| Patents for H05K 1 - Printed circuits (98,583) |
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| 01/29/2004 | US20040016570 Substrate and method of manufacturing the same |
| 01/29/2004 | US20040016569 Add-in card edge-finger design/stackup to optimize connector performance |
| 01/29/2004 | US20040016568 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
| 01/29/2004 | US20040016567 Surface mounting type electronic component |
| 01/29/2004 | US20040016565 Securing electrical conductors |
| 01/29/2004 | US20040016370 Coatings, films, circuit board |
| 01/29/2004 | US20040016118 For manufacturing printed built-up wiring boards |
| 01/29/2004 | US20040016117 Technique for reducing the number of layers in a signal routing device |
| 01/29/2004 | US20040016116 Methods for modifying inner-layer circuit features of printed circuit boards |
| 01/29/2004 | US20040016114 Land grid array structures and methods for engineering change |
| 01/29/2004 | DE10320622A1 Verfahren und Vorrichtung zum Bestimmen korrekter Spurbreiten für eine gedruckte Schaltungsplatine einer drahtlosen Testhalterung Method and apparatus for determining the correct lane widths for a printed circuit board of a wireless test fixture |
| 01/29/2004 | DE10230711A1 Elektrisch leitende Verbindung Electrically conductive connection |
| 01/29/2004 | DE10229337A1 Elektronische Baugruppe Electronic assembly |
| 01/29/2004 | DE10228756A1 Leiterplatte, Leiterplattenanordnung und Verwendung der Leiterplatte PCB, PCB assembly and use of the printed circuit board |
| 01/28/2004 | EP1385204A2 Copper paste and wiring board using the same |
| 01/28/2004 | EP1384701A1 Manufacturing method for tempered glass circuit board |
| 01/28/2004 | EP1384396A1 Integrated cooling of a printed circuit board structure |
| 01/28/2004 | EP1384320A1 Method and apparatus for reducing electromagnetic radiation |
| 01/28/2004 | EP1384302A1 Offset pathway arrangements for energy conditioning |
| 01/28/2004 | EP1384282A1 Multi-layer flat plate antenna with low-cost material and high-conductivity additive processing |
| 01/28/2004 | EP1384237A2 Multiple tier array capacitor and methods of fabrication therefor |
| 01/28/2004 | EP1383708A1 Printed circuit board integrated switch |
| 01/28/2004 | EP1383458A1 Receiving device for drug blisters |
| 01/28/2004 | EP1383420A2 Flex circuit shielded optical sensor |
| 01/28/2004 | EP0982385B1 Adhesive, method for bonding, and assemblies of mounted boards |
| 01/28/2004 | EP0854759B1 Flip chip underfill system and method |
| 01/28/2004 | EP0847596B1 Imaging system and method |
| 01/28/2004 | CN2601462Y Circuit board mounted spherical contact array encapsulated chip |
| 01/28/2004 | CN1471804A Integrated circuit carrier with recesses |
| 01/28/2004 | CN1471803A A multi-chip integrated circuit carrier |
| 01/28/2004 | CN1471802A Method of manufacturing an integrated circuit carrier |
| 01/28/2004 | CN1471801A An integrated circuit carrier |
| 01/28/2004 | CN1471730A Electronic circuit device and method for manufacturing the same |
| 01/28/2004 | CN1471595A Multi-component fibers having reversible thermal properties |
| 01/28/2004 | CN1471552A Varnish for laminate or preprey, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg |
| 01/28/2004 | CN1471353A Printed circuit board its manufacturing method and semiconductor device |
| 01/28/2004 | CN1471352A Distributing base board device |
| 01/28/2004 | CN1470379A Two-layer copper polyimide substrate material |
| 01/27/2004 | US6684007 Optical coupling structures and the fabrication processes |
| 01/27/2004 | US6683790 Electronic part, dielectric filter, dielectric duplexer, and manufacturing method of the electronic part |
| 01/27/2004 | US6683684 Device for measuring relative position error |
| 01/27/2004 | US6683669 Apparatus and method for fabricating substrate of a liquid crystal display device and interconnects therein |
| 01/27/2004 | US6683594 Display apparatus and assembly of its driving circuit |
| 01/27/2004 | US6683576 Circuit board and SMD antenna |
| 01/27/2004 | US6683525 Electrical strain sensitive resistor |
| 01/27/2004 | US6683517 Voltage tunable laminated dielectric materials for microwave applications such as a coaxial cable |
| 01/27/2004 | US6683516 Voltage tunable laminated dielectric materials for microwave applications such as a tunable cavity |
| 01/27/2004 | US6683512 High frequency module having a laminate board with a plurality of dielectric layers |
| 01/27/2004 | US6683468 Method and apparatus for coupling to a device packaged using a ball grid array |
| 01/27/2004 | US6683387 Flip chip carrier package with adapted landing pads |
| 01/27/2004 | US6683384 Air isolated crossovers |
| 01/27/2004 | US6683372 Memory expansion module with stacked memory packages and a serial storage unit |
| 01/27/2004 | US6683260 Multilayer wiring board embedded with transmission line conductor |
| 01/27/2004 | US6683047 Method of inhibiting transcription utilizing nuclear receptors |
| 01/27/2004 | US6682953 Method for making a mounting structure for an electronic component having an external terminal electrode |
| 01/27/2004 | US6682875 Forming nesting contour on a fiber optic array; nesting a surface of non-planar article against contour; exposing photoresist optically connected to proximal optical fiber surface within contours; developing; etching |
| 01/27/2004 | US6682802 Selective PCB stiffening with preferentially oriented fibers |
| 01/27/2004 | US6682230 Optical connector and printed circuit board assembly with movable connection |
| 01/27/2004 | US6681829 Automatic separator and method to obtain circuits for microelectronics |
| 01/27/2004 | US6681695 Continuous printing and mounting apparatus for film-like printing body |
| 01/27/2004 | US6681628 Ceramic resistor card assembly for fuel sensor |
| 01/27/2004 | US6681483 Multi-layer RF printed circuit architecture with low-inductance interconnection and low thermal resistance for wide-lead power devices |
| 01/24/2004 | CA2394932A1 Manufacturing method for tempered glass circuit board |
| 01/22/2004 | WO2004008818A1 Method of forming pattern on ceramic green sheet and conductive paste for use in the method |
| 01/22/2004 | WO2004008817A2 A multi-configuration processor-memory device |
| 01/22/2004 | WO2004008802A1 Hearing aid or similar audio device and method for producing a hearing aid |
| 01/22/2004 | WO2004008410A1 Telemetry signal collection, process and provision equipment |
| 01/22/2004 | WO2004008327A2 A multi-configuration gpu interface device |
| 01/22/2004 | WO2003052822A3 Method for making a non-detachable microcircuit card |
| 01/22/2004 | WO2003049183A3 Optimum power and ground bump pad and bump patterns for flip chip packaging |
| 01/22/2004 | WO2003030252A3 Process for producing interconnects |
| 01/22/2004 | WO2003025974A3 Intermediate support for electronic components and method for solder contacting such an intermediate support |
| 01/22/2004 | US20040015804 Computer aided design apparatus for aiding design of a printed wiring board to effectively reduce noise |
| 01/22/2004 | US20040014584 Glass ceramic mass and use thereof |
| 01/22/2004 | US20040014344 Card edge connector connection jig and card edge connector connection mechanism |
| 01/22/2004 | US20040014338 Connector and mounting structure of connector to substrate |
| 01/22/2004 | US20040014336 Electronic device with integral connectors |
| 01/22/2004 | US20040014317 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 01/22/2004 | US20040014270 microelectromechanical systems (MEMS); microsensors; die protects from damage; protected from galvanic attack |
| 01/22/2004 | US20040013861 Porous silicon nitride ceramics and method for producing the same |
| 01/22/2004 | US20040013860 Good mechanical properties together with high opacity properties, white inorganic pigment |
| 01/22/2004 | US20040013545 Multilayer printed circuit board |
| 01/22/2004 | US20040012992 Multi-level package for a memory module |
| 01/22/2004 | US20040012964 Light emitting module |
| 01/22/2004 | US20040012938 Interconnect module with reduced power distribution impedance |
| 01/22/2004 | US20040012937 Method for manufacturing a printed circuit board substrate with passive electrical components |
| 01/22/2004 | US20040012935 Printed wiring board |
| 01/22/2004 | US20040012934 Multi-configuration processor-memory substrate device |
| 01/22/2004 | US20040012933 Magnetically coupled RJ-45 modular jack assembly for ethernet applications |
| 01/22/2004 | US20040012931 Flanged terminal pins for dc/dc converters |
| 01/22/2004 | US20040012926 Component substrate for a printed circuit board and method of assemblying the substrate and the circuit board |
| 01/22/2004 | US20040012746 Flat panel display device including slitted tape carrier packages and manufacturing method thereof |
| 01/22/2004 | US20040012745 Liquid crystal display device with flexible printed circuit board |
| 01/22/2004 | US20040012492 Apparatus and method for reducing electromigration |
| 01/22/2004 | US20040012085 Semiconductor device |
| 01/22/2004 | US20040012082 Multi-configuration GPU interface device |
| 01/22/2004 | US20040012076 For use in fabrication of integrated circuit devices and integrated circuit packaging devices |
| 01/22/2004 | US20040012042 Isolating material element for the assembly of inductive electronic components |
| 01/22/2004 | US20040011556 Printed circuit board and soldering structure for electronic parts thereto |
| 01/22/2004 | US20040010911 Method for attaching an integrated circuit package to a circuit board |