| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 12/25/2003 | US20030235043 Wiring board device |
| 12/25/2003 | US20030235038 Power semiconductor module |
| 12/25/2003 | US20030235029 Tablet computing device with three-dimensional docking support |
| 12/25/2003 | US20030235012 Load torque variation preventing apparatus, magnetic disk apparatus, flat wiring cable and magnetic recording apparatus |
| 12/25/2003 | US20030234620 Electroluminescent lamp module and processing method |
| 12/25/2003 | US20030234447 Contact structure for reliable metallic interconnection |
| 12/25/2003 | US20030234443 Low profile stacking system and method |
| 12/25/2003 | US20030234441 Method of mounting a leadless package and structure therefor |
| 12/25/2003 | US20030234117 Ground connector assembly with substrate strain relief and method of making same |
| 12/25/2003 | US20030234085 Ultrasonic manufacturing apparatus |
| 12/25/2003 | US20030234072 Suppression of planar shrinkage in ltcc ceramic tape laminate structures without externally applied forces |
| 12/24/2003 | WO2003107726A1 A pcb method and apparatus for producing landless interconnects |
| 12/24/2003 | WO2003107085A1 Liquid crystal display |
| 12/24/2003 | WO2003106573A1 A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby |
| 12/24/2003 | WO2003106561A1 Polyester-type formaldehyde free insulation binder |
| 12/24/2003 | WO2003089991A3 Photocurable compositions containing reactive particles |
| 12/24/2003 | WO2003079743A3 Method for fitting out and soldering a circuit board, reflow oven and circuit board for said method |
| 12/24/2003 | DE20315064U1 Energiesparlampe mit semitransparentem Schutzrohr Energy saving lamp with semi-transparent protective tube |
| 12/24/2003 | DE10255337C1 Anordnung zur Reduzierung der elektromagnetischen Abstrahlung und zur Ableitung von Überspannungen Arrangement for reducing the electromagnetic radiation and for the disposal of overvoltages |
| 12/24/2003 | DE10249992C1 Durchsichtige Scheibe mit einer undurchsichtigen Kontaktfläche für eine Lötverbindung Transparent disk with an opaque contact surface for solder |
| 12/24/2003 | CN1463572A Method for mfg. ceramic multilayered board |
| 12/24/2003 | CN1463454A 低电感格栅阵列电容器 Low inductance capacitor array grid |
| 12/24/2003 | CN1463413A Contactless chip card with antenna support and chip support made from fibrous material |
| 12/24/2003 | CN1463412A Product comprising product sub-parts connected to each other by crimp connection |
| 12/24/2003 | CN1463410A Method for producing contactless chip card using transfer paper and intelligent card manufactured by such method |
| 12/24/2003 | CN1463281A Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil |
| 12/24/2003 | CN1463261A Method for mfg. ceramic part |
| 12/24/2003 | CN1463174A High frequency circuit connection structure having good high frequency performance |
| 12/24/2003 | CN1462980A Appts. for removing coating on conductive material of non-donductive carrier |
| 12/24/2003 | CN1132509C Sheet for heat transfer substrate and method for mfg. sheet, and heat transfer substrate using same and mfg. method therefor |
| 12/24/2003 | CN1132267C Three-way connector |
| 12/24/2003 | CN1132203C Monolithic ceramic electronic element and its producing method |
| 12/24/2003 | CN1132195C Hybrid circuit device with overload protection |
| 12/24/2003 | CN1132054C Composite and flexible circuit distributing plate, and its mfg. method, photoelctric device and electronic device |
| 12/23/2003 | US6667857 Head gimbal assembly having a flexible printed circuit |
| 12/23/2003 | US6667561 Integrated circuit capable of operating in multiple orientations |
| 12/23/2003 | US6667560 Board on chip ball grid array |
| 12/23/2003 | US6667559 Ball grid array module and method of manufacturing same |
| 12/23/2003 | US6667556 Flip chip adaptor package for bare die |
| 12/23/2003 | US6667555 Spacer-connector stud for stacked surface laminated multi-chip modules and methods of manufacture |
| 12/23/2003 | US6667550 Installation structure and method for optical parts and electric parts |
| 12/23/2003 | US6667443 Manufacturing method of multilayer substrate and multilayer substrate produced by the manufacturing method |
| 12/23/2003 | US6667441 Diverter device for a flexible circuit |
| 12/23/2003 | US6667256 Glass-ceramic composition for ceramic electronic part, ceramic electronic part, and method for manufacturing multilayer ceramic electronic part |
| 12/23/2003 | US6667235 Semiconductor device and manufacturing method therefor |
| 12/23/2003 | US6667147 Electronic device manufacture |
| 12/23/2003 | US6667107 Thermosetting resin composition and use thereof |
| 12/23/2003 | US6667094 Paste for screenprinting electric structures onto carrier substrates |
| 12/23/2003 | US6667090 Coupon registration mechanism and method |
| 12/23/2003 | US6667072 Sustains surface flattening method by employing participation of porous materials such as zeolites, zeolite like, mesoporous and mesoporous composites; planarized substrate comprises ceramic substrate, buffer layer, nanostructure layer |
| 12/23/2003 | US6666980 Method for manufacturing a resistor |
| 12/23/2003 | US6666964 High density, multilayer printed circuits comprising flexible dielectric substrates having apertures, wire conductors and gold layers formed in electroplating baths; electronics |
| 12/23/2003 | US6666695 Electronic card connector having power contacts |
| 12/23/2003 | US6666692 Electrical connector |
| 12/23/2003 | US6666392 Finely crusted thermosetting resin and inorganic dielectric powder; casting into metal mold, heating, pressurization |
| 12/23/2003 | US6666368 Methods and systems for positioning substrates using spring force of phase-changeable bumps therebetween |
| 12/23/2003 | US6665931 Wiring method for forming conductor wire on a substrate board |
| 12/23/2003 | US6665930 Printed circuit board with SMD components |
| 12/23/2003 | US6665927 Cutting a ground plane to remove circuit board resonance |
| 12/23/2003 | CA2310711C Circuit board with an electronic component and a method for producing a connection between the circuit board and the component |
| 12/23/2003 | CA2302798C Solderless pin connection |
| 12/23/2003 | CA2283212C Opto-electric module |
| 12/23/2003 | CA2200675C A printed antenna structure for wireless data communications |
| 12/21/2003 | CA2430361A1 Redundant battery connections |
| 12/18/2003 | WO2003105545A1 Flexible printed circuit board and process for producing the same |
| 12/18/2003 | WO2003105222A1 Method for contact bonding electronic components on an insulating substrate and component module produced according to said method |
| 12/18/2003 | WO2003105160A1 Conductive paste, multilayer board including the conductive paste and process for producing the same |
| 12/18/2003 | WO2003105109A1 Apparatus for interfacing electronic circuits |
| 12/18/2003 | WO2003105063A2 Cross-reference |
| 12/18/2003 | WO2003104854A2 Long range optical reader |
| 12/18/2003 | WO2003104559A1 Low water paper |
| 12/18/2003 | WO2003104284A2 Epoxide-type formaldehyde free insulation binder |
| 12/18/2003 | WO2003090278A3 Dual-sided heat removal system |
| 12/18/2003 | WO2003078153A3 Lamination of high-layer-count substrates |
| 12/18/2003 | WO2003077132A8 Arrangement of integrated circuits in a memory module |
| 12/18/2003 | WO2003075337A8 Fluxless assembly of chip size semiconductor packages |
| 12/18/2003 | WO2003034636A3 High speed, controlled impedance air dielectric electronic backplane systems |
| 12/18/2003 | WO2003002929A3 Ignitor with printed electrostatic discharge spark gap |
| 12/18/2003 | WO2002052321A3 Device for the transmission of optical signals by means of planar light guides |
| 12/18/2003 | US20030233134 Biocompatible bonding method and electronics package suitable for implantation |
| 12/18/2003 | US20030233133 Biocompatible bonding method and electronics package suitable for implantation |
| 12/18/2003 | US20030232534 Connecting member for flat circuit member and method of connecting the connecting member and the flat circuit member |
| 12/18/2003 | US20030232523 Electrical connector having reliable soldering configuration |
| 12/18/2003 | US20030232517 Electrical connector assembly |
| 12/18/2003 | US20030232489 Methods for manufacturing a hybrid integrated circuit device |
| 12/18/2003 | US20030232462 Semiconductor devices and semiconductor device components with peripherally located, castellated contacts, assemblies and packages including such semiconductor devices or packages and associated methods |
| 12/18/2003 | US20030232205 Bonding nickel/copper alloy plate onto ceramic substrate, applying photoresist, ethching, then removing photoresist; reduces the displacement failure during mounting of semiconductor |
| 12/18/2003 | US20030232204 Metal/ceramic bonding article and method for producing same |
| 12/18/2003 | US20030231533 Circuit board and information storing apparatus equipped therewith |
| 12/18/2003 | US20030231474 PCB method and apparatus for producing landless interconnects |
| 12/18/2003 | US20030231473 Printed wiring board for controlling signal transmission using paired inductance and capacitance |
| 12/18/2003 | US20030231457 Plated terminations |
| 12/18/2003 | US20030231456 Energy conditioning structure |
| 12/18/2003 | US20030231451 Component carrier |
| 12/18/2003 | US20030231275 Liquid crystal display device |
| 12/18/2003 | US20030231099 Resistor structure |
| 12/18/2003 | US20030231088 Semiconductor device and electronic device |
| 12/18/2003 | US20030231076 Structure of non-reciprocal circuit element |
| 12/18/2003 | US20030230813 Method for manufacturing circuit board and circuit board and power conversion module using the same |
| 12/18/2003 | US20030230807 Circuit board with trace configuration for high-speed digital differential signaling |