Patents for H05K 1 - Printed circuits (98,583)
04/2004
04/01/2004US20040063340 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
04/01/2004US20040063332 COF semiconductor device and a manufacturing method for the same
04/01/2004US20040063294 Techniques for fabricating a resistor on a flexible base material
04/01/2004US20040062858 Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method
04/01/2004US20040062019 Multilayered circuit board
04/01/2004US20040062009 Combined member of aluminum-ceramics
04/01/2004US20040061825 Display device
04/01/2004US20040061649 Low-loss printed circuit board antenna structure and method of manufacture thereof
04/01/2004US20040061570 Transmission line parasitic element discontinuity cancellation
04/01/2004US20040061566 EMI suppression method for powertrain control modules
04/01/2004US20040061423 Lamps
04/01/2004US20040061242 Semiconductor device power interconnect striping
04/01/2004US20040061241 Semiconductor device power interconnect striping
04/01/2004US20040061234 High reliability multlayer circuit substrates and methods for their formation
04/01/2004US20040061232 Multilayer substrate
04/01/2004US20040061223 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
04/01/2004US20040061198 Integrated circuit module having on-chip surge capacitors
04/01/2004US20040061105 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
04/01/2004US20040060969 Structure and method for connecting flexible printed circuit board to inkjet print head
04/01/2004US20040060732 Multichip module having chips on two sides
04/01/2004US20040060730 Dielectric composite materials and method for preparing
04/01/2004US20040060724 Current-carrying electronic component and method of manufacturing same
04/01/2004US20040060666 Electronic component component mounting equipment and component mounting method
04/01/2004US20040060646 Method for manufacturing a ceramic multilayer circuit board
04/01/2004US20040060169 Bettery pack and method of manufacturing the same
04/01/2004DE4138818B4 Gehäuse zur Aufnahme elektronischer Komponenten und Verfahren zu seiner Herstellung Housing for accommodating electronic components and process for its preparation
04/01/2004DE20319650U1 Flexible array of LEDs for creating illuminating surfaces by cutting circuit board into shape as needed
04/01/2004DE20023435U1 Multi-layer conductor arrangement e.g. for the manufacture of compact electrical circuits, has at least two electrical conductor layers arranged one above the other on the carrier in different planes
04/01/2004DE19714544B4 Verfahren zum Anbringen eines Trockenelektrolytkondensators auf einer Leiterplatine und Anordnung des Kondensators und der Platine A method for attaching a solid electrolytic capacitor on a printed circuit board and arrangement of the capacitor and the circuit board
04/01/2004DE10341586A1 Electrical connector box for cable looms/networks, has insulating board with first conducting track arranged in vertical direction on upper side of second conducting track so both tracks are adjacent
04/01/2004DE10333296A1 Vehicle-mounted electronic device e.g. heating-resistance type flow rate measuring device, has mounting portion provided at conductor wirings, whose shape is circular, elliptical or quadrangle
04/01/2004DE10244365A1 Distributed semiconductor circuit for electrical control device in automobile, uses circuit modules with folded flexible circuit board for logic unit and input and/or output device
04/01/2004DE10243814A1 Verfahren zur Herstellung einer leitenden Beschichtung auf einem isolierenden Substrat A process for producing a conductive coating on an insulating substrate
04/01/2004DE10243637A1 Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von sterr-flexiblen Leiterplatten Circuit board with at least one rigid and at least one flexible region as well as methods for producing sterr-flexible PCB
04/01/2004DE10242366A1 Lichthärtgerät A light curing
04/01/2004DE10223203B4 Elektronisches Bauelement-Modul und Verfahren zu dessen Herstellung The electronic component module and method for its production
04/01/2004CA2499506A1 Modular server processing card system and method
03/2004
03/31/2004EP1404166A1 Multilayer flexible wiring circuit board and its manufacturing method
03/31/2004EP1403922A2 Combined member of aluminum-ceramics
03/31/2004EP1403886A2 Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same
03/31/2004EP1403754A2 Computer in a vehicle
03/31/2004EP1403686A2 Liquid crystal display device
03/31/2004EP1403685A2 Liquid crystal display device
03/31/2004EP1403228A1 Ceramic component and production method therefor
03/31/2004EP1402989A1 Leach-resistant solder alloys for silver-based thick-film conductors
03/31/2004EP1402629A2 Apparatus and method for tuning an inter-stage matching network of an integrated multistage amplifier
03/31/2004EP1402615A1 Housing part for an electric adjusting drive
03/31/2004EP1401659A1 Corrosion prevention for cac component
03/31/2004EP1169775B1 Predistortion generator coupled with an rf amplifier
03/31/2004EP1133812B1 High density electrical connector
03/31/2004CN2609227Y Modular connector
03/31/2004CN2609189Y Surface mounted thick-film circuit
03/31/2004CN1486561A Electromagnetically-coupled bus system
03/31/2004CN1486540A Electromagnetic coupler flexible circuit
03/31/2004CN1486341A Polyaryl ketone resin film and laminates therof with metal
03/31/2004CN1486249A Electrodes for a drop-on-demand printer
03/31/2004CN1486245A Lightweight circuit board with conductive constraining cores
03/31/2004CN1486128A Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel
03/31/2004CN1485865A Condenser and circuit board, method for producing the same
03/31/2004CN1144335C Bus device
03/31/2004CN1144320C Connector with two rows of terminals having tail portions with similar impedance
03/31/2004CN1144287C Integrated circuit assembly band and its producing method
03/31/2004CN1144242C Sheet shape inducer
03/31/2004CN1144168C Multifunction circuit board
03/31/2004CN1144093C Camera having flexible printed circuit board
03/31/2004CN1144087C Liquid crystal display device
03/31/2004CN1143766C Retainer for punching ceramic green sheet and punching device
03/30/2004US6715018 Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer
03/30/2004US6714558 System for implementing network protocols between devices on a printed circuit board
03/30/2004US6714433 Memory module with equal driver loading
03/30/2004US6714431 Semiconductor package with a controlled impedance bus and method of forming same
03/30/2004US6714422 High frequency module device and method for its preparation
03/30/2004US6714421 Flip chip package substrate
03/30/2004US6714420 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment
03/30/2004US6714385 Apparatus and method for controlling common mode impedance in disk drive head suspensions
03/30/2004US6714384 Reduced stiffness printed circuit head interconnect
03/30/2004US6714383 Magnetic disk apparatus
03/30/2004US6714360 Lens device and method of assembly of lens device
03/30/2004US6714308 Rapid in-situ mastering of an aspheric fizeau
03/30/2004US6714275 Liquid crystal display apparatus method for checking the joining accuracy thereof
03/30/2004US6714104 Inverted microtrip transmission line integrated in a multilayer structure
03/30/2004US6714092 Supply noise filter for clock generator
03/30/2004US6713963 Ultra-high pressure discharge lamp
03/30/2004US6713871 A simple current loop is created that improves the power delivery for the system
03/30/2004US6713860 Electronic assembly and system with vertically connected capacitors
03/30/2004US6713854 Electronic circuit module with a carrier having a mounting pad array
03/30/2004US6713853 Electronic package with offset reference plane cutout
03/30/2004US6713848 Output stage layout for minimum cross coupling between channels
03/30/2004US6713792 Integrated circuit heat sink device including through hole to facilitate communication
03/30/2004US6713788 Opto-electric mounting apparatus
03/30/2004US6713687 Printed wiring board and method for manufacturing printed wiring board
03/30/2004US6713686 Apparatus and method for repairing electronic packages
03/30/2004US6713685 Non-circular micro-via
03/30/2004US6713683 Wiring board with terminals and method for manufacturing the same
03/30/2004US6713682 Through hole conduction structure of flexible multilayer circuit board and forming method thereof
03/30/2004US6713587 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication
03/30/2004US6713581 Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it
03/30/2004US6713417 Multilayer circuit board using a low-melting conductive metal; low temperature-fired mixture of mgal2o4 mg3b2o6 and/or mg2b2o5 and a glass powder of silicon oxide, boron oxide, aluminum oxide, and magnesium oxide
03/30/2004US6713399 Carbon-conductive ink resistor printed circuit board and its fabrication method
03/30/2004US6713210 Secondary cell protection circuit device and secondary cell assembly