| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 08/27/2002 | US6441639 Circuit module connected to a transmission line including arrangement to suppress reflections at a branch point of the transmission line |
| 08/27/2002 | US6441628 CSP BGA test socket with insert and method |
| 08/27/2002 | US6441520 Power module |
| 08/27/2002 | US6441509 Controller for battery-operated vehicle |
| 08/27/2002 | US6441493 Circuit board having interconnection ball lands and ball grid array (BGA) package using the circuit board |
| 08/27/2002 | US6441488 Fan-out translator for a semiconductor package |
| 08/27/2002 | US6441486 BGA substrate via structure |
| 08/27/2002 | US6441471 Wiring substrate for high frequency applications |
| 08/27/2002 | US6441407 Gate controlled thyristor driven with low-inductance |
| 08/27/2002 | US6441337 Laser machining method, laser machining device and control method of laser machining |
| 08/27/2002 | US6441319 Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate |
| 08/27/2002 | US6441318 Compensation adjustable printed circuit board |
| 08/27/2002 | US6441316 Printed-circuit board and a semiconductor module, and a manufacturing process of the semiconductor module |
| 08/27/2002 | US6441314 Multilayered substrate for semiconductor device |
| 08/27/2002 | US6441313 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 08/27/2002 | US6441312 Electronic package with plurality of solder-applied areas providing heat transfer |
| 08/27/2002 | US6441083 Polyamidic acid-containing and fine particles-dispersed composition and production process therefor |
| 08/27/2002 | US6441064 Imidazole-phosphoric acid salts as accelerators for dicyandiamide in one-component epoxy compositions |
| 08/27/2002 | US6440883 Low rate of phase change; cordierite primary crystal phase; may contain potassium and/or a rare earth element |
| 08/27/2002 | US6440775 Method and apparatus for edge connection between elements of an integrated circuit |
| 08/27/2002 | US6440642 Dielectric composition |
| 08/27/2002 | US6440641 Deposited thin film build-up layer dimensions as a method of relieving stress in high density interconnect printed wiring board substrates |
| 08/27/2002 | US6440576 Metal plated aromatic polyimide film |
| 08/27/2002 | US6440567 Halogen free flame retardant adhesive resin coated composite |
| 08/27/2002 | US6440542 Copper-clad laminated board, and circuit board for printed wiring board and method for producing the same |
| 08/27/2002 | US6440331 Electrically conductive coating of printed wiring boards so they can be electroplated; graphite particles, tin oxide and antimony |
| 08/27/2002 | US6440318 Printed circuit board with a multilayer integral thin-film metal resistor and method therefor |
| 08/27/2002 | US6440262 Resist mask having measurement marks for measuring the accuracy of overlay of a photomask disposed on semiconductor wafer |
| 08/27/2002 | US6439919 Cap and low insertion force connector for printed circuit board |
| 08/27/2002 | US6439895 Pin-free socket compatible with optical/electrical interconnects |
| 08/27/2002 | US6439115 Uphill screen printing in the manufacturing of microelectronic components |
| 08/22/2002 | WO2002065822A1 Method for producing wirings with rough conducting structures and at least one area with fine conducting structures |
| 08/22/2002 | WO2002065592A1 Demountable clamping means for land grid array connectors |
| 08/22/2002 | WO2002065487A1 Resistor element, stress sensor and method for manufacturing them |
| 08/22/2002 | WO2002064548A1 Novolak cyanate-based prepolymer compositions |
| 08/22/2002 | WO2002064364A1 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film |
| 08/22/2002 | WO2002064363A1 Laminate and process for producing the same |
| 08/22/2002 | WO2002064301A2 Laser micromachining and electrical structures |
| 08/22/2002 | WO2002033557A3 Single-source or single-destination signal routing |
| 08/22/2002 | WO2002023674A3 Thick film millimeter wave transceiver module |
| 08/22/2002 | US20020115342 Electro-optical connection module |
| 08/22/2002 | US20020115330 System and method for pakage socket with embedded power and ground planes |
| 08/22/2002 | US20020115316 Solderless connector for opto-electric module |
| 08/22/2002 | US20020115313 System and method for package socket with embedded power and ground planes |
| 08/22/2002 | US20020115278 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier |
| 08/22/2002 | US20020115112 Neutrokine-alpha and Neutrokine-alpha splice variant |
| 08/22/2002 | US20020114950 Useful for the preparation of a conductor paste used in an internal conductor layer of a ceramic multilayer electronic part |
| 08/22/2002 | US20020114932 Composite multilayered ceramic board and manufacturing method thereof |
| 08/22/2002 | US20020114726 Electronic device |
| 08/22/2002 | US20020114507 Saw alignment technique for array device singulation |
| 08/22/2002 | US20020114146 Precision on-chip transmission line termination |
| 08/22/2002 | US20020114143 Chip-scale packages stacked on folded interconnector for vertical assembly on substrates |
| 08/22/2002 | US20020114129 Ultra-low impedance power interconnection system for electronic packages |
| 08/22/2002 | US20020113673 Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices |
| 08/22/2002 | US20020113664 Satellite broadcast receiving device having two local oscillation circuits and reduced spurious signal |
| 08/22/2002 | US20020113663 Energy conditioning circuit assembly |
| 08/22/2002 | US20020113311 Device with at least one semiconductor component and a printed circuit board and method of establishing an electromechanical connection between the two |
| 08/22/2002 | US20020113307 High-density flip-chip interconnect |
| 08/22/2002 | US20020113246 Light-emitting unit, light-emitting unit assembly, and lighting apparatus produced using a plurality of light-emitting units |
| 08/22/2002 | US20020113044 Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole |
| 08/22/2002 | US20020112963 Methods for fabricating high-precision thermally stable electromagnetic coils |
| 08/22/2002 | US20020112885 Printed circuit board and method for manufacturing same |
| 08/22/2002 | US20020112884 Circuit board and method of manufacturing the same |
| 08/22/2002 | US20020112882 Ceramic circuit board |
| 08/22/2002 | US20020112879 Electronic parts mounting board and production method thereof |
| 08/22/2002 | US20020112878 Terminals for circuit board |
| 08/22/2002 | US20020112632 Method for supporting sensitive workpieces during processing |
| 08/22/2002 | US20020112347 Methods for trimming electrical parameters in an electrical circuit |
| 08/22/2002 | DE10203353A1 Halbleitermodul und elektronische Komponente Semiconductor and electronic component module |
| 08/22/2002 | DE10154556A1 Gestapelte Halbleiterbauelementestruktur Stacked semiconductor device structure |
| 08/22/2002 | DE10111882C1 Verfahren und Vorrichtung zum Falten flexibler Trägerfolien Method and apparatus for folding flexible carrier films |
| 08/22/2002 | DE10108073A1 Leuchtvorrichtung Lighting device |
| 08/22/2002 | DE10103390A1 Verfahren und System zum Herstellen einer im Wesentlichen ringförmigen Lotverbindung A method and system for producing a substantially annular solder joint |
| 08/22/2002 | CA2372757A1 Electronic parts and method producing the same |
| 08/21/2002 | EP1233663A2 Via fill compositions for direct attach of devices and methods for applying same |
| 08/21/2002 | EP1233662A1 Foil/ink composite inductor |
| 08/21/2002 | EP1233661A2 Methods for trimming electrical parameters in an electrical circuit |
| 08/21/2002 | EP1233474A2 Electrical connection system and method for flat circuits |
| 08/21/2002 | EP1233426A2 Antennas with conductive plastics or conductive composites |
| 08/21/2002 | EP1233370A1 Method of manufacturing resonant circuits |
| 08/21/2002 | EP1232868A2 Image forming apparatus having life information |
| 08/21/2002 | EP1232844A1 Aromatic polyamide film |
| 08/21/2002 | EP1232679A1 Printed circuit board employing lossy power distribution network to reduce power plane resonances |
| 08/21/2002 | EP1232677A2 Flip chip package, circuit board thereof and packaging method thereof |
| 08/21/2002 | EP1232542A1 Dual function lamp socket |
| 08/21/2002 | EP1232540A1 Differential signal electrical connectors |
| 08/21/2002 | EP1232439A1 A memory expansion module with stacked memory packages |
| 08/21/2002 | EP0995199B1 Electrical device, electrical appliance or lighting device |
| 08/21/2002 | EP0795262B1 Chemically grafted electrical devices |
| 08/21/2002 | CN2507221Y Column fastened on printed circuit board for keeping space |
| 08/21/2002 | CN1365249A Anti-alter multilayer board and its design device, method, program and program record medium |
| 08/21/2002 | CN1089543C Magnetic prepreg, its mfg. method and printed wiring board employing said prepreg |
| 08/20/2002 | US6438637 Dual solder-hole layout for expansion slots |
| 08/20/2002 | US6438281 Optical wiring layer, optoelectric wiring substrate, mounted substrate, and methods for manufacturing the same |
| 08/20/2002 | US6437991 Radioelectronic unit |
| 08/20/2002 | US6437990 Multi-chip ball grid array IC packages |
| 08/20/2002 | US6437989 Circuit board with an electronic component and a method for producing a connection between the circuit board and the component |
| 08/20/2002 | US6437986 Fuse relay junction block for use in automobiles |
| 08/20/2002 | US6437673 Transformer assembling method, transformer, transformer-mounted substrate, power supply unit having transformer-mounted substrate, and recording apparatus including power supply unit |
| 08/20/2002 | US6437669 Microwave to millimeter wave frequency substrate interface |