| Patents for H05K 1 - Printed circuits (98,583) |
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| 02/05/2004 | US20040020690 Via connector and method of making same |
| 02/05/2004 | US20040020687 Flexible circuit board having electrical resistance heater trace |
| 02/05/2004 | US20040020673 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 02/05/2004 | US20040020202 Channel-shaped connection device for electrical lines of internal conbustion engines |
| 02/05/2004 | US20040020046 Deforming conductive particles by application of a stress; mixing the deformed conductive particles with a binder that includes a thermosetting resin as a main component |
| 02/05/2004 | US20040020031 Method for manufacturing membranes |
| 02/05/2004 | DE4405578B4 Elektronische Baueinheit The electronic package |
| 02/05/2004 | DE19800234B4 Bürstenloser Motor Brushless motor |
| 02/05/2004 | DE10333250A1 A prepreg including a heat hardenable resin composition (D) containing an Al hydroxide/boehmite composite useful as a printed conductor plate for electronic components |
| 02/05/2004 | DE10331811A1 Leiterpaste, Verfahren zum Drucken der Leiterpaste und Verfahren zur Herstellung einer Keramikleiterplatte Conductor paste method for printing the conductor paste and method of manufacturing a ceramic circuit board |
| 02/05/2004 | DE10321224A1 Siloxan-modifiziertes Polyimidharz Siloxane-modified polyimide resin |
| 02/05/2004 | DE10234395A1 Electronic or electrical component e.g. miniature light bulb or LED for automobile or domestic lighting, has knife clamp connector terminal element providing push-fit electrical connection |
| 02/05/2004 | DE10234081A1 Vorrichtung mit einer Schaltungsanordnung mit induktivem Element A device with a circuit with inductive element |
| 02/05/2004 | DE10229120A1 Verfahren, Adapterkarte und Anordnung zum Einbau von Speichermodulen Method, adapter card and arrangement for installation of memory modules |
| 02/05/2004 | DE10109542B4 Anordung zur Verbindung eines auf einer Leiterplatte angebrachten Bauelementes mit einer flexiblen Schichtanordnung Arrangement for connecting a mounted component on a circuit board with a flexible layer arrangement |
| 02/04/2004 | EP1387605A2 Multilayered printed wiring board |
| 02/04/2004 | EP1387445A1 Electrical connector for a camera |
| 02/04/2004 | EP1387442A1 Method of mounting camera module on wiring board |
| 02/04/2004 | EP1387431A1 Transmission line type components |
| 02/04/2004 | EP1387385A1 Plasma display |
| 02/04/2004 | EP1387369A1 High-frequency module device |
| 02/04/2004 | EP1387367A1 Composite particle for dielectrics, ultramicroparticulate composite resin particle, composition for forming dielectrics and use thereof |
| 02/04/2004 | EP1387334A1 Display module and display unit |
| 02/04/2004 | EP1387193A1 Planar optical waveguide apparatus and opto-electronic hybrid circuit using the same |
| 02/04/2004 | EP1387179A2 Printed circuit board integrated with a two-axis fluxgate sensor and method for manufacturing the same |
| 02/04/2004 | EP1386741A1 Slotted substrate and method of making |
| 02/04/2004 | EP1386689A1 Method and device for laser beam machining of laminated material |
| 02/04/2004 | EP1386526A1 Substrate adhesion enhancement to film |
| 02/04/2004 | EP1236264B1 Low cost limited angle torque dc brushless servomotor and method for fabricating thereof |
| 02/04/2004 | EP1183294B1 Process for producing phenol-dicarbonyl condensates with increased fluorescence, epoxy resins, epoxy resin systems and laminates made with the same |
| 02/04/2004 | CN2601838Y Junction device of circuit board and integrated circuit chip and print cartridge adopting said chip |
| 02/04/2004 | CN1473379A Wiring board with terminal |
| 02/04/2004 | CN1473140A Porous silicon nitride ceramic and its manufacturing method |
| 02/04/2004 | CN1473002A 电子机器 Electronic equipment |
| 02/04/2004 | CN1473000A Interlayer arrangement structure for multilayer circuit board |
| 02/04/2004 | CN1472805A Electric circuit elements, electric circuit assembly, electric circuit built-in modules and manufacture thereof |
| 02/04/2004 | CN1472801A Chip packaging substrate |
| 02/04/2004 | CN1472783A Noise shielded multi-layer substrates and manufacture thereof |
| 02/04/2004 | CN1472618A Memory module fixing method, changeover cards and arrangement thereof |
| 02/04/2004 | CN1472558A Photoelectric assembling line module, production and assemblies thereof |
| 02/04/2004 | CN1137613C Printed-wiring board and production method thereof |
| 02/04/2004 | CN1137610C Connection method for printing insulating layer of laminated electronic device |
| 02/04/2004 | CN1137506C Laminated substrate board |
| 02/04/2004 | CN1137385C Improving multi-chip module testability using poled-polymer interlayer dielectrics |
| 02/04/2004 | CN1137229C Water-based thick film conductive compositions |
| 02/03/2004 | US6687842 Off-chip signal routing between multiply-connected on-chip electronic elements via external multiconductor transmission line on a dielectric element |
| 02/03/2004 | US6687459 FPC mounting structure |
| 02/03/2004 | US6687132 Conductive member grid array interface for mirror array drive apparatus |
| 02/03/2004 | US6687108 Passive electrostatic shielding structure for electrical circuitry and energy conditioning with outer partial shielded energy pathways |
| 02/03/2004 | US6687097 Electrostatic protection for magnetic heads |
| 02/03/2004 | US6687074 Magnetic recording and reproducing apparatus capable of preventing deterioration of transmission characteristic |
| 02/03/2004 | US6686987 Liquid crystal display device |
| 02/03/2004 | US6686824 Toroidal printed coil |
| 02/03/2004 | US6686808 Coplanar stripline with corrugated structure |
| 02/03/2004 | US6686766 Technique to reduce reflections and ringing on CMOS interconnections |
| 02/03/2004 | US6686758 Engagement probe and apparatuses configured to engage a conductive pad |
| 02/03/2004 | US6686722 Battery pack containing a circuit breaker |
| 02/03/2004 | US6686666 Plurality of pads formed in stackup that including dielectric and multiple signal routing layers |
| 02/03/2004 | US6686665 Solder pad structure for low temperature co-fired ceramic package and method for making the same |
| 02/03/2004 | US6686664 Structure to accommodate increase in volume expansion during solder reflow |
| 02/03/2004 | US6686643 Substrate with at least two metal structures deposited thereon, and method for fabricating the same |
| 02/03/2004 | US6686539 Tamper-responding encapsulated enclosure having flexible protective mesh structure |
| 02/03/2004 | US6686030 Metal/ceramic circuit board |
| 02/03/2004 | US6686029 Circuit board and method for manufacturing the same |
| 02/03/2004 | US6685817 Controlling thickness of plating over a width of a substrate |
| 02/03/2004 | US6685511 Balanced-transmission cable-and-connector unit |
| 02/03/2004 | US6685488 Electrical connector having improved grounding terminals |
| 02/03/2004 | US6685485 Electrical connector |
| 02/03/2004 | US6684495 Method of making a circuit board not having solder failures |
| 02/03/2004 | CA2296171C Polyamide composition |
| 02/03/2004 | CA2290764C Method of forming dielectric thin film pattern and method of forming laminate pattern comprising dielectric thin film and conductive thin film |
| 01/29/2004 | WO2004010751A1 Multilayer wiring board, method for producing the same, semiconductor device and radio electronic device |
| 01/29/2004 | WO2004010750A1 Printed circuit board element comprising a power supply device for electric and electronic components that are arranged on said board |
| 01/29/2004 | WO2004010500A1 Stacked microelectronic packages |
| 01/29/2004 | WO2004010499A1 Module component |
| 01/29/2004 | WO2004009876A1 Copper electrolyte comprising amine compound having specific skeleton and organic sulfur compound and electrolytic copper foil prepared using the same |
| 01/29/2004 | WO2004009708A1 Curable resin composition |
| 01/29/2004 | WO2004009480A1 Shatterproof ultra-thin glass and the handling thereof |
| 01/29/2004 | WO2004008832A2 Attachable modular electronic systems |
| 01/29/2004 | WO2002099851A3 Temperature controlled vacuum chuck |
| 01/29/2004 | US20040019758 Memory module and memory system suitable for high speed operation |
| 01/29/2004 | US20040019756 Memory device supporting a dynamically configurable core organization |
| 01/29/2004 | US20040019167 Peak melting temperature of >/= 320 degrees C. and good mechanical properties |
| 01/29/2004 | US20040019134 Flame retarded epoxy resin composition |
| 01/29/2004 | US20040018814 Layout of wireless communication circuit on a printed circuit board |
| 01/29/2004 | US20040018726 Patterned thin film and method of forming same |
| 01/29/2004 | US20040018658 Noise shield type multi-layered substrate and munufacturing method thereof |
| 01/29/2004 | US20040018373 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 01/29/2004 | US20040018348 Multilayered printed wiring board |
| 01/29/2004 | US20040018297 Conductive inks for metalization in integrated polymer microsystems |
| 01/29/2004 | US20040018131 Improved adhesion; irradiation polymerization; electroless plating |
| 01/29/2004 | US20040017707 Computer memory cards using flash EEPROM integrated circuit chips and memory-controller systems |
| 01/29/2004 | US20040017672 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 01/29/2004 | US20040017671 Reducing electro magnetic interference (EMI) in integrated circuits operating on both analog and digital signals |
| 01/29/2004 | US20040017670 Multilayer ceramic substrate with a cavity |
| 01/29/2004 | US20040017536 Display device |
| 01/29/2004 | US20040017514 Video signal skew |
| 01/29/2004 | US20040017419 Method of forming a through-substrate interconnect |
| 01/29/2004 | US20040017007 Semiconductor package and substrate thereof |
| 01/29/2004 | US20040016748 Radiator system, radiating method, thermal buffer, semiconductor module, heat spreader and substrate |