Patents for H05K 1 - Printed circuits (98,583) |
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03/30/2004 | US6713163 Multilayered printed wiring board |
03/30/2004 | US6713154 A cycloolefin polymer containing carboxy or hydroxy polar groups; an organic peroxide and a hardener; modified norbornene polymer |
03/30/2004 | US6713143 Thermosetting low-dielectric resin composition and use thereof |
03/30/2004 | US6713000 Ultraviolet curable silver composition and related method |
03/30/2004 | US6712621 Thermally enhanced interposer and method |
03/30/2004 | US6712620 Coaxial elastomeric connector system |
03/30/2004 | US6712527 Fiber optic connections and method for using same |
03/30/2004 | US6712486 Mounting arrangement for light emitting diodes |
03/30/2004 | US6712457 Asymmetrical tape automated bonding device for a printhead cartridge |
03/30/2004 | US6711815 Fabricating method of semiconductor devices |
03/30/2004 | US6711814 Method of making printed circuit board having inductive vias |
03/30/2004 | US6711812 Method of making metal core substrate printed circuit wiring board enabling thermally enhanced ball grid array (BGA) packages |
03/30/2004 | CA2300522C Revenue meter bayonet assembly and method of attachment |
03/25/2004 | WO2004026010A1 Circuit-component-containing module |
03/25/2004 | WO2004026009A1 Liquid crystalline polymer composites, method of manufacture thereof, and articles formed therefrom |
03/25/2004 | WO2004025812A1 Assembly for accommodating the power electronics and control electronics of an electric motor |
03/25/2004 | WO2004025773A2 Coaxial elastomeric connector system |
03/25/2004 | WO2004025737A1 Semiconductor device exhibiting enhanced pattern recognition when illuminated in a machine vision system |
03/25/2004 | WO2004025671A2 Electronic transformer/inductor devices and methods for making same |
03/25/2004 | WO2004025552A1 Portable data carrier with a display device |
03/25/2004 | WO2004025341A1 Printed circuit board comprising electrical conductor paths and means for electro-optical and/or opto-electrical conversion |
03/25/2004 | WO2004024808A1 Porous membrane of poly(metaphenylene isophthalamide) and process for producing the same |
03/25/2004 | WO2004024630A1 Dielectric particles having passivated surfaces and methods of forming same |
03/25/2004 | WO2003104284A3 Epoxide-type formaldehyde free insulation binder |
03/25/2004 | WO2003079599A3 A measurement arrangement and telecommunications assembly |
03/25/2004 | WO2003073475B1 Heat sink for semiconductor die employing phase change cooling |
03/25/2004 | WO2003059027A8 System for producing electrical and integrated circuits |
03/25/2004 | WO2003058712A3 Method for assigning power and ground pins in array packages to enhance next level routing |
03/25/2004 | US20040060032 Automated system for designing and developing field programmable gate arrays |
03/25/2004 | US20040059850 Modular server processing card system and method |
03/25/2004 | US20040058593 Coupling adjusting structure for double-tuned circuit |
03/25/2004 | US20040058564 Electric power and communications signal distribution unit, particularly for heads of combination weighers |
03/25/2004 | US20040058473 Substrate for an electric component and method for the production thereof |
03/25/2004 | US20040058172 Strength, processability and dimensional stability properties |
03/25/2004 | US20040058138 Board for printed wiring |
03/25/2004 | US20040058137 Aromatic liquid-crystalline polyester film and metal laminated article |
03/25/2004 | US20040058136 For use in electronic apparatus |
03/25/2004 | US20040057669 Optical line-of-sight inter-board data transfer |
03/25/2004 | US20040057269 Arrangement of integrated circuits in a memory module |
03/25/2004 | US20040057224 High density electronics assembly and method |
03/25/2004 | US20040057222 Method of making a center bond flip chip semiconductor carrier |
03/25/2004 | US20040057221 Dynamic isolating mount for processor packages |
03/25/2004 | US20040057220 Electronic apparatus |
03/25/2004 | US20040057184 Circuit board with added impedance |
03/25/2004 | US20040056673 Test method for semiconductor components using conductive polymer contact system |
03/25/2004 | US20040056105 Data structure encoded on a surface of an object |
03/25/2004 | US20040055785 Fat conductor |
03/25/2004 | US20040055784 Solder interconnections for flat circuits |
03/25/2004 | US20040055782 Surface-mounting type electronic circuit unit having no melting of solder attaching electric part thereto |
03/25/2004 | US20040055770 EMI shield that adheres to and conforms with printed circuit board surfaces |
03/25/2004 | US20040055703 Process for securing a microwave module to a support |
03/25/2004 | US20040055635 Conductive paste, method for manufacturing solar battery, and solar battery |
03/25/2004 | US20040055503 Method and solution for treating fluorocarbon surfaces |
03/25/2004 | US20040055418 Thermal decomposition of metal compound; uniformity, high density particle size; electroconductivity pastes |
03/25/2004 | US20040055153 Method for producing a molding with an integrated conductor run, and a molding |
03/25/2004 | US20040055152 Bonding of a multi-layer circuit to a heat sink |
03/25/2004 | DE4301570B4 Verfahren zur Herstellung einer Induktionsspule A process for producing an induction coil |
03/25/2004 | DE19704600B4 Armaturenbrett mit leitendem Gehäuse Dashboard with conductive housing |
03/25/2004 | DE10341053A1 Verbindungsstruktur eines Flachkabels und Verbindungsverfahren A flat cable connection structure and connection method |
03/25/2004 | DE10334531A1 Speichermodul und Speichersystem, geeignet für einen Hochgeschwindigkeitsbetrieb Memory module and storage system suitable for a high speed operation |
03/25/2004 | DE10248112A1 Multilayer circuit board manufacture, e.g. for motor vehicle control device, by creating groove by machining to remove region of at least one rigid individual layer |
03/25/2004 | DE10242143A1 Elektrische Steckbuchse Electrical socket |
03/25/2004 | DE10241658A1 Partially soldering electrical conductors, comprises removing the insulation from the conducting material, heating the conductor by induction, and supplying solder and flux |
03/25/2004 | DE10241203A1 Circuit board e.g. for add-drop multiplexer in optical communications, has electro-optical and/or opto-electrical component coupled with electrical and optical conductor paths |
03/25/2004 | DE10240685A1 Production of a strip conductor foil comprises pressing a foil made from an electrically conducting material with a coating using a stamp on a plastic film under the action of heat, and removing the foil from the plastic film |
03/25/2004 | CA2498819A1 Transformer/inductor devices and methods for making same |
03/24/2004 | EP1401250A1 Electrodes with a mesh structure |
03/24/2004 | EP1401064A1 An adaptor for electrical connection between connectors having different numbers of poles |
03/24/2004 | EP1400987A2 Conductive paste, method for manufacturing solar battery, and solar battery |
03/24/2004 | EP1400848A1 Circuitry with embossed portions |
03/24/2004 | EP1400789A2 Electric power and communications signal distribution unit, particularly for heads of combination weighers |
03/24/2004 | EP1400552A1 Polyimide compositions useful as dielectric substrates for electronic applications, and methods relating thereto |
03/24/2004 | EP1400500A1 Apparatus, mold, and method for manufacturing metal-ceramic composite member |
03/24/2004 | EP1399976A1 Image generation device, and method for producing such an image generation device |
03/24/2004 | EP1399951A2 Interchangeable microdeposition head apparatus and method |
03/24/2004 | EP1399950A2 Formation of printed circuit board structures using piezo microdeposition |
03/24/2004 | EP1399935A1 Improved method for forming magnetic layers in printed circuit boards |
03/24/2004 | EP1399880A1 Contactless chipcard with an antenna support and chip support made from a fibrous material |
03/24/2004 | EP1399879A1 Multi-feature-size electronic structures |
03/24/2004 | EP1399705A2 Ignitor with printed electrostatic discharge spark gap |
03/24/2004 | EP1399269A1 Waveform generator for microdeposition control system |
03/24/2004 | EP1399268A1 Industrial microdeposition system for polymer light emitting diode displays, printed circuit boards and the like |
03/24/2004 | EP1399267A1 Microdeposition apparatus |
03/24/2004 | EP1290054A4 Glyoxal-phenolic condensates with enhanced fluorescence |
03/24/2004 | EP1138180B1 Printed circuit board and method for fabricating such board |
03/24/2004 | EP0692136B1 High strength conductive polymers |
03/24/2004 | CN1484934A Via-in-pad with off-center geometry and method of manufacture |
03/24/2004 | CN1484869A Fuel cell electric equipment electronic board manufacturing method of electric board connector for fuel cell wiring member and mounting method of fuel cell |
03/24/2004 | CN1484854A A method and an arrangement for providing vias in printed circuit boards |
03/24/2004 | CN1484840A Multiple tier array capacitor and methods of fabrication therefor |
03/24/2004 | CN1484773A Layered circuit boards and methods of production thereof |
03/24/2004 | CN1484674A Thermosetting resin composition and prepreg laminate for circuit board and printed circuit board each made therewith |
03/24/2004 | CN1484480A FPCB connection mechanism |
03/24/2004 | CN1484080A Active matrix substrate, liquid crystal display apparatus waving same, method for mfg of same |
03/24/2004 | CN1143416C Card edge connector |
03/24/2004 | CN1143411C Electrical connector system for shielded flat flexible circuity |
03/24/2004 | CN1143382C Insulated substrate, its making method and modular semiconductor device having the same thereof |
03/24/2004 | CN1143375C Semiconductor device, method of manufacture, circuit board and electronic device |
03/24/2004 | CN1143374C Semiconductor device, method of manufacture thereof, circuit board and electronic device |
03/24/2004 | CN1143373C Semiconductor device, method of manufacture thereof circuit board and electronic device |