A2 Out-of-plane micro-device structures |
| 08/14/2002 | EP1230680A2 Method for integrating a chip in a printed board and integrated circuit |
| 08/14/2002 | EP1230107A1 Control device for a motor vehicle and method for producing the same |
| 08/14/2002 | EP1188203A4 Surface mountable connector assembly including a printed circuit board |
| 08/14/2002 | EP1036393A4 Flat surface-mounted multi-purpose wire |
| 08/14/2002 | DE10162749A1 Schaltungsanordnung Circuitry |
| 08/14/2002 | DE10160218A1 Vorrichtung zur gesteuerten Übertragung optischer Signale in Lichtleitern Device for the controlled transmission of optical signals in optical fibers |
| 08/14/2002 | DE10146227A1 Siliciumnitrid-Produkt Silicon nitride product |
| 08/14/2002 | DE10105621A1 Elektrische Leiterplatte Electrical circuit board |
| 08/14/2002 | DE10104267A1 Elektronisches Bauteil mit mindestens einer Isolationslage Electronic component with at least one layer of insulation |
| 08/14/2002 | CN1364402A Printed circuit board assembly with improved thermal performance |
| 08/14/2002 | CN1364208A Wholly aromatic polyamide fiber paper and laminated sheet therefrom |
| 08/14/2002 | CN1364114A Carrier foil-pasted metal foil and production method thereof |
| 08/14/2002 | CN1364053A Improved structure and method for packing image sensor |
| 08/14/2002 | CN1364051A Flexible distributing board and manufacture thereof |
| 08/14/2002 | CN1364050A Structure and method for packaging image sensor |
| 08/14/2002 | CN1364049A Circuit substrate and manufacture thereof |
| 08/14/2002 | CN1363940A Superthin PCB transformer without magnetic core and battery charger therewith |
| 08/14/2002 | CN1363427A Circuit products with welded parts and method for recovery of them for reuse |
| 08/13/2002 | US6434369 Antenna device and portable transceiver |
| 08/13/2002 | US6434034 Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
| 08/13/2002 | US6434016 Apparatus for interconnecting multiple devices on a circuit board |
| 08/13/2002 | US6434014 Printed circuit board connection including a conductor foil |
| 08/13/2002 | US6433993 Multilayer; flexible metal layer, dielectrics, barrier; combustion vapor deposition |
| 08/13/2002 | US6433986 Device having electrical board mounted thereon and method for manufacturing apparatus having the device |
| 08/13/2002 | US6433810 Laser printing method and apparatus for printing characters |
| 08/13/2002 | US6433728 Integrally molded remote entry transmitter |
| 08/13/2002 | US6433650 Electrical transmission arrangement |
| 08/13/2002 | US6433649 Non-reciprocal circuit element and millimeter-wave hybrid integrated circuit board with the non-reciprocal circuit element |
| 08/13/2002 | US6433422 Semiconductor integrated circuit having semiconductor packages for mounting integrated circuit chips on both sides of a substrate |
| 08/13/2002 | US6433417 Electronic component having improved soldering performance and adhesion properties of the lead wires |
| 08/13/2002 | US6433414 Method of manufacturing flexible wiring board |
| 08/13/2002 | US6433286 Method of making higher impedance traces on a low impedance circuit board |
| 08/13/2002 | US6433284 Partially cut multi-planar flexible printed circuit |
| 08/13/2002 | US6433276 Surface mount feedthrough |