| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/17/2004 | CN2606997Y Inner layer structure of circuit board |
| 03/17/2004 | CN2606965Y Integrated circuit connector |
| 03/17/2004 | CN1483303A Use of metallic treatment on copper foil to produce fine lines and replace oxide process in printed circuit board production |
| 03/17/2004 | CN1483302A Carrier-based electronic module |
| 03/17/2004 | CN1483282A Case of folding type multi-display device |
| 03/17/2004 | CN1483208A Method and apparatus for making semiconductor device and the semiconductor device |
| 03/17/2004 | CN1483008A Esd dissipative ceramics |
| 03/17/2004 | CN1482850A Method and apparatus for determining fastener fabrication dimension |
| 03/17/2004 | CN1482847A Structure for preventing mosaic copper metal damage and method thereof |
| 03/17/2004 | CN1482846A 存储模块和存储系统 Memory modules and memory systems |
| 03/17/2004 | CN1482845A Electric circuit board without photosensitive material |
| 03/17/2004 | CN1482512A Imaging device packaging, camera module and the producing process of the camera module |
| 03/17/2004 | CN1482097A Glass ceramic composition, glass ceramic sintered material and ceramic multilayer substrate |
| 03/16/2004 | US6708243 Computer assembly with stub traces coupled to vias to add capacitance at the vias |
| 03/16/2004 | US6707687 Connection structure for radio frequency circuit that exceeds in RF characteristics |
| 03/16/2004 | US6707686 Telecommunications chassis and card |
| 03/16/2004 | US6707685 Multi-layer wiring board |
| 03/16/2004 | US6707684 Electrical contacts couple to a printed circuit board through a socket; high speed signals routed over connectors |
| 03/16/2004 | US6707682 Low-EMI electronic apparatus, low-EMI circuit board, and method of manufacturing the low-EMI circuit board |
| 03/16/2004 | US6707680 Surface applied passives |
| 03/16/2004 | US6707671 Power module and method of manufacturing the same |
| 03/16/2004 | US6707662 Planar polymer capacitor |
| 03/16/2004 | US6707543 Mounting information-collecting device, connector, and mounting information-collecting method |
| 03/16/2004 | US6707350 Distributive multiplexer for space applications |
| 03/16/2004 | US6707288 Apparatus for producing and testing electronic units |
| 03/16/2004 | US6707284 Programmable power supply |
| 03/16/2004 | US6707158 Semiconductor device and method for producing the same, and anisotropic conductive circuit board |
| 03/16/2004 | US6707150 Package support member with high heat-removing ability |
| 03/16/2004 | US6707146 Semiconductor apparatus with decoupling capacitor |
| 03/16/2004 | US6707145 Efficient multiple power and ground distribution of SMT IC packages |
| 03/16/2004 | US6707140 Arrayable, scaleable, and stackable molded package configuration |
| 03/16/2004 | US6707125 Solid-state imaging apparatus and manufacturing method thereof |
| 03/16/2004 | US6706975 Paste for filling throughhole and printed wiring board using same |
| 03/16/2004 | US6706974 Plane splits filled with lossy materials |
| 03/16/2004 | US6706973 Electrical connection with inwardly deformable contacts |
| 03/16/2004 | US6706972 Electronic assembly comprising a sole plate forming a heat sink |
| 03/16/2004 | US6706971 Stackable microcircuit layer formed from a plastic encapsulated microcircuit |
| 03/16/2004 | US6706964 Electronic device and method for manufacturing the same, and method for shielding printed circuit board |
| 03/16/2004 | US6706547 Method of manufacturing a circuit device with trenches in a conductive foil |
| 03/16/2004 | US6706546 Optical reflective structures and method for making |
| 03/16/2004 | US6706464 Prevent short circuiting; solvent-free dielectric films; exposure to actinic radiation |
| 03/16/2004 | US6706409 Silicone oligomer, a specified amount of metal hydrate such as aluminum hydroxide, and a resin; heat resistance, free of bromine compounds |
| 03/16/2004 | US6706326 Process for plating plastics using a catalytic filler |
| 03/16/2004 | US6706236 Method for making holes in ceramic green sheets |
| 03/16/2004 | US6706201 Method for producing metallized substrate materials |
| 03/16/2004 | US6705877 Stackable memory module with variable bandwidth |
| 03/16/2004 | US6705876 Electrical interconnect assemblies and methods |
| 03/16/2004 | US6705509 Method of recovering lead-free solder from printed circuit boards |
| 03/16/2004 | US6705007 Polyimide precursor layer on a first metal layer, adding second metal layer, patterning metal layer to form circuit, imidating the polyimide precursor layer to form a polyimide insulating layer. |
| 03/16/2004 | US6705005 Method of forming assemblies of circuit boards in different planes |
| 03/16/2004 | US6705003 Printed wiring board with plurality of interconnect patterns and conductor bumps |
| 03/11/2004 | WO2004021760A1 Electronic cicuit part mounting machine and mounting position accuracy inspection method for the mounting machine |
| 03/11/2004 | WO2004021749A2 Manufacture of flexible printed circuit boards |
| 03/11/2004 | WO2004021435A1 Module part |
| 03/11/2004 | WO2004020715A1 Glass cloth for printed circuit plate, and multilayer plate |
| 03/11/2004 | WO2004020355A1 Low-temperature, fluoride free fiber glass compositions and products made using same |
| 03/11/2004 | WO2003058717A3 Package for a non-volatile memory device including integrated passive devices and method for making the same |
| 03/11/2004 | WO2003038865A3 Stacking multiple devices using direct soldering |
| 03/11/2004 | WO2003007338A3 Method for attaching an electronic component to a substrate |
| 03/11/2004 | WO2002102224A3 In vivo sensing device with a circuit board having rigid sections and flexible sections |
| 03/11/2004 | WO2002096168A3 Method for the manufacture of a printed circuit and planar antenna manufactured with this printed circuit |
| 03/11/2004 | US20040048732 Dielectric cermic material that contains silver niobium and tantalate |
| 03/11/2004 | US20040048501 Electronic assembly having a removable power supply |
| 03/11/2004 | US20040048420 Method for embedding an air dielectric transmission line in a printed wiring board(PCB) |
| 03/11/2004 | US20040048417 Techniques for joining an opto-electronic module to a semiconductor package |
| 03/11/2004 | US20040048414 Method for the production of an electronic component |
| 03/11/2004 | US20040048132 Fuel cell and electronic device using fuel cell |
| 03/11/2004 | US20040048079 Polyimide/metal laminate, and electric/electronic equipment bases, magnetic recording bases, solar battery bases, coating film for aerospace materials and filmy resistance elements with the use thereof |
| 03/11/2004 | US20040048072 N-substituted arylamino-phenol-formaldehyde condensates |
| 03/11/2004 | US20040048047 Carrier-attached copper foil and printed board using the copper foil |
| 03/11/2004 | US20040047637 Transponder assembly for use with parallel optics modules in fiber optic communications systems |
| 03/11/2004 | US20040047570 Circuit board construction for use in small form factor fiber optic communication system transponders |
| 03/11/2004 | US20040047273 Optical pickup device and optical disk device |
| 03/11/2004 | US20040047170 Memory module and memory system |
| 03/11/2004 | US20040047138 Electronic component mounting circuit board and electronic component replacing method |
| 03/11/2004 | US20040047136 Wiring board having terminal |
| 03/11/2004 | US20040047125 Module support for electrical/electronic components |
| 03/11/2004 | US20040047118 Assembly comprised of a panel-like constructed module and of a connection unit, production method and device |
| 03/11/2004 | US20040047112 Capacitor, laminated capacitor, and capacitor built-in-board |
| 03/11/2004 | US20040046835 A dielectric film for use as a substrate for a flexible circuit comprises a polymer selected from the group consisting of liquid crystal polymers and polyimide copolymers including carboxylic ester structural units in the polymeric backbone. |
| 03/11/2004 | US20040046822 Terminals for circuit board |
| 03/11/2004 | US20040046582 Contacting component, method of producing the same, and test tool having the contacting component |
| 03/11/2004 | US20040046507 Lamp base comprising an eletronic component and a method for producing a lamp base |
| 03/11/2004 | US20040046263 Integrated circuit package employing flip-chip technology and method of assembly |
| 03/11/2004 | US20040046244 Multilayered substrate for semiconductor device |
| 03/11/2004 | US20040046155 Organic compositions |
| 03/11/2004 | US20040046154 Composition that includes conductive particles and glass particles dispersed in a thermoplastic polymer system. The hot melt conductor paste composition according to the invention is a solid at room temperature, but melts at a temperature of |
| 03/11/2004 | US20040046006 Method and arrangement for providing vias in printed circuit boards |
| 03/11/2004 | US20040045738 Audio coding and decoding |
| 03/11/2004 | US20040045736 Mechatronic transmission control |
| 03/11/2004 | US20040045656 Method of fabricating a ceramic substrate with a thermal conductive plug of a multi-chip package |
| 03/11/2004 | US20040045655 Multilayer ceramic electronic component, electronic component aggregate, and method for producing multilayer ceramic electronic component |
| 03/11/2004 | US20040045161 Capacitor plate for substrate components |
| 03/11/2004 | US20040045160 Methods for trimming electrical parameters in an electrical circuit |
| 03/11/2004 | US20040045159 Electrical connection with inwardly deformable contacts |
| 03/11/2004 | DE20319185U1 Kleine Stapel-Speicherkarte Small stack memory card |
| 03/11/2004 | DE20319173U1 Kleine Speicherkarte Small memory card |
| 03/11/2004 | DE20317524U1 T5 fluorescent energy saving lamp is used in unit for larger tube and has adapter and fittings for assembly and transportation. |
| 03/11/2004 | DE10334116A1 Strahlungssystem, Strahlungsverfahren, Wärmepuffer, Halbleitermodul, Wärmeverteilungseinrichtung und Substrat Radiation system, radiation process, heat buffer, semiconductor module, heat distribution device and substrate |
| 03/11/2004 | DE10241891A1 Electronic switching part for high frequency applications, e.g. a distance radar in a vehicle, comprises an electrical/electronic component with contact elements arranged on a substrate |