Patents for H05K 1 - Printed circuits (98,583) |
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04/01/2004 | US20040063340 Multilayer wiring board, manufacturing method therefor and test apparatus thereof |
04/01/2004 | US20040063332 COF semiconductor device and a manufacturing method for the same |
04/01/2004 | US20040063294 Techniques for fabricating a resistor on a flexible base material |
04/01/2004 | US20040062858 Prepreg production method and prepeg production device and prepreg obtained by the production method and production method for insulating layer attached copper foil and insulating layer attached copper foil obtained by the production method |
04/01/2004 | US20040062019 Multilayered circuit board |
04/01/2004 | US20040062009 Combined member of aluminum-ceramics |
04/01/2004 | US20040061825 Display device |
04/01/2004 | US20040061649 Low-loss printed circuit board antenna structure and method of manufacture thereof |
04/01/2004 | US20040061570 Transmission line parasitic element discontinuity cancellation |
04/01/2004 | US20040061566 EMI suppression method for powertrain control modules |
04/01/2004 | US20040061423 Lamps |
04/01/2004 | US20040061242 Semiconductor device power interconnect striping |
04/01/2004 | US20040061241 Semiconductor device power interconnect striping |
04/01/2004 | US20040061234 High reliability multlayer circuit substrates and methods for their formation |
04/01/2004 | US20040061232 Multilayer substrate |
04/01/2004 | US20040061223 Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer |
04/01/2004 | US20040061198 Integrated circuit module having on-chip surge capacitors |
04/01/2004 | US20040061105 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof |
04/01/2004 | US20040060969 Structure and method for connecting flexible printed circuit board to inkjet print head |
04/01/2004 | US20040060732 Multichip module having chips on two sides |
04/01/2004 | US20040060730 Dielectric composite materials and method for preparing |
04/01/2004 | US20040060724 Current-carrying electronic component and method of manufacturing same |
04/01/2004 | US20040060666 Electronic component component mounting equipment and component mounting method |
04/01/2004 | US20040060646 Method for manufacturing a ceramic multilayer circuit board |
04/01/2004 | US20040060169 Bettery pack and method of manufacturing the same |
04/01/2004 | DE4138818B4 Gehäuse zur Aufnahme elektronischer Komponenten und Verfahren zu seiner Herstellung Housing for accommodating electronic components and process for its preparation |
04/01/2004 | DE20319650U1 Flexible array of LEDs for creating illuminating surfaces by cutting circuit board into shape as needed |
04/01/2004 | DE20023435U1 Multi-layer conductor arrangement e.g. for the manufacture of compact electrical circuits, has at least two electrical conductor layers arranged one above the other on the carrier in different planes |
04/01/2004 | DE19714544B4 Verfahren zum Anbringen eines Trockenelektrolytkondensators auf einer Leiterplatine und Anordnung des Kondensators und der Platine A method for attaching a solid electrolytic capacitor on a printed circuit board and arrangement of the capacitor and the circuit board |
04/01/2004 | DE10341586A1 Electrical connector box for cable looms/networks, has insulating board with first conducting track arranged in vertical direction on upper side of second conducting track so both tracks are adjacent |
04/01/2004 | DE10333296A1 Vehicle-mounted electronic device e.g. heating-resistance type flow rate measuring device, has mounting portion provided at conductor wirings, whose shape is circular, elliptical or quadrangle |
04/01/2004 | DE10244365A1 Distributed semiconductor circuit for electrical control device in automobile, uses circuit modules with folded flexible circuit board for logic unit and input and/or output device |
04/01/2004 | DE10243814A1 Verfahren zur Herstellung einer leitenden Beschichtung auf einem isolierenden Substrat A process for producing a conductive coating on an insulating substrate |
04/01/2004 | DE10243637A1 Leiterplatte mit mindestens einem starren und mindestens einem flexiblen Bereich sowie Verfahren zur Herstellung von sterr-flexiblen Leiterplatten Circuit board with at least one rigid and at least one flexible region as well as methods for producing sterr-flexible PCB |
04/01/2004 | DE10242366A1 Lichthärtgerät A light curing |
04/01/2004 | DE10223203B4 Elektronisches Bauelement-Modul und Verfahren zu dessen Herstellung The electronic component module and method for its production |
04/01/2004 | CA2499506A1 Modular server processing card system and method |
03/31/2004 | EP1404166A1 Multilayer flexible wiring circuit board and its manufacturing method |
03/31/2004 | EP1403922A2 Combined member of aluminum-ceramics |
03/31/2004 | EP1403886A2 Ferrite thin film, method of manufacturing the same and electromagnetic noise suppressor using the same |
03/31/2004 | EP1403754A2 Computer in a vehicle |
03/31/2004 | EP1403686A2 Liquid crystal display device |
03/31/2004 | EP1403685A2 Liquid crystal display device |
03/31/2004 | EP1403228A1 Ceramic component and production method therefor |
03/31/2004 | EP1402989A1 Leach-resistant solder alloys for silver-based thick-film conductors |
03/31/2004 | EP1402629A2 Apparatus and method for tuning an inter-stage matching network of an integrated multistage amplifier |
03/31/2004 | EP1402615A1 Housing part for an electric adjusting drive |
03/31/2004 | EP1401659A1 Corrosion prevention for cac component |
03/31/2004 | EP1169775B1 Predistortion generator coupled with an rf amplifier |
03/31/2004 | EP1133812B1 High density electrical connector |
03/31/2004 | CN2609227Y Modular connector |
03/31/2004 | CN2609189Y Surface mounted thick-film circuit |
03/31/2004 | CN1486561A Electromagnetically-coupled bus system |
03/31/2004 | CN1486540A Electromagnetic coupler flexible circuit |
03/31/2004 | CN1486341A Polyaryl ketone resin film and laminates therof with metal |
03/31/2004 | CN1486249A Electrodes for a drop-on-demand printer |
03/31/2004 | CN1486245A Lightweight circuit board with conductive constraining cores |
03/31/2004 | CN1486128A Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
03/31/2004 | CN1485865A Condenser and circuit board, method for producing the same |
03/31/2004 | CN1144335C Bus device |
03/31/2004 | CN1144320C Connector with two rows of terminals having tail portions with similar impedance |
03/31/2004 | CN1144287C Integrated circuit assembly band and its producing method |
03/31/2004 | CN1144242C Sheet shape inducer |
03/31/2004 | CN1144168C Multifunction circuit board |
03/31/2004 | CN1144093C Camera having flexible printed circuit board |
03/31/2004 | CN1144087C Liquid crystal display device |
03/31/2004 | CN1143766C Retainer for punching ceramic green sheet and punching device |
03/30/2004 | US6715018 Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computer |
03/30/2004 | US6714558 System for implementing network protocols between devices on a printed circuit board |
03/30/2004 | US6714433 Memory module with equal driver loading |
03/30/2004 | US6714431 Semiconductor package with a controlled impedance bus and method of forming same |
03/30/2004 | US6714422 High frequency module device and method for its preparation |
03/30/2004 | US6714421 Flip chip package substrate |
03/30/2004 | US6714420 Electronic circuit unit that is suitable for miniaturization and suitable for simple output adjustment |
03/30/2004 | US6714385 Apparatus and method for controlling common mode impedance in disk drive head suspensions |
03/30/2004 | US6714384 Reduced stiffness printed circuit head interconnect |
03/30/2004 | US6714383 Magnetic disk apparatus |
03/30/2004 | US6714360 Lens device and method of assembly of lens device |
03/30/2004 | US6714308 Rapid in-situ mastering of an aspheric fizeau |
03/30/2004 | US6714275 Liquid crystal display apparatus method for checking the joining accuracy thereof |
03/30/2004 | US6714104 Inverted microtrip transmission line integrated in a multilayer structure |
03/30/2004 | US6714092 Supply noise filter for clock generator |
03/30/2004 | US6713963 Ultra-high pressure discharge lamp |
03/30/2004 | US6713871 A simple current loop is created that improves the power delivery for the system |
03/30/2004 | US6713860 Electronic assembly and system with vertically connected capacitors |
03/30/2004 | US6713854 Electronic circuit module with a carrier having a mounting pad array |
03/30/2004 | US6713853 Electronic package with offset reference plane cutout |
03/30/2004 | US6713848 Output stage layout for minimum cross coupling between channels |
03/30/2004 | US6713792 Integrated circuit heat sink device including through hole to facilitate communication |
03/30/2004 | US6713788 Opto-electric mounting apparatus |
03/30/2004 | US6713687 Printed wiring board and method for manufacturing printed wiring board |
03/30/2004 | US6713686 Apparatus and method for repairing electronic packages |
03/30/2004 | US6713685 Non-circular micro-via |
03/30/2004 | US6713683 Wiring board with terminals and method for manufacturing the same |
03/30/2004 | US6713682 Through hole conduction structure of flexible multilayer circuit board and forming method thereof |
03/30/2004 | US6713587 Such as cationic tetrabromobisphenol a-diethylene glycol-diethanolamine resin and curing agent; flame resistance protective layer; circuit board fabrication |
03/30/2004 | US6713581 Crosslinkable polymer material of low relative permittivity, and films, substrates and electronic units formed of it |
03/30/2004 | US6713417 Multilayer circuit board using a low-melting conductive metal; low temperature-fired mixture of mgal2o4 mg3b2o6 and/or mg2b2o5 and a glass powder of silicon oxide, boron oxide, aluminum oxide, and magnesium oxide |
03/30/2004 | US6713399 Carbon-conductive ink resistor printed circuit board and its fabrication method |
03/30/2004 | US6713210 Secondary cell protection circuit device and secondary cell assembly |