Patents for H05K 1 - Printed circuits (98,583)
12/2003
12/18/2003US20030230802 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods
12/18/2003US20030230801 Semiconductor device assemblies and packages including multiple semiconductor devices and methods
12/18/2003US20030230797 Semiconductor module structure incorporating antenna
12/18/2003US20030230791 Power distribution plane layout for VLSI packages
12/18/2003US20030230752 LED matrix substrate with convection holes
12/18/2003US20030230568 Electronic device and method of controlling image forming apparatus
12/18/2003CA2816324A1 Rfid label technique
12/18/2003CA2816180A1 Rfid label technique
12/18/2003CA2816158A1 Rfid label technique
12/18/2003CA2488540A1 Apparatus for interfacing electronic circuits
12/18/2003CA2473729A1 Method for manufacturing rfid labels
12/17/2003EP1372366A2 Electronic device and method for using the same
12/17/2003EP1372364A1 Method of manufacturing circuit formed substrate
12/17/2003EP1372220A1 A circuit board terminal
12/17/2003EP1372215A2 Semiconductor module structure incorporating antenna
12/17/2003EP1372190A1 A process for mounting electronic devices onto submounts and submount therefor
12/17/2003EP1371621A1 Metal/ceramic bonding article and method for producing same
12/17/2003EP1371275A1 Circuit support element for electronic devices, in particular for communication terminals
12/17/2003EP1371273A1 Laminate comprised of flat conductor elements
12/17/2003EP1371272A1 Wired transmission path
12/17/2003EP1371010A2 Optical reader imaging module
12/17/2003EP1370701A1 Method of suppressing the oxidation characteristics of nickel
12/17/2003EP0872165B1 Circuit board with screening arrangement against electromagnetic interference
12/17/2003CN1462574A Multilayer printed circuit board
12/17/2003CN1462494A Shielded carrier with components for land grid array connectors
12/17/2003CN1462289A Heat-resistant resin precursor, heat-resistant resin, insulating film and semiconductr device
12/17/2003CN1462172A Printing circuit board having fixed antiwelding layer
12/17/2003CN1462171A Electronic device, printed substrate and method for fixing connector
12/17/2003CN1462088A Manufacturing method of radio circuit and radio circuit
12/17/2003CN1462065A Wiring forming system and wiring forning method for wiring on wiring board
12/17/2003CN1461773A Composition of epoxy resin
12/16/2003US6665736 Computer motherboard for supporting various memories
12/16/2003US6665194 Semiconductor package able to accommodate a large number of connections with improved electrical characteristics
12/16/2003US6665193 Electronic circuit construction, as for a wireless RF tag
12/16/2003US6665191 Multi-folded printed wiring construction for an implantable medical device
12/16/2003US6665185 High capacity cooling systems for electronics located on circuit boards
12/16/2003US6665182 Module unit for memory modules and method for its production
12/16/2003US6665181 Cooling device capable of reducing thickness of electronic apparatus
12/16/2003US6665170 Light emitting diode illumination system
12/16/2003US6665164 Surface mountable over-current protecting apparatus
12/16/2003US6665025 Liquid crystal display device and a method for manufacturing a grounding device
12/16/2003US6664944 Rear electrode structures for electrophoretic displays
12/16/2003US6664942 Signal transmission film and a liquid crystal display panel having the same
12/16/2003US6664883 Apparatus and method for PCB winding planar magnetic devices
12/16/2003US6664874 Mounting structure of high-frequency wiring board
12/16/2003US6664864 Cavity design printed circuit board for a temperature compensated crystal oscillator and a temperature compensated crystal oscillator employing the same
12/16/2003US6664794 Apparatus and method for evaluating the surface insulation resistance of electronic assembly manufacture
12/16/2003US6664649 Lead-on-chip type of semiconductor package with embedded heat sink
12/16/2003US6664645 Method of mounting a semiconductor chip, circuit board for flip-chip connection and method of manufacturing the same, electromagnetic wave readable data carrier and method of manufacturing the same, and electronic component module for an electromagnetic wave readable data carrier
12/16/2003US6664637 Flip chip C4 extension structure and process
12/16/2003US6664620 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
12/16/2003US6664613 Magnetic shielding for integrated circuits
12/16/2003US6664597 Substrate for mounting a semiconductor element thereon and semiconductor device comprising a semiconductor element mounted on said substrate
12/16/2003US6664485 Full additive process with filled plated through holes
12/16/2003US6664483 Electronic package with high density interconnect and associated methods
12/16/2003US6664482 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges
12/16/2003US6664481 Arrangement for enabling trimming on a substrate and a method of producing a substrate that enables trimming
12/16/2003US6664479 Flexible printed circuit board
12/16/2003US6664029 Method of forming pattern
12/16/2003US6664001 Layered substrate with battery
12/16/2003US6663970 Epoxy/resin alloys
12/16/2003US6663946 Multi-layer wiring substrate
12/16/2003US6663799 For use in electrical connection between circuit devices and electrical connection between wirings in a circuit device
12/16/2003US6663741 Stabilization of electrical and electronic apparatus using pressure sensitive adhesives comprising acrylic polymers on substrates, then cutting the lamination, peeling the chips and cooling; stress relieving
12/16/2003US6663740 Manufacturing method and manufacturing apparatus of thin-film laminate
12/16/2003US6663442 High speed interconnect using printed circuit board with plated bores
12/16/2003US6663440 Printed circuit board for pin array connection
12/16/2003US6663401 Electrical connector
12/16/2003US6663400 Wiring board having connector and method of manufacturing the same
12/16/2003US6662647 Conformal fluid data sensor
12/16/2003US6662441 Method for making multi-layer printed circuit board registration
12/16/2003US6662440 Z-axis electrical contact for microelectric devices
12/16/2003US6662439 Ablating through metallic layer to form an interlacing electrode pattern; forming into an electrochemical biosensor strip
12/11/2003WO2003103355A1 Composite multi-layer substrate and module using the substrate
12/11/2003WO2003103352A1 Board for printed wiring, printed wiring board, and method for manufacturing them
12/11/2003WO2003103350A1 Conductive sheet
12/11/2003WO2003103334A1 An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure
12/11/2003WO2003103125A1 Circuit arrangement for controlling electromotive driving means of a mobile working machine, particularly of an industrial truck
12/11/2003WO2003103048A1 Die connected with integrated circuit component
12/11/2003WO2003102863A1 Adapter for connecting card
12/11/2003WO2003102859A1 Optical reader having a plurality of imaging modules
12/11/2003WO2003102277A1 Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board
12/11/2003WO2003102267A1 Method for electroless metalisation of polymer substrate
12/11/2003WO2003102103A1 Method of preparing a stable phenolic resin with low ph
12/11/2003WO2003101902A1 Ltcc tape composition
12/11/2003WO2003036685A3 Method and apparatus for applying conductive ink onto semiconductor substrates
12/11/2003WO2003032340A3 Sodium copper titanate compositions containing a rare earth, yttrium or bismuth
12/11/2003WO2003023477A3 Optical/electrical interconnects and package for high speed signaling
12/11/2003WO2003013148A3 Microencapsulated electrophoretic display with integrated driver
12/11/2003WO2002057100A3 Electric heating system for a motor vehicle
12/11/2003US20030228808 Fuse clip for circuit boards
12/11/2003US20030228776 Right angle board-to-board connector with balanced impedance
12/11/2003US20030228748 Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
12/11/2003US20030228743 Pattern forming method and pattern forming device
12/11/2003US20030227764 Method of manufacturing vehicle electric power distribution system
12/11/2003US20030227756 Temperature characteristic compensation apparatus
12/11/2003US20030227750 Liquid cooled metal thermal stack for high-power dies
12/11/2003US20030227728 Circuit board with protection capability and method of protecting a circuit board
12/11/2003US20030227711 Flex circuit bracket which establishes a diffusion path for a data storage device housing
12/11/2003US20030227593 Liquid crystal display device and manufacturing method of liquid crystal display device