| Patents for H05K 1 - Printed circuits (98,583) |
|---|
| 04/27/2004 | US6728106 Heat dissipation structure of integrated circuit (IC) |
| 04/27/2004 | US6728092 Formation of thin film capacitors |
| 04/27/2004 | US6728073 Flexible circuit designs with improved damping |
| 04/27/2004 | US6727881 Longterm image quality |
| 04/27/2004 | US6727785 High efficiency single port resonant line |
| 04/27/2004 | US6727782 Multilayered LC composite component and method for manufacturing the same |
| 04/27/2004 | US6727780 Adding electrical resistance in series with bypass capacitors using annular resistors |
| 04/27/2004 | US6727774 Bypass capacitor methods for achieving a desired value of electrical impedance between parallel planar conductors of an electrical power distribution structure, and associated electrical power distribution structures |
| 04/27/2004 | US6727766 Oscillator with dielectric resonator and electronic apparatus using the same |
| 04/27/2004 | US6727718 Electronic component package, printed circuit board, and method of inspecting the printed circuit board |
| 04/27/2004 | US6727652 Lamps |
| 04/27/2004 | US6727584 Semiconductor module |
| 04/27/2004 | US6727581 Semiconductor module |
| 04/27/2004 | US6727579 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 04/27/2004 | US6727577 Tape carrier package |
| 04/27/2004 | US6727564 Solid image pickup apparatus |
| 04/27/2004 | US6727437 Non-continuous conductive layer for laminated substrates |
| 04/27/2004 | US6727435 Backplane power distribution system |
| 04/27/2004 | US6727199 Sodium copper titanate compositions containing a rare earth, yttrium or bismuth |
| 04/27/2004 | US6727111 Process for making electronic chip device incorporating plural elements |
| 04/27/2004 | US6726984 Ceramic structure using a support sheet |
| 04/27/2004 | US6726493 Method and structure for connecting and aligning electrical connections disposed on devices by fitting one device into an opening on another device |
| 04/27/2004 | US6726488 High-frequency wiring board |
| 04/27/2004 | US6726087 Process and device for soldering electrical components on a plastic sheet |
| 04/27/2004 | CA2351568C Method for forming transparent conductive film by using chemically amplified resist |
| 04/22/2004 | WO2004034761A1 Electronic substrate of a three-dimensional electronic module |
| 04/22/2004 | WO2004034759A1 Wiring board incorporating components and process for producing the same |
| 04/22/2004 | WO2004034758A1 Process for producing ceramic multilayer board |
| 04/22/2004 | WO2004034756A2 Layered structure with electric leads for a body worn device |
| 04/22/2004 | WO2004034754A2 Circuit board stiffener |
| 04/22/2004 | WO2004034512A1 Electronic circuitry provided with an integrated antenna |
| 04/22/2004 | WO2004034434A2 Components, methods and assemblies for multi-chip packages |
| 04/22/2004 | WO2004034410A2 Via-less electronic structures and methods |
| 04/22/2004 | WO2004034318A1 Ic card and adapter |
| 04/22/2004 | WO2004033999A1 Dial module, manufacturing method thereof, led display element, display module, movement module, connector module, and meter using them |
| 04/22/2004 | WO2004033540A1 Base film for membrane switch and membrane switch |
| 04/22/2004 | WO2003100903A3 Non-uniform transmission line and method of fabricating the same |
| 04/22/2004 | WO2003092174A3 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 04/22/2004 | WO2003085703A3 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 04/22/2004 | US20040078698 Robotic Memory-Module Tester Using Adapter Cards for Vertically Mounting PC Motherboards |
| 04/22/2004 | US20040077825 Such as 9,10-dihydro-9-oxo-10-phosphorous-phenanthrenyl-10-oxide |
| 04/22/2004 | US20040077821 Comprises epoxy resins and phosphorus-containing hardener such as 9,10-dihydro-9-oxz-10-phosphorylphenanthrene-10-oxide; heat resistance |
| 04/22/2004 | US20040077798 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 04/22/2004 | US20040077222 High performance jack for telecommunication applications |
| 04/22/2004 | US20040077193 Board mounted electrical connector |
| 04/22/2004 | US20040077189 Adhesive interconnector |
| 04/22/2004 | US20040077188 Card connector assembly including contact lands having no damage |
| 04/22/2004 | US20040077124 High-frequency circuit block, its manufacturing method, high-frequency module device, and its manufacturing method |
| 04/22/2004 | US20040076877 Connection between a conductive substrate and laminate |
| 04/22/2004 | US20040076832 For three-layer flexible printed circuit board; requires no roughening; improved adhesion with epoxy resins; corrosion resistance |
| 04/22/2004 | US20040076806 Porous ceramics and method for preparation thereof, and microstrip substrate |
| 04/22/2004 | US20040076805 Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith |
| 04/22/2004 | US20040076765 To impart improved adhesion to metal, by surface treating the polyimide with a solution of potassium permanganate and/or sodium permanganate and potassium hydroxide and/or sodium hydroxide and then with an acid; peel strength |
| 04/22/2004 | US20040076743 Using a mask during activation step so as to selectively activate only selected portions of the surface, thus enabling smaller areas to be plated on the printed circuit board because no plating mask is used |
| 04/22/2004 | US20040076424 Camera and photographing lens barrel |
| 04/22/2004 | US20040076030 Apparatus and method for mounting microelectronic devices on a mirrored board assembly |
| 04/22/2004 | US20040075946 Head gimbal assembly and method for manufacturing the same |
| 04/22/2004 | US20040075821 Method of capturing and processing sensed images |
| 04/22/2004 | US20040075534 Method for field programming radio frequency identification devices that control remote control devices |
| 04/22/2004 | US20040075528 Printed circuit heaters with ultrathin low resistivity materials |
| 04/22/2004 | US20040075515 Semiconductor device, and method and apparatus for manufacturing semiconductor device |
| 04/22/2004 | US20040075177 Wiring board, method of manufacturing the same, semiconductor device, circuit board, and electronic equipment |
| 04/22/2004 | US20040075165 Dual power supply method and apparatus |
| 04/22/2004 | US20040075164 Module device of stacked semiconductor packages and method for fabricating the same |
| 04/22/2004 | US20040075085 Heating a mixture to react the polymer binder precursor and generate a polymer matrix with conductive material dispersed; protecting electronic circuits |
| 04/22/2004 | US20040074960 Method for field programmable radio frequency document identification devices |
| 04/22/2004 | US20040074676 Method and apparatus for field programming radio frequency identification devices |
| 04/22/2004 | US20040074671 Mutilayer wiring board, touch panel and manufacturing method of the same |
| 04/22/2004 | US20040074670 Connection structure between printed circuit board and flexible circuit board |
| 04/22/2004 | US20040074669 Circuit board and method of making circuit board |
| 04/22/2004 | US20040074660 Cross substrate, method of mounting semiconductor element, and semiconductor device |
| 04/22/2004 | US20040074651 Conformal coating enhanced to provide heat detection |
| 04/22/2004 | US20040074086 Method for forming conductor wire on a substrate board |
| 04/22/2004 | DE202004002921U1 Warning light for use on emergency services vehicle has a number of light emitting diodes |
| 04/22/2004 | DE202004002332U1 Leiterplatte Circuit board |
| 04/22/2004 | DE10327926A1 Schaltungsintegriertes Mikromodul Integrated circuit Micromodule |
| 04/22/2004 | DE10247567A1 Procedure to manufacture electrical component carrier having plastic housing with conductors stamped out of sheet metal with electronic components connected to them and all embedded in plastic of housing |
| 04/22/2004 | DE10247035A1 Memory module for mobile radio application, has dissipation frame arranged between memory device and board, where dissipation frame includes heat-conducting paste between board and memory device |
| 04/22/2004 | DE10246591A1 Punching die tool e.g. for punching holes into ceramic work pieces has die part fastened nondestructive via fastener system, to connection part for mounting on machine tool |
| 04/22/2004 | DE10196368T5 Kontaktstruktur und Verfahren zu dessen Herstellung und eine Prüfkontaktanordnung, die diese verwendet Contact structure and method for its preparation and a test contact, which uses this |
| 04/22/2004 | DE10084799T5 Universelle eigensichere Schaltstromversorgung Universal intrinsically safe switching power supply |
| 04/21/2004 | EP1411756A2 Radio frequency apparatus |
| 04/21/2004 | EP1411594A2 High density electrical connector |
| 04/21/2004 | EP1411569A2 Fuel cell and its connection structure to a processing unit |
| 04/21/2004 | EP1411553A1 Electronic circuit component |
| 04/21/2004 | EP1411464A1 Memory card |
| 04/21/2004 | EP1411290A1 Diode lighting system |
| 04/21/2004 | EP1411205A2 Power conversion unit and method of providing power to a window covering |
| 04/21/2004 | EP1410906A1 Laminate structures, methods for production thereof and uses thereof |
| 04/21/2004 | EP1410703A1 Sequentially processed circuitry |
| 04/21/2004 | EP1410701A1 Method of manufacturing an integrated circuit carrier |
| 04/21/2004 | EP1410700A1 Integrated circuit carrier with recesses |
| 04/21/2004 | EP1410489A2 Power converters |
| 04/21/2004 | EP1410440A2 Layered dielectric nanoporous material and methods of producing same |
| 04/21/2004 | EP1410403A1 Low temperature method and compositions for producing electrical conductors |
| 04/21/2004 | EP1409577A1 Flame resistant thermoplastic moulding materials |
| 04/21/2004 | EP1409574A1 Nanocomposite dielectrics |
| 04/21/2004 | EP1409194A2 Laser micromachining of electrical structures |
| 04/21/2004 | EP1153183B1 Key with integrated, electronic control circuit for a vehicle security system |
| 04/21/2004 | EP1123644B1 Method for producing multi-layer circuits |