| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 03/03/2004 | EP1392495A1 Three-dimensional nonwoven substrate for circuit board |
| 03/03/2004 | EP1392449A1 Over-clocking in a microdeposition control system to improve resolution |
| 03/03/2004 | EP1099247B1 Method for transferring solder to a device and/or testing the device |
| 03/03/2004 | EP1019654A4 Flexible lighting element circuit and method of manufacturing the same |
| 03/03/2004 | EP0929999B1 A protective device for shielding an electrical apparatus against environmental conditions |
| 03/03/2004 | CN1479926A Mountable electrical conductors |
| 03/03/2004 | CN1479802A Alluminium alloy thin film, wiring circuit having the thin film and target material depositing the thin film |
| 03/03/2004 | CN1479768A Material for insulating substrate, printed circuit board, laminate, copper foil with resin, copper-clad laminate, polymide film, film for TAB and prepreg |
| 03/03/2004 | CN1479567A Wiring base plate, semconductor device and its manufacturing mtehod, circuit board and electronic instrument |
| 03/03/2004 | CN1479566A Laminated ceramic electronic component and manufacturing method thereof |
| 03/03/2004 | CN1479565A 布线基板及其制造方法 Wiring board and manufacturing method thereof |
| 03/03/2004 | CN1479506A Camera module and mobile communication terminal using the camera module |
| 03/03/2004 | CN1479407A Semiconductor assembly structure combined with antenna |
| 03/03/2004 | CN1479406A Plane medium transmission line and integrated circuit using the transmission line |
| 03/03/2004 | CN1479405A Structure of nonreciprocal circuit element |
| 03/03/2004 | CN1479372A Line baseplate |
| 03/03/2004 | CN1478831A Low dielectric loss tangent film and distributing film |
| 03/03/2004 | CN1478824A Electronic element for high frequency using low-dielectric loss angle tangent insulating material |
| 03/03/2004 | CN1140895C Storage apparatus |
| 03/03/2004 | CN1140877C Electrical connector for simultaneous connection of two electronic-memory cards |
| 03/03/2004 | CN1140560C Cyanate ester composition and cured product thereof |
| 03/02/2004 | US6701197 System and method for side to side registration in a printed circuit imager |
| 03/02/2004 | US6700797 Nested plug-in modules |
| 03/02/2004 | US6700795 Scalable, modular architecture for automotive power distribution and body control functions |
| 03/02/2004 | US6700792 High-frequency composite component and portable wireless device incorporating the component |
| 03/02/2004 | US6700790 Circuit board with integrated circuit |
| 03/02/2004 | US6700789 High-frequency wiring board |
| 03/02/2004 | US6700768 Fuse housing |
| 03/02/2004 | US6700643 Device for exposure of a peripheral area of a film circuit board |
| 03/02/2004 | US6700463 Transmission line structure for reduced coupling of signals between circuit elements on a circuit board |
| 03/02/2004 | US6700457 Impedance compensation for circuit board breakout region |
| 03/02/2004 | US6700455 Electromagnetic emission reduction technique for shielded connectors |
| 03/02/2004 | US6700448 High performance dual range oscillator module |
| 03/02/2004 | US6700207 Flip-chip ball grid array package for electromigration testing |
| 03/02/2004 | US6700204 Substrate for accommodating passive component |
| 03/02/2004 | US6700196 Programmable multi-chip module |
| 03/02/2004 | US6700182 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module |
| 03/02/2004 | US6700177 Compact, surface-mounting-type, electronic-circuit unit |
| 03/02/2004 | US6700079 Discrete solder ball contact and circuit board assembly utilizing same |
| 03/02/2004 | US6700077 Packaging substrate with electrostatic discharge protection |
| 03/02/2004 | US6700076 Multi-layer interconnect module and method of interconnection |
| 03/02/2004 | US6700075 Reduced crosstalk ultrasonic piezo film array on a printed circuit board |
| 03/02/2004 | US6700074 Electrical component housing structures and their method of manufacture |
| 03/02/2004 | US6700072 Electrical connection with inwardly deformable contacts |
| 03/02/2004 | US6700071 Multi-layer circuit board having at least two or more circuit patterns connected |
| 03/02/2004 | US6700070 Alignment mark for placement of guide hole |
| 03/02/2004 | US6699748 Method of fabricating capacitor having a photosensitive resin layer as a dielectric |
| 03/02/2004 | US6699732 Pitch compensation in flip-chip packaging |
| 03/02/2004 | US6699730 Stacked microelectronic assembly and method therefor |
| 03/02/2004 | US6699605 Glass ceramic laminate becoming relatively high in bending strength after fired |
| 03/02/2004 | US6699572 Metal film/aromatic polyimide film laminate |
| 03/02/2004 | US6699395 Method of forming alignment features for conductive devices |
| 03/02/2004 | US6699069 On-board type connector |
| 03/02/2004 | US6699046 Pin grid array integrated circuit connecting device |
| 03/02/2004 | US6698093 Creating unified portion with separation films via laser beam throughhole formation |
| 03/02/2004 | US6698091 Method and apparatus for coupling circuit boards |
| 03/02/2004 | US6698084 Method for manufacturing radio frequency module components with surface acoustic wave element |
| 02/26/2004 | WO2004017703A2 Method for forming printing inspection data |
| 02/26/2004 | WO2004017691A1 I-channel surface-mount connector with extended flanges |
| 02/26/2004 | WO2004017688A1 Depositing solid materials |
| 02/26/2004 | WO2004017687A1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/26/2004 | WO2004017471A1 Suppressor device |
| 02/26/2004 | WO2004017372A2 Method and apparatus for reducing electromagnetic emissions from electronic circuits |
| 02/26/2004 | WO2004017342A1 Capacitor circuit and method for mounting capacitor circuit |
| 02/26/2004 | WO2004016702A1 Aqueous formaldehyde-free composition and fiberglass insulation including the same |
| 02/26/2004 | WO2004016559A1 Glass/ceramic composite material, ceramic film, layer composite, or microhybrid comprising said composite material and method for production thereof |
| 02/26/2004 | WO2004016558A1 The use of zeolites in preparing low temperature ceramics |
| 02/26/2004 | WO2003065412A3 Dielectric loss compensation methods and apparatus |
| 02/26/2004 | WO2003001254A3 Apparatus for holding an optical element |
| 02/26/2004 | WO2002039498A3 Methods and systems for positioning substrates |
| 02/26/2004 | US20040040008 Determining via placement in the printed circuit board of a wireless test fixture |
| 02/26/2004 | US20040039859 Via configuration for differential signaling through power or ground planes |
| 02/26/2004 | US20040039155 Heating polyethylene resin at a heating temperature higher than a melting point of the resin material in a reduced pressure atmosphere; excellent controllability |
| 02/26/2004 | US20040039127 Electronic device using low dielectric loss tangent insulators for high frequency signals |
| 02/26/2004 | US20040038808 Method of producing membrane electrode assemblies for use in proton exchange membrane and direct methanol fuel cells |
| 02/26/2004 | US20040038719 FPCB connection mechanism |
| 02/26/2004 | US20040038611 Low dielectric loss tangent films and wiring films |
| 02/26/2004 | US20040038583 Spring-loaded heat sink assembly for a circuit assembly |
| 02/26/2004 | US20040038565 Low height USB interface connecting device and a memory storage apparatus thereof |
| 02/26/2004 | US20040038562 Adapter assembly |
| 02/26/2004 | US20040038497 Method for fabricating large area flexible electronics |
| 02/26/2004 | US20040038449 Polymer compositions that can be used to make plastic reflector articles having light reflecting surfaces such as for use in automobile tail and head lights; compositions comprise base polycarbonate polymer matrix and thermally-conductive carbon material |
| 02/26/2004 | US20040038054 Laminate for substrate of printed wiring board |
| 02/26/2004 | US20040038017 Polyester-type formaldehyde free insulation binder |
| 02/26/2004 | US20040038011 Integral-type ceramic circuit board and method of producing same |
| 02/26/2004 | US20040037966 Protective film for base substrates of multi-layered board and method and apparatus for inspecting base substrates |
| 02/26/2004 | US20040037950 Improving dimensional stability, matching thermal expansion of glass layer to electronic connection components, preventing thermal expansion stress |
| 02/26/2004 | US20040037516 Optical transmission module |
| 02/26/2004 | US20040037512 Electro-optical circuit board having optical transmit/receive module and optical waveguide |
| 02/26/2004 | US20040037080 Flexible led lighting strip |
| 02/26/2004 | US20040037079 Flexible LED lighting strip |
| 02/26/2004 | US20040037062 Low cost highly isolated RF coupler |
| 02/26/2004 | US20040037061 Method and components for manufacturing multi-layer modular electrical circuits |
| 02/26/2004 | US20040037057 Radiating structure for electronic circuit units, capable of efficiently radiating heat of heater element |
| 02/26/2004 | US20040037050 Printed circuit board |
| 02/26/2004 | US20040037044 Heat sink for surface mounted power devices |
| 02/26/2004 | US20040037021 5-pin protector |
| 02/26/2004 | US20040037007 Disc drive apparatus having drive electronics top mounted on flexible printed circuit board |
| 02/26/2004 | US20040036833 Flexible substrate, LCD module using same, and manufacturing method of same |
| 02/26/2004 | US20040036830 An active matrix substrate includes: an insulative substrate; an insulating film provided on a layer of line terminals on the insulative substrate and including a contact hole extending in the terminal arrangement direction so that the |