| Patents for H05K 1 - Printed circuits (98,583) |
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| 09/03/2002 | US6444066 Blending dielectric and glass powders of oxides of barium, titanium and rare earth metals, then molding into sheets; forming a silver conductor patterns on the surface and heating; suppression diffusion |
| 09/03/2002 | US6443737 Circuit board, electrical connection box having the circuit board and method of making the circuit board |
| 09/03/2002 | US6443351 Method of achieving solder ball coplanarity on ball grid array integrated circuit package |
| 09/03/2002 | US6442832 Method for coupling a circuit board to a transmission line that includes a heat sensitive dielectric |
| 09/03/2002 | US6442818 Method for positioning components having critical positioning tolerances for attachment to a circuit board |
| 08/29/2002 | WO2002067646A1 Arrangement with an integrated circuit mounted on a bearing means and a power supply module arrangement |
| 08/29/2002 | WO2002067643A2 High strength vias |
| 08/29/2002 | WO2002067641A1 Wiring board, process for producing the same, polyimide film for use in the wiring board, and etchant for use in the process |
| 08/29/2002 | WO2002067640A1 Electronic device and method of manufacturing the same |
| 08/29/2002 | WO2002067639A1 An electronic device and a circuit arrangement |
| 08/29/2002 | WO2002067638A1 Printed wiring board, multilayer printed wiring board, and, method of detecting foreign matter and voids in inner layer of multilayer printed wiring board |
| 08/29/2002 | WO2002067614A2 Method for establishing a priority call in a fixed wireless access communication system |
| 08/29/2002 | WO2002067613A2 Apparatus for reallocating communication resources to establish a priority call in a fixed wireless access communication system |
| 08/29/2002 | WO2002067325A2 High-density flip-chip interconnect |
| 08/29/2002 | WO2002067324A1 Member for electronic circuit, method for manufacturing the member, and electronic part |
| 08/29/2002 | WO2002067278A2 Electrolytic capacitors and method for making them |
| 08/29/2002 | WO2002066539A1 Poly amic acid system for polyimides |
| 08/29/2002 | WO2002066485A2 Novel hydroxyaryl phosphine oxides, glycidyl ethers and epoxy compositions, composites and laminates derived therefrom |
| 08/29/2002 | WO2002066256A2 Process for the manufacture of printed circuit boards with plated resistors |
| 08/29/2002 | WO2002046323A3 Uv curable ink-jet legend ink for printing on printed circuit boards |
| 08/29/2002 | WO2002045474A3 Board integrated resilient contact elements array and method of fabrication |
| 08/29/2002 | WO2002039794A3 System and method for fabricating printed circuit boards |
| 08/29/2002 | WO2002015651A3 Low inductance transistor module with distributed bus |
| 08/29/2002 | WO2001033927B1 Inter-circuit encapsulated packaging for power delivery |
| 08/29/2002 | WO2000027166A9 Transducer concepts for hearing aids and other devices |
| 08/29/2002 | US20020120091 Poly amic acid system for polyimides |
| 08/29/2002 | US20020119682 Printed circuit board configuration |
| 08/29/2002 | US20020119658 Semiconductor device and method for making the same |
| 08/29/2002 | US20020119366 Secondary battery with terminals and capacitor with terminals |
| 08/29/2002 | US20020119342 Multilayer coating for printed circuits |
| 08/29/2002 | US20020119317 Mixture containing phosphorous compound |
| 08/29/2002 | US20020118560 Substrate-level DC bus design to reduce module inductance |
| 08/29/2002 | US20020118526 Telecommunications chassis and card |
| 08/29/2002 | US20020118525 Telecommunications Chassis and Card |
| 08/29/2002 | US20020118524 Telecommunications chassis and card with flame spread containment |
| 08/29/2002 | US20020118523 Electronic circuit equipment using multilayer circuit board |
| 08/29/2002 | US20020118520 High power amplifier and chassis |
| 08/29/2002 | US20020118519 Composite devices of laminate type and processes for producing same |
| 08/29/2002 | US20020118518 Conductive member grid array interface for mirror array drive apparatus |
| 08/29/2002 | US20020118517 Chip component assembly |
| 08/29/2002 | US20020118516 Board connection structure, electronic device with board connection structure and connector used therein |
| 08/29/2002 | US20020118504 Power supply module |
| 08/29/2002 | US20020118350 Method and apparatus for registration control in production by imaging |
| 08/29/2002 | US20020118332 Liquid crystal display device |
| 08/29/2002 | US20020118309 Tuner and receiver apparatus |
| 08/29/2002 | US20020118014 Hall-effect device mounting for brushless motor commutation |
| 08/29/2002 | US20020117964 Method for vacuum deposition of circuitry onto a thermoplastic material and a vehicular lamp housing incorporating the same |
| 08/29/2002 | US20020117909 Motor provided with flexible circuit board |
| 08/29/2002 | US20020117764 Lead-on-chip type of semiconductor package with embedded heat sink |
| 08/29/2002 | US20020117753 Three dimensional packaging |
| 08/29/2002 | US20020117743 Component built-in module and method for producing the same |
| 08/29/2002 | US20020117652 Heat treatment in a non-oxidizing atmosphere at 150-600 degrees C; no discrete metallic silver on surfaces |
| 08/29/2002 | US20020117468 Method for forming a recognition mark on a substrate for a KGD |
| 08/29/2002 | US20020117331 Manufacturing method for a printed wiring board |
| 08/29/2002 | US20020117330 Resilient contact structures formed and then attached to a substrate |
| 08/29/2002 | US20020117328 Flexible substrate, electro-optical device and electronic device |
| 08/29/2002 | DE10203366A1 Mikrostreifenleitung, Resonatorelement, Filter, Hochfrequenzschaltung und elektronisches Gerät, das dieselben verwendet Microstrip line resonator, filter, high-frequency circuit and electronic apparatus using the same |
| 08/29/2002 | DE10121969C1 Schaltungsanordnung in Druckkontaktierung und Verfahren zu seiner Herstellung Circuit arrangement in pressure contact and process for its preparation |
| 08/29/2002 | DE10114030A1 Dielektrische Porzellanzusammensetzung und dielektrischer Resonator und nicht strahlender dielektrischer Streifen, für die diese verwendet wird Dielectric porcelain composition and a dielectric resonator and non-radiative dielectric strip, for which it will be used |
| 08/29/2002 | DE10107609A1 Spannungsversorgungsmodul Power Module |
| 08/29/2002 | DE10105190A1 Verfahren zur Herstellung einer Feinstrukturierung eines Materials und Vorrichtung A method for producing a fine structuring of a material and device |
| 08/29/2002 | DE10105069A1 Kopplungselement für Dual-Interface-Karte Coupling element for dual interface card |
| 08/29/2002 | DE10104413A1 Schalter und Verfahren zur Herstellung eines Schalters Switch and method of manufacturing a switch |
| 08/29/2002 | DE10103456C1 Vorrichtung mit mindestens einem Halbleiterbauteil und einer Leiterplatte und Verfahren zur Herstellung einer elektromechanischen Verbindung zwischen beiden A device with at least one semiconductor device and a circuit board and method for producing an electro-mechanical connection between the two |
| 08/29/2002 | DE10047436A1 Sicherheitsmodul Security module |
| 08/28/2002 | EP1235471A1 A stackable module |
| 08/28/2002 | EP1235470A1 Contact pad arrangement for a printed circuit board and process for mounting components thereon |
| 08/28/2002 | EP1235469A2 Circuit board construction for differential bus distribution |
| 08/28/2002 | EP1235295A2 High frequency circuit board and antenna switch module for high frequency using the same |
| 08/28/2002 | EP1235267A1 Two-metal tab tape, double-sided csp tape, bga tape, and method for manufacturing the same |
| 08/28/2002 | EP1235235A1 Electronic parts and method producing the same |
| 08/28/2002 | EP1235233A2 Electrical devices |
| 08/28/2002 | EP1234857A1 Resin composition and flexible printed circuit board |
| 08/28/2002 | EP1234488A1 Inter-circuit encapsulated packaging for power delivery |
| 08/28/2002 | EP1234189A1 Multi-layered electronic parts |
| 08/28/2002 | EP1233935A1 Method for attaching a body, which is comprised of a metal matrix composite (mmc) material, to a ceramic body |
| 08/28/2002 | EP0975891B1 Vibration control system, especially for circuit boards |
| 08/28/2002 | EP0972405B1 Computer system and process for capture, editing and playback of motion video compressed using interframe and intraframe techniques |
| 08/28/2002 | CN2508521Y Circuit board of communication socket |
| 08/28/2002 | CN2508520Y Circuit board indicator structure |
| 08/28/2002 | CN2508472Y Small optical transmission and receiving module casing capable of connecting-disconnecting |
| 08/28/2002 | CN1366798A Laminate with inside layer circuit used for multilayer printed circuit board for high frequency circuit, and method and device for measuring circuit impedance of laminate with inside layer circuit |
| 08/28/2002 | CN1366534A Polyimides and polyamide acids |
| 08/28/2002 | CN1366447A Circuit substrate and its making method and display apparatus |
| 08/28/2002 | CN1366446A Parts built in module and its making method |
| 08/28/2002 | CN1366445A Manufacturing method of multilayer flexible wiring plate |
| 08/28/2002 | CN1366444A Parts built-in module and its making method |
| 08/28/2002 | CN1366323A Electrode base plate used for plasma display screen and its manufacturing method |
| 08/28/2002 | CN1365998A Resin shaping block |
| 08/28/2002 | CN1365879A Punching apparatus |
| 08/28/2002 | CN1365871A Thermal pressure welding method and thermal pressure welding equipment |
| 08/28/2002 | CN1089905C Liquid crystal display device with reduced frame portion surrounding display area |
| 08/28/2002 | CA2373675A1 Optical data link |
| 08/28/2002 | CA2365004A1 Manufacturing method for a printed wiring board |
| 08/27/2002 | US6442644 Memory system having synchronous-link DRAM (SLDRAM) devices and controller |
| 08/27/2002 | US6442525 System for authenticating physical objects |
| 08/27/2002 | US6442057 Memory module for preventing skew between bus lines |
| 08/27/2002 | US6442043 Chip assembly module of bump connection type using a multi-layer printed circuit substrate |
| 08/27/2002 | US6442041 MCM—MLC technology |
| 08/27/2002 | US6442027 Electronic control unit having connector positioned between two circuit substrates |